4114 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4124 Bauteilen · Seite 111/258)

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SMD-36P · 37P

ATWINC3400-MR210CA142 (SMD-36P) - 3D-Modell (SMD-36P)

ATWINC3400-MR210CA142

MICROCHIP·SMD-36P

READY

37P22.4×14.7×2.40mmP=1.2mm2.7V to 3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

UFBGA-88(6x6) · 88P

ATMXT640U-CCU023 (UFBGA-88(6x6)) - 3D-Modell (UFBGA-88(6x6))

ATMXT640U-CCU023

MICROCHIP·UFBGA-88(6x6)

READY

88P6.0×6.0×0.60mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

PBGA-324_L23.0-W23.0-P1.00-TL_MICROCHIP_ZL501XX · 324P

C20297164 (PBGA-324_L23.0-W23.0-P1.00-TL_MICROCHIP_ZL501XX) - 3D-Modell (PBGA-324_L23.0-W23.0-P1.00-TL_MICROCHIP_ZL501XX)

C20297164

Generic·PBGA-324_L23.0-W23.0-P1.00-TL_MICROCHIP_ZL501XX

READY

324P23.0×23.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ2048EFM144T-E/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ2048EFM144T-E/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX · 6P

C5128593 (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX) - 3D-Modell (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX)

C5128593

Generic·OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX

READY

6P3.2×2.5×1.00mmP=1.05mm

Standard-Elektronik- & Steckverbinderbauteil

PBGA-272(27x27) · 272P

70V5388S166BGI8 (PBGA-272(27x27)) - 3D-Modell (PBGA-272(27x27))

70V5388S166BGI8

RENESAS·PBGA-272(27x27)

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-59(8x8) · 59P

HV53011-E/KVX (TFBGA-59(8x8)) - 3D-Modell (TFBGA-59(8x8))

HV53011-E/KVX

MICROCHIP·TFBGA-59(8x8)

READY

59P8.0×8.0×1.20mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

UDFN-6(2x2) · 7P

NCP380LMU05AATBG (UDFN-6(2x2)) - 3D-Modell (UDFN-6(2x2))

NCP380LMU05AATBG

onsemi·UDFN-6(2x2)

READY

7P2.0×2.0×0.85mmP=0.65mm2.5 V – 5.5 V

Standard-Elektronik- & Steckverbinderbauteil

SMD-12P · 12P

MRF89XAM9AT-I/RM (SMD-12P) - 3D-Modell (SMD-12P)

MRF89XAM9AT-I/RM

MICROCHIP·SMD-12P

READY

12P28.0×17.8×3.10mm2.1–3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

VQFN-10-EP(2x2) · 10P

MCP1665T-E/MRA (VQFN-10-EP(2x2)) - 3D-Modell (VQFN-10-EP(2x2))

MCP1665T-E/MRA

MICROCHIP·VQFN-10-EP(2x2)

READY

10P2.0×2.0×0.90mmP=0.5mm2.9V to 5V

Standard-Elektronik- & Steckverbinderbauteil

VFBGA-78 · 78P

HV2902GA-G (VFBGA-78) - 3D-Modell (VFBGA-78)

HV2902GA-G

MICROCHIP·VFBGA-78

READY

78P9.0×9.0×1.00mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-44-EP(5x5) · 45P

ATMEGA164A-MCH (QFN-44-EP(5x5)) - 3D-Modell (QFN-44-EP(5x5))

ATMEGA164A-MCH

MICROCHIP·QFN-44-EP(5x5)

READY

45P5.0×5.0×1.35mmP=0.53mm1.8V - 5.5V

Eingebetteter Mikrocontroller (MCU)

WFBGA-48(4x6) · 48P

SST39VF401C-70-4I-MAQE-T (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39VF401C-70-4I-MAQE-T

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39LF802C-55-4C-MAQE (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39LF802C-55-4C-MAQE

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39VF401C-70-4I-MAQE (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39VF401C-70-4I-MAQE

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-84 · 84P

CEC1712H-S2-I/SX (WFBGA-84) - 3D-Modell (WFBGA-84)

CEC1712H-S2-I/SX

MICROCHIP·WFBGA-84

READY

84P7.0×7.0×1.35mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

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