4022 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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MSOP-10 · 10P

TC1303C-ZS0EUNTR (MSOP-10) - 3D-Modell (MSOP-10)

TC1303C-ZS0EUNTR

MICROCHIP·MSOP-10

READY

10P3.0×3.0×1.10mmP=0.5mm8V to 4.5V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-28-208mil · 28P

dsPIC33EP64GP502T-I/SS (SSOP-28-208mil) - 3D-Modell (SSOP-28-208mil)

dsPIC33EP64GP502T-I/SS

MICROCHIP·SSOP-28-208mil

READY

28P10.2×5.3×1.85mmP=0.65mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

VQFN-100-EP(12x12) · 101P

USB5816T/KD (VQFN-100-EP(12x12)) - 3D-Modell (VQFN-100-EP(12x12))

USB5816T/KD

MICROCHIP·VQFN-100-EP(12x12)

READY

101P12.0×12.0×0.90mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

VQFN-100-EP(12x12) · 101P

USB5816CT-I/KD (VQFN-100-EP(12x12)) - 3D-Modell (VQFN-100-EP(12x12))

USB5816CT-I/KD

MICROCHIP·VQFN-100-EP(12x12)

READY

101P12.0×12.0×0.90mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC16LF1776T-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC16LF1776T-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.50mmP=1.27mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC16F876AT-E/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC16F876AT-E/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×0.85mmP=0.65mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC16F818T-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC16F818T-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×0.85mmP=0.65mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-44-EP(8x8) · 45P

PIC16F727T-I/ML (QFN-44-EP(8x8)) - 3D-Modell (QFN-44-EP(8x8))

PIC16F727T-I/ML

MICROCHIP·QFN-44-EP(8x8)

READY

45P8.0×8.0×0.90mmP=0.65mm1.8V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC16F648AT-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC16F648AT-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×1.00mmP=0.65mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-44-EP(8x8) · 45P

dsPIC33FJ64GP204T-I/ML (QFN-44-EP(8x8)) - 3D-Modell (QFN-44-EP(8x8))

dsPIC33FJ64GP204T-I/ML

MICROCHIP·QFN-44-EP(8x8)

READY

45P8.0×8.0×0.90mmP=0.65mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-44-EP(8x8) · 45P

dsPIC33EP32GS504T-I/ML (QFN-44-EP(8x8)) - 3D-Modell (QFN-44-EP(8x8))

dsPIC33EP32GS504T-I/ML

MICROCHIP·QFN-44-EP(8x8)

READY

45P8.0×8.0×1.00mmP=0.5mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

MSOP-8 · 8P

TC1174VUATR (MSOP-8) - 3D-Modell (MSOP-8)

TC1174VUATR

MICROCHIP·MSOP-8

READY

8P3.0×3.0×1.10mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

MLF-10(3x3) · 11P

MIC2212-GKBML-TR (MLF-10(3x3)) - 3D-Modell (MLF-10(3x3))

MIC2212-GKBML-TR

MICROCHIP·MLF-10(3x3)

READY

11P3.0×3.0×1.00mmP=0.5mm2.25V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

VFBGA-400 · 400P

M2GL010T-VFG400I (VFBGA-400) - 3D-Modell (VFBGA-400)

M2GL010T-VFG400I

MICROCHIP·VFBGA-400

READY

400P17.0×17.0×0.85mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-24 · 24P

LX1688CPW (TSSOP-24) - 3D-Modell (TSSOP-24)

LX1688CPW

MICROCHIP·TSSOP-24

READY

24P7.8×4.4×1.20mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-256(14x14) · 256P

M2GL010T-VFG256I (FPBGA-256(14x14)) - 3D-Modell (FPBGA-256(14x14))

M2GL010T-VFG256I

MICROCHIP·FPBGA-256(14x14)

READY

256P14.0×14.0×1.35mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

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