3774 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3784 Bauteilen · Seite 56/237)

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HVQFN-48_L7.0-W7.0-P0.50-TL-EP5.1 · 49P

C7215761 (HVQFN-48_L7.0-W7.0-P0.50-TL-EP5.1) - 3D-Modell (HVQFN-48_L7.0-W7.0-P0.50-TL-EP5.1)

C7215761

Generic·HVQFN-48_L7.0-W7.0-P0.50-TL-EP5.1

READY

49P7.0×7.0×0.85mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-256(14x14) · 256P

M2GL025-1VF256 (FPBGA-256(14x14)) - 3D-Modell (FPBGA-256(14x14))

M2GL025-1VF256

MICROCHIP·FPBGA-256(14x14)

READY

256P14.0×14.0×1.35mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-256 · 256P

A3P400-2FG256 (FPBGA-256) - 3D-Modell (FPBGA-256)

A3P400-2FG256

MICROCHIP·FPBGA-256

READY

256P17.0×17.0×1.35mmP=1mm2.7 V to 3.6 V

Standard-Elektronik- & Steckverbinderbauteil

- · 6P

MIC5320-MMYD6 (-) - 3D-Modell (-)

MIC5320-MMYD6

READY

6P2.3V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-8 · 8P

AT24C64-10PI (PDIP-8) - 3D-Modell (PDIP-8)

AT24C64-10PI

MICROCHIP·PDIP-8

READY

8P9.6×6.3×4.20mmP=2.54mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

AT24C02AN-10SC-1.8 (SOIC-8) - 3D-Modell (SOIC-8)

AT24C02AN-10SC-1.8

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-8 · 8P

AT24C32-10PI-2.5 (PDIP-8) - 3D-Modell (PDIP-8)

AT24C32-10PI-2.5

MICROCHIP·PDIP-8

READY

8P9.6×6.3×4.20mmP=2.54mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-8 · 8P

AT24C64-10TI-2.5 (TSSOP-8) - 3D-Modell (TSSOP-8)

AT24C64-10TI-2.5

MICROCHIP·TSSOP-8

READY

8P3.0×4.4×1.20mmP=0.65mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-8 · 8P

AT24C02A-10PC-2.5 (PDIP-8) - 3D-Modell (PDIP-8)

AT24C02A-10PC-2.5

MICROCHIP·PDIP-8

READY

8P9.6×6.3×4.20mmP=2.54mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

AT24C08AN-10SC-1.8 (SOIC-8) - 3D-Modell (SOIC-8)

AT24C08AN-10SC-1.8

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-20 · 20P

MCP4461-502E/ST (TSSOP-20) - 3D-Modell (TSSOP-20)

MCP4461-502E/ST

MICROCHIP·TSSOP-20

READY

20P6.5×4.4×1.00mmP=0.65mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-16-EP(3x3) · 17P

CAP1208-1-A4-TR (QFN-16-EP(3x3)) - 3D-Modell (QFN-16-EP(3x3))

CAP1208-1-A4-TR

MICROCHIP·QFN-16-EP(3x3)

READY

17P3.0×3.0×0.85mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-16-300mil · 16P

LE89810BSCT (SOIC-16-300mil) - 3D-Modell (SOIC-16-300mil)

LE89810BSCT

MICROCHIP·SOIC-16-300mil

READY

16P10.3×7.5×2.70mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

LGA-64(10x5) · 66P

ZL30621LFF7 (LGA-64(10x5)) - 3D-Modell (LGA-64(10x5))

ZL30621LFF7

MICROCHIP·LGA-64(10x5)

READY

66P10.0×5.0×1.15mmP=0.4mm1.5V to 3.3V

Standard-Elektronik- & Steckverbinderbauteil

LGA-64(10x5) · 66P

ZL30723LFF7 (LGA-64(10x5)) - 3D-Modell (LGA-64(10x5))

ZL30723LFF7

MICROCHIP·LGA-64(10x5)

READY

66P10.0×5.0×1.15mmP=0.4mm1.5V to 3.3V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

AT24C32N-10SI-1.8 (SOIC-8) - 3D-Modell (SOIC-8)

AT24C32N-10SI-1.8

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

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