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Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3609 Bauteilen · Seite 63/226)

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PLCC-44(16.6x16.6) · 44P

AT89LS52-16JU (PLCC-44(16.6x16.6)) - 3D-Modell (PLCC-44(16.6x16.6))

AT89LS52-16JU

MICROCHIP·PLCC-44(16.6x16.6)

READY

44P16.6×16.6×1.00mmP=1.27mm2.7V to 4.0V

Standard-Elektronik- & Steckverbinderbauteil

DIP-8 · 8P

PIC12F1822-I/P (DIP-8) - 3D-Modell (DIP-8)

PIC12F1822-I/P

MICROCHIP·DIP-8

READY

8P3.0×3.0×3.50mmP=2.54mm1.8V-3.6V

Standard-Elektronik- & Steckverbinderbauteil

TO-263-5 · 6P

MIC29152WU (TO-263-5) - 3D-Modell (TO-263-5)

MIC29152WU

MICROCHIP·TO-263-5

READY

6P10.1×9.0×4.50mmP=1.7mm

Standard-Elektronik- & Steckverbinderbauteil

DIP-28-600mil · 28P

PIC16F57-I/P (DIP-28-600mil) - 3D-Modell (DIP-28-600mil)

PIC16F57-I/P

MICROCHIP·DIP-28-600mil

READY

28P35.0×14.3×4.20mmP=2.54mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

VSOP-32 · 32P

AT27LV010A-70VI (VSOP-32) - 3D-Modell (VSOP-32)

AT27LV010A-70VI

MICROCHIP·VSOP-32

READY

32P12.4×8.0×2.45mmP=0.5mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TSOP-28 · 28P

AT27BV256-90TC (TSOP-28) - 3D-Modell (TSOP-28)

AT27BV256-90TC

MICROCHIP·TSOP-28

READY

28P11.8×8.0×2.50mmP=0.55mm2.7V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-256(17x17) · 256P

M7A3P1000-2FG256I (FPBGA-256(17x17)) - 3D-Modell (FPBGA-256(17x17))

M7A3P1000-2FG256I

MICROCHIP·FPBGA-256(17x17)

READY

256P17.0×17.0×1.35mmP=1mm2.7 V to 3.6 V

Standard-Elektronik- & Steckverbinderbauteil

MLF-8_L2.0-W2.0-P0.50-BL-EP · 9P

C3177940 (MLF-8_L2.0-W2.0-P0.50-BL-EP) - 3D-Modell (MLF-8_L2.0-W2.0-P0.50-BL-EP)

C3177940

Generic·MLF-8_L2.0-W2.0-P0.50-BL-EP

READY

9P2.0×2.0×0.75mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

TO-220-3_L10.2-W4.5-P2.54-L · 3P

C17571591 (TO-220-3_L10.2-W4.5-P2.54-L) - 3D-Modell (TO-220-3_L10.2-W4.5-P2.54-L)

C17571591

Generic·TO-220-3_L10.2-W4.5-P2.54-L

READY

3P10.2×4.5×2.00mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-64-EP(9x9) · 65P

ATSAMC21J18A-MUT (QFN-64-EP(9x9)) - 3D-Modell (QFN-64-EP(9x9))

ATSAMC21J18A-MUT

MICROCHIP·QFN-64-EP(9x9)

READY

65P9.0×9.0×1.00mmP=0.5mm2.7V – 5.5V

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-256(17x17) · 256P

U1AFS1500-FGG256 (FPBGA-256(17x17)) - 3D-Modell (FPBGA-256(17x17))

U1AFS1500-FGG256

MICROCHIP·FPBGA-256(17x17)

READY

256P17.0×17.0×1.35mmP=1mm2.97 V to 3.63 V

Standard-Elektronik- & Steckverbinderbauteil

TSOP-32 · 32P

AT27C020-55TC (TSOP-32) - 3D-Modell (TSOP-32)

AT27C020-55TC

MICROCHIP·TSOP-32

READY

32P8.0×18.4×2.45mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28 · 28P

AT27BV512-90RC (SOIC-28) - 3D-Modell (SOIC-28)

AT27BV512-90RC

MICROCHIP·SOIC-28

READY

28P18.3×8.6×2.50mmP=1.27mm2.7V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL · 8P

C17602032 (SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL) - 3D-Modell (SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL)

C17602032

Generic·SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL

READY

8P4.9×3.9×1.75mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-144(13x13) · 144P

A3P1000-1FGG144I (FPBGA-144(13x13)) - 3D-Modell (FPBGA-144(13x13))

A3P1000-1FGG144I

MICROCHIP·FPBGA-144(13x13)

READY

144P13.0×13.0×1.35mmP=1mm2.7 V to 3.6 V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-8 · 8P

AT24C01C-XHM-T (TSSOP-8) - 3D-Modell (TSSOP-8)

AT24C01C-XHM-T

MICROCHIP·TSSOP-8

READY

8P3.0×4.4×1.20mmP=0.65mm1.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

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