2284 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3500 Bauteilen · Seite 71/219)

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VDFN-6 · 6P

DSC1121CI1-024.0000 (VDFN-6) - 3D-Modell (VDFN-6)

DSC1121CI1-024.0000

MICROCHIP·VDFN-6

READY

6P2.5×3.2×0.85mmP=1.05mm

Standard-Elektronik- & Steckverbinderbauteil

OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H · 4P

C617395 (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H) - 3D-Modell (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H)

C617395

Generic·OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H

READY

4P1.6×1.2×0.75mmP=0.75mm

Standard-Elektronik- & Steckverbinderbauteil

OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H · 4P

C611850 (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H) - 3D-Modell (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H)

C611850

Generic·OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H

READY

4P1.6×1.2×0.75mmP=0.75mm

Standard-Elektronik- & Steckverbinderbauteil

SMD-4P,1.6x1.2mm · 4P

DSC6001HE1A-008.0000 (SMD-4P,1.6x1.2mm) - 3D-Modell (SMD-4P,1.6x1.2mm)

DSC6001HE1A-008.0000

MICROCHIP·SMD-4P,1.6x1.2mm

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

DFN-8-EP(2x3) · 9P

24AA00T-I/MC (DFN-8-EP(2x3)) - 3D-Modell (DFN-8-EP(2x3))

24AA00T-I/MC

MICROCHIP·DFN-8-EP(2x3)

READY

9P3.0×2.0×0.80mmP=0.5mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ0512EFF144-E/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ0512EFF144-E/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

VDFN-6 · 6P

DSC1101CI1-025.0000 (VDFN-6) - 3D-Modell (VDFN-6)

DSC1101CI1-025.0000

MICROCHIP·VDFN-6

READY

6P2.5×3.2×0.85mmP=1.05mm

Standard-Elektronik- & Steckverbinderbauteil

VFLGA-6 · 6P

DSC612PI2A-012Q (VFLGA-6) - 3D-Modell (VFLGA-6)

DSC612PI2A-012Q

MICROCHIP·VFLGA-6

READY

6P1.2×1.6×1.15mmP=0.57mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

DFN-8-EP(2x3) · 9P

PIC12F1501-E/MC (DFN-8-EP(2x3)) - 3D-Modell (DFN-8-EP(2x3))

PIC12F1501-E/MC

MICROCHIP·DFN-8-EP(2x3)

READY

9P3.0×2.0×0.85mmP=0.5mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

- · 36P

RN42APL-I/RM550 (-) - 3D-Modell (-)

RN42APL-I/RM550

READY

36P25.8×13.4×2.40mmP=1mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

TFBGA-144 · 144P

PIC32MZ1024EFK144-I/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ1024EFK144-I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-44(5x5) · 45P

ATMEGA324A-MCHR (QFN-44(5x5)) - 3D-Modell (QFN-44(5x5))

ATMEGA324A-MCHR

MICROCHIP·QFN-44(5x5)

READY

45P5.0×5.0×1.35mmP=0.53mm1.8V - 5.5V

Eingebetteter Mikrocontroller (MCU)

SMD3225-6P · 6P

DSC1101CM1-075.0000 (SMD3225-6P) - 3D-Modell (SMD3225-6P)

DSC1101CM1-075.0000

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

AMPMGEB-24.545454T (SMD1612-4P) - 3D-Modell (SMD1612-4P)

AMPMGEB-24.545454T

ABRACON·SMD1612-4P

READY

4P1.6×1.2×0.84mmP=0.75mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39WF800B-70-4I-MAQE (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39WF800B-70-4I-MAQE

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

UDFN-6-EP(2x2) · 7P

MIC2033-08BYMT-T5 (UDFN-6-EP(2x2)) - 3D-Modell (UDFN-6-EP(2x2))

MIC2033-08BYMT-T5

MICROCHIP·UDFN-6-EP(2x2)

READY

7P2.0×2.0×0.85mmP=0.65mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

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