0805 · 2PPreviewReal Photo3D CADPinoutFootprintDims0805W8F1004T5EUNI-ROYAL·0805READY2P2.0×1.2×0.50mmP=1.9mmStandard Electronic & Interconnect Component
LQFN-56(7x7) · 57PPreviewReal Photo3D CADPinoutFootprintDimsRP2040Raspberry Pi·LQFN-56(7x7)READY57P7.0×7.0×0.90mmP=0.4mmEmbedded Microcontroller Unit (MCU)
SMD-38P · 39PPreviewReal Photo3D CADPinoutFootprintDimsESP32-WROOM-32E(M113EH6400PH3Q0)ESPRESSIF·SMD-38PREADY39P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 VWireless Wi-Fi / Bluetooth LE SoC Module
DIP-8 · 8PPreviewReal Photo3D CADPinoutFootprintDimsNE555PTI·DIP-8READY8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 VInterface Bridge / Precision Clock & Timer IC
TQFP-32(7x7) · 32PPreviewReal Photo3D CADPinoutFootprintDimsATMEGA328P-AUMICROCHIP·TQFP-32(7x7)READY32P7.0×7.0×1.00mmP=0.8mmEmbedded Microcontroller Unit (MCU)
TQFP-64(10x10) · 8PPreviewReal Photo3D CADPinoutFootprintDimsPIC24EP512GP806-I/PTMICROCHIP(美国微芯)·TQFP-64(10x10)READY8PPIC24EP512GP806-I/PT
Through Hole,Right Angle,P=2mm · 8PPreviewReal Photo3D CADPinoutFootprintDimsHX PM2.0-1x3P WC H6.35hanxia·Through Hole,Right Angle,P=2mmREADY8PFemale Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃
- · 8PPreviewReal Photo3D CADPinoutFootprintDimsCH32V003F4P6-EVT+WCH-LinkEWCH(南京沁恒)·-READY8P评估板两件套,含CH32V003测试板一块,LINK-E一个 两件套