3748 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3756 Bauteilen · Seite 68/235)

Zeige 1073–1088 von 3756 Bauteilen

FCBGA-1152(35x35) · 1152P

MPFS250T-1FCG1152E (FCBGA-1152(35x35)) - 3D-Modell (FCBGA-1152(35x35))

MPFS250T-1FCG1152E

MICROCHIP·FCBGA-1152(35x35)

READY

1152P35.0×35.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

FCBGA-784(29x29) · 784P

MPF200TL-FCG784E (FCBGA-784(29x29)) - 3D-Modell (FCBGA-784(29x29))

MPF200TL-FCG784E

MICROCHIP·FCBGA-784(29x29)

READY

784P29.0×29.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-484(23x23) · 484P

M2GL005-1FG484 (FPBGA-484(23x23)) - 3D-Modell (FPBGA-484(23x23))

M2GL005-1FG484

MICROCHIP·FPBGA-484(23x23)

READY

484P23.0×23.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

CSPBGA-536(16x16) · 536P

MPF300T-FCSG536E (CSPBGA-536(16x16)) - 3D-Modell (CSPBGA-536(16x16))

MPF300T-FCSG536E

MICROCHIP·CSPBGA-536(16x16)

READY

536P16.0×16.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

MSOP-10 · 10P

MIC5162BMM-TR (MSOP-10) - 3D-Modell (MSOP-10)

MIC5162BMM-TR

MICROCHIP·MSOP-10

READY

10P3.0×3.0×1.10mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

PIC16F18044-I/SS (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

PIC16F18044-I/SS

MICROCHIP·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOT-223-3 · 4P

MCP1825S-1202E/DB (SOT-223-3) - 3D-Modell (SOT-223-3)

MCP1825S-1202E/DB

MICROCHIP·SOT-223-3

READY

4P6.5×3.5×1.60mmP=2.3mm2.1V to 6.0V

Low-Dropout-Linearspannungsregler (LDO)

SOIC-8 · 8P

SST26VF016B-104V/SN (SOIC-8) - 3D-Modell (SOIC-8)

SST26VF016B-104V/SN

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.7V-3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOT-89-3 · 3P

MCP1702T-1502E/MB (SOT-89-3) - 3D-Modell (SOT-89-3)

MCP1702T-1502E/MB

MICROCHIP·SOT-89-3

READY

3P4.5×2.5×1.50mmP=3mm2.7V to 13.2V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-8 · 8P

25AA320AX-I/ST (TSSOP-8) - 3D-Modell (TSSOP-8)

25AA320AX-I/ST

MICROCHIP·TSSOP-8

READY

8P3.0×4.4×1.20mmP=0.65mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC32MM0016GPL028-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC32MM0016GPL028-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×1.00mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-36-EP(6x6) · 37P

PIC32MM0016GPL036-I/M2 (QFN-36-EP(6x6)) - 3D-Modell (QFN-36-EP(6x6))

PIC32MM0016GPL036-I/M2

MICROCHIP·QFN-36-EP(6x6)

READY

37P6.0×6.0×1.00mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

25AA320A-I/SN (SOIC-8) - 3D-Modell (SOIC-8)

25AA320A-I/SN

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-8 · 8P

25LC128-I/ST (TSSOP-8) - 3D-Modell (TSSOP-8)

25LC128-I/ST

MICROCHIP·TSSOP-8

READY

8P3.0×4.4×1.20mmP=0.65mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOP-8 · 8P

MIC4684YM (SOP-8) - 3D-Modell (SOP-8)

MIC4684YM

MICROCHIP·SOP-8

READY

8P4.9×3.9×1.75mmP=1.27mm4V to 30V

Standard-Elektronik- & Steckverbinderbauteil

TO-92-3 · 3P

TN0702N3-G (TO-92-3) - 3D-Modell (TO-92-3)

TN0702N3-G

MICROCHIP·TO-92-3

READY

3P4.9×3.7×4.60mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

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