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Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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SMD,25.5x18mm · 41P

ESP32-S3-WROOM-1-N16 (SMD,25.5x18mm) - Pinbelegung (41P)

ESP32-S3-WROOM-1-N16

ESPRESSIF·SMD,25.5x18mm

READY

41P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,25.5x18mm · 41P

ESP32-S3-WROOM-1-N16R2 (SMD,25.5x18mm) - Pinbelegung (41P)

ESP32-S3-WROOM-1-N16R2

ESPRESSIF·SMD,25.5x18mm

READY

41P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,25.5x18mm · 41P

ESP32-S3-WROOM-1-N16R8 (SMD,25.5x18mm) - Pinbelegung (41P)

ESP32-S3-WROOM-1-N16R8

ESPRESSIF·SMD,25.5x18mm

READY

41P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,25.5x18mm · 41P

ESP32-S3-WROOM-1-N4 (SMD,25.5x18mm) - Pinbelegung (41P)

ESP32-S3-WROOM-1-N4

ESPRESSIF·SMD,25.5x18mm

READY

41P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,25.5x18mm · 41P

ESP32-S3-WROOM-1-N4R2 (SMD,25.5x18mm) - Pinbelegung (41P)

ESP32-S3-WROOM-1-N4R2

ESPRESSIF·SMD,25.5x18mm

READY

41P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,25.5x18mm · 41P

ESP32-S3-WROOM-1-N4R8 (SMD,25.5x18mm) - Pinbelegung (41P)

ESP32-S3-WROOM-1-N4R8

ESPRESSIF·SMD,25.5x18mm

READY

41P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,25.5x18mm · 41P

ESP32-S3-WROOM-1-N8 (SMD,25.5x18mm) - Pinbelegung (41P)

ESP32-S3-WROOM-1-N8

ESPRESSIF·SMD,25.5x18mm

READY

41P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,25.5x18mm · 41P

ESP32-S3-WROOM-1-N8R2 (SMD,25.5x18mm) - Pinbelegung (41P)

ESP32-S3-WROOM-1-N8R2

ESPRESSIF·SMD,25.5x18mm

READY

41P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,25.5x18mm · 41P

ESP32-S3-WROOM-1-N8R8 (SMD,25.5x18mm) - Pinbelegung (41P)

ESP32-S3-WROOM-1-N8R8

ESPRESSIF·SMD,25.5x18mm

READY

41P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

TSSOP-8 · 8P

MCP6022-I/ST (TSSOP-8) - Pinbelegung (8P)

MCP6022-I/ST

MICROCHIP·TSSOP-8

READY

8P3.0×4.4×1.20mmP=0.65mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TO-263-5 · 6P

MIC29152WU (TO-263-5) - Pinbelegung (6P)

MIC29152WU

MICROCHIP·TO-263-5

READY

6P10.1×9.0×4.50mmP=1.7mm

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-20 · 20P

STM32G031F6P7 (TSSOP-20) - Pinbelegung (20P)

STM32G031F6P7

READY

20P6.5×4.4×1.20mmP=0.65mm1.62 V - 3.6 V

Eingebetteter Mikrocontroller (MCU)

SOP-8 · 8P

STM32G031J4M6 (SOP-8) - Pinbelegung (8P)

STM32G031J4M6

READY

8P4.9×3.9×1.75mmP=1.27mm1.62 V - 3.6 V

Eingebetteter Mikrocontroller (MCU)

SOP-8 · 8P

STM32G031J6M6TR (SOP-8) - Pinbelegung (8P)

STM32G031J6M6TR

READY

8P4.9×3.9×1.75mmP=1.27mm1.62 V - 3.6 V

Eingebetteter Mikrocontroller (MCU)

SO-8 · 8P

STM32G031J6M6U (SO-8) - Pinbelegung (8P)

STM32G031J6M6U

READY

8P4.9×3.9×1.75mmP=1.27mm1.62 V - 3.6 V

Eingebetteter Mikrocontroller (MCU)

LQFP-64(10x10) · 64P

STM32G071R8T6 (LQFP-64(10x10)) - Pinbelegung (64P)

STM32G071R8T6

ST·LQFP-64(10x10)

READY

64P10.0×10.0×1.60mmP=0.5mm1.62 V - 3.6 V

Eingebetteter Mikrocontroller (MCU)

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