4062 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (4064 款元器件 · 第 199/254)

显示 3169–3184 共 4064 款元器件

UFBGA-100 · 100P

STM32L152V8H6 (UFBGA-100) - 3D模型 (UFBGA-100)

STM32L152V8H6

READY

100P7.0×7.0×0.60mmP=0.5mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-100 · 100P

STM32L152VCH6D (UFBGA-100) - 3D模型 (UFBGA-100)

STM32L152VCH6D

READY

100P7.0×7.0×0.60mmP=0.5mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-100 · 100P

STM32L431VCI6 (UFBGA-100) - 3D模型 (UFBGA-100)

STM32L431VCI6

READY

100P7.0×7.0×0.55mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-132(7x7) · 132P

STM32L4R5QII6 (UFBGA-132(7x7)) - 3D模型 (UFBGA-132(7x7))

STM32L4R5QII6

ST·UFBGA-132(7x7)

READY

132P7.0×7.0×0.60mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-100 · 100P

STM32L072VBI6 (UFBGA-100) - 3D模型 (UFBGA-100)

STM32L072VBI6

READY

100P7.0×7.0×0.60mmP=0.5mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-257 · 257P

STM32MP157FAD1 (TFBGA-257) - 3D模型 (TFBGA-257)

STM32MP157FAD1

READY

257P10.0×10.0×1.20mmP=0.65mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-132(7x7) · 132P

STM32U595QII6Q (UFBGA-132(7x7)) - 3D模型 (UFBGA-132(7x7))

STM32U595QII6Q

ST·UFBGA-132(7x7)

READY

132P7.0×7.0×0.60mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

LFBGA-448 · 448P

STM32MP157CAA3T (LFBGA-448) - 3D模型 (LFBGA-448)

STM32MP157CAA3T

READY

448P18.0×18.0×1.35mmP=0.8mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-41 · 41P

STM32WBA55HGF6TR (WLCSP-41) - 3D模型 (WLCSP-41)

STM32WBA55HGF6TR

READY

41P2.8×3.0×0.55mmP=0.4mm

嵌入式微控制器芯片 (MCU)

WLCSP-144(5.2x5.2) · 144P

STM32L4S9ZIY6TR (WLCSP-144(5.2x5.2)) - 3D模型 (WLCSP-144(5.2x5.2))

STM32L4S9ZIY6TR

ST·WLCSP-144(5.2x5.2)

READY

144P5.2×5.2×0.59mmP=0.4mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-104(4.1x5.1) · 104P

STM32L162VDY6XTR (WLCSP-104(4.1x5.1)) - 3D模型 (WLCSP-104(4.1x5.1))

STM32L162VDY6XTR

ST·WLCSP-104(4.1x5.1)

READY

104P5.1×4.1×0.55mmP=0.4mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-104(4.1x5.1) · 104P

STM32L152VEY6TR (WLCSP-104(4.1x5.1)) - 3D模型 (WLCSP-104(4.1x5.1))

STM32L152VEY6TR

ST·WLCSP-104(4.1x5.1)

READY

104P5.1×4.1×0.56mmP=0.4mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-144(5.2x5.2) · 144P

STM32L4R9ZIY6TR (WLCSP-144(5.2x5.2)) - 3D模型 (WLCSP-144(5.2x5.2))

STM32L4R9ZIY6TR

ST·WLCSP-144(5.2x5.2)

READY

144P5.2×5.2×0.59mmP=0.4mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-201 · 201P

STM32H745IGK6 (UFBGA-201) - 3D模型 (UFBGA-201)

STM32H745IGK6

READY

201P10.0×10.0×0.50mmP=0.65mm

嵌入式微控制器芯片 (MCU)

WLCSP-52(3.1x3.2) · 52P

STM32U385CGY6QTR (WLCSP-52(3.1x3.2)) - 3D模型 (WLCSP-52(3.1x3.2))

STM32U385CGY6QTR

ST·WLCSP-52(3.1x3.2)

READY

52P3.1×3.2×0.55mmP=0.39mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-72(3.8x4.4) · 72P

STM32L476JGY6TR (WLCSP-72(3.8x4.4)) - 3D模型 (WLCSP-72(3.8x4.4))

STM32L476JGY6TR

ST·WLCSP-72(3.8x4.4)

READY

72P3.8×4.4×0.56mmP=0.4mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

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