3897 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (3904 款元器件 · 第 97/244)

显示 1537–1552 共 3904 款元器件

UDFN-6-EP(2x2) · 7P

MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) - 3D模型 (UDFN-6-EP(2x2))

MIC2033-08BYMT-T5

MICROCHIP·UDFN-6-EP(2x2)

READY

7P2.0×2.0×0.85mmP=0.65mm2.5V to 5.5V

标准电子与连接器元件

TSOP-28-10.1mm · 28P

AT28HC256-90TU-T (TSOP-28-10.1mm) - 3D模型 (TSOP-28-10.1mm)

AT28HC256-90TU-T

MICROCHIP·TSOP-28-10.1mm

READY

28P18.3×10.1×2.50mmP=1.27mm

标准电子与连接器元件

WFBGA-48(4x6) · 48P

SST39VF801C-70-4C-MAQE-T (WFBGA-48(4x6)) - 3D模型 (WFBGA-48(4x6))

SST39VF801C-70-4C-MAQE-T

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

标准电子与连接器元件

SMD3225-6P · 6P

DSC1121CE1-025.0012 (SMD3225-6P) - 3D模型 (SMD3225-6P)

DSC1121CE1-025.0012

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm

标准电子与连接器元件

SMD1612-4P · 4P

AMPMGEB-11.2896T (SMD1612-4P) - 3D模型 (SMD1612-4P)

AMPMGEB-11.2896T

ABRACON·SMD1612-4P

READY

4P1.6×1.2×0.84mmP=0.75mm

标准电子与连接器元件

SMD1612-4P · 4P

DSC6331HI2AA-031.9488 (SMD1612-4P) - 3D模型 (SMD1612-4P)

DSC6331HI2AA-031.9488

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V ~ 3.63V

标准电子与连接器元件

SMD · 29P

ATWINC1510-MR210UB (SMD) - 3D模型 (SMD)

ATWINC1510-MR210UB

READY

29P21.8×14.8×2.40mmP=1.02mm2.7V to 3.6V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD-36P · 37P

ATWINC3400-MR210CA142 (SMD-36P) - 3D模型 (SMD-36P)

ATWINC3400-MR210CA142

MICROCHIP·SMD-36P

READY

37P22.4×14.7×2.40mmP=1.2mm2.7V to 3.6V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

UFBGA-88(6x6) · 88P

ATMXT640U-CCU023 (UFBGA-88(6x6)) - 3D模型 (UFBGA-88(6x6))

ATMXT640U-CCU023

MICROCHIP·UFBGA-88(6x6)

READY

88P6.0×6.0×0.60mmP=0.5mm

标准电子与连接器元件

PBGA-324_L23.0-W23.0-P1.00-TL_MICROCHIP_ZL501XX · 324P

C20297164 (PBGA-324_L23.0-W23.0-P1.00-TL_MICROCHIP_ZL501XX) - 3D模型 (PBGA-324_L23.0-W23.0-P1.00-TL_MICROCHIP_ZL501XX)

C20297164

Generic·PBGA-324_L23.0-W23.0-P1.00-TL_MICROCHIP_ZL501XX

READY

324P23.0×23.0×1.35mmP=1mm

标准电子与连接器元件

TFBGA-144 · 144P

PIC32MZ2048EFM144T-E/JWX (TFBGA-144) - 3D模型 (TFBGA-144)

PIC32MZ2048EFM144T-E/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

标准电子与连接器元件

OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX · 6P

C5128593 (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX) - 3D模型 (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX)

C5128593

Generic·OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX

READY

6P3.2×2.5×1.00mmP=1.05mm

标准电子与连接器元件

PBGA-272(27x27) · 272P

70V5388S166BGI8 (PBGA-272(27x27)) - 3D模型 (PBGA-272(27x27))

70V5388S166BGI8

RENESAS·PBGA-272(27x27)

READY

272P27.0×27.0×1.35mmP=1.27mm

标准电子与连接器元件

TFBGA-59(8x8) · 59P

HV53011-E/KVX (TFBGA-59(8x8)) - 3D模型 (TFBGA-59(8x8))

HV53011-E/KVX

MICROCHIP·TFBGA-59(8x8)

READY

59P8.0×8.0×1.20mmP=0.65mm

标准电子与连接器元件

UDFN-6(2x2) · 7P

NCP380LMU05AATBG (UDFN-6(2x2)) - 3D模型 (UDFN-6(2x2))

NCP380LMU05AATBG

onsemi·UDFN-6(2x2)

READY

7P2.0×2.0×0.85mmP=0.65mm2.5 V – 5.5 V

标准电子与连接器元件

SMD-12P · 12P

MRF89XAM9AT-I/RM (SMD-12P) - 3D模型 (SMD-12P)

MRF89XAM9AT-I/RM

MICROCHIP·SMD-12P

READY

12P28.0×17.8×3.10mm2.1–3.6V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

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