3911 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3924 Bauteilen · Seite 245/246)

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SOP-16 · 16P

CH340C (SOP-16) - 3D-Modell (SOP-16)

CH340C

READY

16P9.9×3.9×1.75mmP=1.27mm

Schnittstellen-Bridge & Takt-/Timer-IC

SOT-223 · 4P

AMS1117-3.3 (SOT-223) - 3D-Modell (SOT-223)

AMS1117-3.3

Advanced Monolithic Systems·SOT-223

READY

4P6.5×3.5×1.80mmP=2.29mm5V to 3.3V

Low-Dropout-Linearspannungsregler (LDO)

0805 · 2P

0805W8F1004T5E (0805) - 3D-Modell (0805)

0805W8F1004T5E

UNI-ROYAL·0805

READY

2P2.0×1.2×0.50mmP=1.9mm

Standard-Elektronik- & Steckverbinderbauteil

LQFN-56(7x7) · 57P

RP2040 (LQFN-56(7x7)) - 3D-Modell (LQFN-56(7x7))

RP2040

Raspberry Pi·LQFN-56(7x7)

READY

57P7.0×7.0×0.90mmP=0.4mm

Eingebetteter Mikrocontroller (MCU)

SMD-38P · 39P

ESP32-WROOM-32E(M113EH6400PH3Q0) (SMD-38P) - 3D-Modell (SMD-38P)

ESP32-WROOM-32E(M113EH6400PH3Q0)

ESPRESSIF·SMD-38P

READY

39P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

DIP-8 · 8P

NE555P (DIP-8) - 3D-Modell (DIP-8)

NE555P

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

Schnittstellen-Bridge & Takt-/Timer-IC

TQFP-32(7x7) · 32P

ATMEGA328P-AU (TQFP-32(7x7)) - 3D-Modell (TQFP-32(7x7))

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

Eingebetteter Mikrocontroller (MCU)

MSOP-8 · 8P

MCP3553-E/MS (MSOP-8) - 3D-Modell (MSOP-8)

MCP3553-E/MS

MICROCHIP(美国微芯)·MSOP-8

READY

8P

MCP3553-E/MS

TSSOP-14 · 8P

PIC16LF18324-I/ST (TSSOP-14) - 3D-Modell (TSSOP-14)

PIC16LF18324-I/ST

MICROCHIP(美国微芯)·TSSOP-14

READY

8P

PIC16LF18324-I/ST

SOT-23-5 · 8P

MCP1322T-31LE/OT (SOT-23-5) - 3D-Modell (SOT-23-5)

MCP1322T-31LE/OT

MICROCHIP(美国微芯)·SOT-23-5

READY

8P

MCP1322T-31LE/OT

SSOP-28-208mil · 8P

PIC16F18455-I/SS (SSOP-28-208mil) - 3D-Modell (SSOP-28-208mil)

PIC16F18455-I/SS

MICROCHIP(美国微芯)·SSOP-28-208mil

READY

8P

PIC16F18455-I/SS

TSSOP-14 · 8P

MCP4362-103E/ST (TSSOP-14) - 3D-Modell (TSSOP-14)

MCP4362-103E/ST

MICROCHIP(美国微芯)·TSSOP-14

READY

8P

MCP4362-103E/ST

TQFP-64(14x14) · 8P

ATMEGA329PV-10AU (TQFP-64(14x14)) - 3D-Modell (TQFP-64(14x14))

ATMEGA329PV-10AU

MICROCHIP(美国微芯)·TQFP-64(14x14)

READY

8P

ATMEGA329PV-10AU

SOIC-8 · 8P

PIC12LF1840-I/SN (SOIC-8) - 3D-Modell (SOIC-8)

PIC12LF1840-I/SN

MICROCHIP(美国微芯)·SOIC-8

READY

8P

PIC12LF1840-I/SN

TQFP-80(12x12) · 8P

PIC24FJ128GA108-I/PT (TQFP-80(12x12)) - 3D-Modell (TQFP-80(12x12))

PIC24FJ128GA108-I/PT

MICROCHIP(美国微芯)·TQFP-80(12x12)

READY

8P

PIC24FJ128GA108-I/PT

SOIC-28-300mil · 8P

PIC18F26K40T-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC18F26K40T-I/SO

MICROCHIP(美国微芯)·SOIC-28-300mil

READY

8P

8位CMOS闪存微控制器，具备10位A/D和纳瓦技术，有低功耗模式、多种外设功能和特殊特性

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