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Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3844 Bauteilen · Seite 207/241)

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LQFP-64(7x7) · 64P

CH367L (LQFP-64(7x7)) - 3D-Modell (LQFP-64(7x7))

CH367L

WCH·LQFP-64(7x7)

READY

64P7.0×7.0×1.60mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-20(3x3) · 21P

CH592D (QFN-20(3x3)) - 3D-Modell (QFN-20(3x3))

CH592D

WCH·QFN-20(3x3)

READY

21P3.0×3.0×0.85mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-32-EP(4x4) · 33P

CH9114F (QFN-32-EP(4x4)) - 3D-Modell (QFN-32-EP(4x4))

CH9114F

WCH·QFN-32-EP(4x4)

READY

33P4.0×4.0×0.85mmP=0.4mm1.2V to 3.3V

Standard-Elektronik- & Steckverbinderbauteil

QFN-32(4x4) · 33P

CH32L103K8U6 (QFN-32(4x4)) - 3D-Modell (QFN-32(4x4))

CH32L103K8U6

WCH·QFN-32(4x4)

READY

33P4.0×4.0×0.85mmP=0.4mm1.8V~3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28(4x4) · 29P

CH377F (QFN-28(4x4)) - 3D-Modell (QFN-28(4x4))

CH377F

WCH·QFN-28(4x4)

READY

29P4.0×4.0×0.85mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-6 · 6P

CH217K (SOT-23-6) - 3D-Modell (SOT-23-6)

CH217K

READY

6P2.9×1.6×1.10mmP=0.95mm

Standard-Elektronik- & Steckverbinderbauteil

QFN20_3X3mm · 21P

CH32V203F8U6 (QFN20_3X3mm) - 3D-Modell (QFN20_3X3mm)

CH32V203F8U6

WCH·QFN20_3X3mm

READY

21P3.0×3.0×0.85mmP=0.4mm

Eingebetteter Mikrocontroller (MCU)

DFN-6(1.2x1.2) · 7P

CH443L (DFN-6(1.2x1.2)) - 3D-Modell (DFN-6(1.2x1.2))

CH443L

WCH·DFN-6(1.2x1.2)

READY

7P1.2×1.2×1.00mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-32(4x4) · 33P

CH9437F (QFN-32(4x4)) - 3D-Modell (QFN-32(4x4))

CH9437F

WCH·QFN-32(4x4)

READY

33P4.0×4.0×0.85mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-48(5x5) · 49P

CH9434A (QFN-48(5x5)) - 3D-Modell (QFN-48(5x5))

CH9434A

WCH·QFN-48(5x5)

READY

49P5.0×5.0×0.85mmP=0.35mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-20(3x3) · 21P

CH591D (QFN-20(3x3)) - 3D-Modell (QFN-20(3x3))

CH591D

WCH·QFN-20(3x3)

READY

21P3.0×3.0×0.85mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

ESSOP-10 · 11P

CH224A (ESSOP-10) - 3D-Modell (ESSOP-10)

CH224A

READY

11P4.9×3.9×1.10mmP=1mm4V to 30V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-28-209mil · 28P

CH334S (SSOP-28-209mil) - 3D-Modell (SSOP-28-209mil)

CH334S

WCH·SSOP-28-209mil

READY

28P10.2×5.3×1.85mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-68(8x8) · 69P

CH32V467WEU6 (QFN-68(8x8)) - 3D-Modell (QFN-68(8x8))

CH32V467WEU6

WCH·QFN-68(8x8)

READY

69P8.0×8.0×0.90mmP=0.4mm

Eingebetteter Mikrocontroller (MCU)

LQFP-100(14x14) · 100P

CH32V317VCT6 (LQFP-100(14x14)) - 3D-Modell (LQFP-100(14x14))

CH32V317VCT6

WCH·LQFP-100(14x14)

READY

100P14.0×14.0×1.60mmP=0.5mm

Eingebetteter Mikrocontroller (MCU)

QFN-32(5x5) · 33P

CH182H7 (QFN-32(5x5)) - 3D-Modell (QFN-32(5x5))

CH182H7

WCH·QFN-32(5x5)

READY

33P5.0×5.0×0.85mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

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