4114 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (12 款元器件 · 第 1/1)

显示 1–12 共 12 款元器件

LQFP-64M(10x10) · 64P

CH561Q (LQFP-64M(10x10)) - 3D模型 (LQFP-64M(10x10))

CH561Q

WCH(南京沁恒)·LQFP-64M(10x10)

READY

64P10.0×10.0×1.40mmP=0.5mm

标准电子与连接器元件

TSSOP-16 · 16P

CH440R (TSSOP-16) - 3D模型 (TSSOP-16)

CH440R

WCH(南京沁恒)·TSSOP-16

READY

16P5.0×4.4×1.00mmP=0.65mm

标准电子与连接器元件

SOP-20-300mil · 20P

CH450H (SOP-20-300mil) - 3D模型 (SOP-20-300mil)

CH450H

WCH(南京沁恒)·SOP-20-300mil

READY

20P12.8×7.5×2.50mmP=1.27mm

标准电子与连接器元件

FQFP-80(14x20) · 80P

CH365P (FQFP-80(14x20)) - 3D模型 (FQFP-80(14x20))

CH365P

WCH(南京沁恒)·FQFP-80(14x20)

READY

80P20.0×14.0×2.00mmP=0.8mm

标准电子与连接器元件

DIP-24 · 24P

CH451L (DIP-24) - 3D模型 (DIP-24)

CH451L

WCH(南京沁恒)·DIP-24

READY

24P31.0×5.3×3.85mmP=2.54mm

标准电子与连接器元件

SSOP-28-209mil · 28P

CH9101U (SSOP-28-209mil) - 3D模型 (SSOP-28-209mil)

CH9101U

WCH(南京沁恒)·SSOP-28-209mil

READY

28P10.2×5.3×2.00mmP=0.65mm

标准电子与连接器元件

ESSOP-10-150mil-1mm · 11P

CH9141K (ESSOP-10-150mil-1mm) - 3D模型 (ESSOP-10-150mil-1mm)

CH9141K

WCH(南京沁恒)·ESSOP-10-150mil-1mm

READY

11P4.9×3.9×1.10mmP=1mm

标准电子与连接器元件

SSOP-20-208mil · 20P

CH331A (SSOP-20-208mil) - 3D模型 (SSOP-20-208mil)

CH331A

WCH(南京沁恒)·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm

标准电子与连接器元件

LQFP-128(14x14) · 128P

CH9130L (LQFP-128(14x14)) - 3D模型 (LQFP-128(14x14))

CH9130L

WCH(南京沁恒)·LQFP-128(14x14)

READY

128P14.0×14.0×1.60mmP=0.4mm

标准电子与连接器元件

QFN-16(4x4) · 17P

CH9101Y (QFN-16(4x4)) - 3D模型 (QFN-16(4x4))

CH9101Y

WCH(南京沁恒)·QFN-16(4x4)

READY

17P4.0×4.0×0.85mmP=0.65mm

标准电子与连接器元件

QFN-16(3x3) · 17P

CH282P (QFN-16(3x3)) - 3D模型 (QFN-16(3x3))

CH282P

WCH(南京沁恒)·QFN-16(3x3)

READY

17P3.0×3.0×0.85mmP=0.5mm

标准电子与连接器元件

- · 8P

CH32V003F4P6-EVT+WCH-LinkE (-) - 3D模型 (-)

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

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