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All Packages RF Module BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Components (3 components · Page 1/1)

Showing 1–3 of 3 components

SOP-16-300mil · 16P

PCF8574T (SOP-16-300mil) - 3D Model (SOP-16-300mil)

PCF8574T

HGSEMI·SOP-16-300mil

READY

16P10.3×7.5×2.10mmP=1.27mm2.5 to 6 V

Standard Electronic & Interconnect Component

DIP-8 · 8P

DS1307ZN-778/HG (DIP-8) - 3D Model (DIP-8)

DS1307ZN-778/HG

READY

8P9.6×6.3×4.20mmP=2.54mm4.5V to 5.5V

Standard Electronic & Interconnect Component

DIP-8 · 8P

AT24C02CN (DIP-8) - 3D Model (DIP-8)

AT24C02CN

READY

8P9.6×6.3×4.20mmP=2.54mm1.7V to 5.5V

Standard Electronic & Interconnect Component

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