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Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (822 Bauteilen · Seite 1/52)

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MSOP-8 · 8P

25LC080D-E/MS (MSOP-8) - 3D-Modell (MSOP-8)

25LC080D-E/MS

MICROCHIP·MSOP-8

READY

8P3.0×3.0×1.10mmP=0.65mm2.5V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

MSOP-8 · 8P

25LC020A-E/MS (MSOP-8) - 3D-Modell (MSOP-8)

25LC020A-E/MS

MICROCHIP·MSOP-8

READY

8P3.0×3.0×1.10mmP=0.65mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-8 · 8P

25C080-E/P (PDIP-8) - 3D-Modell (PDIP-8)

25C080-E/P

MICROCHIP·PDIP-8

READY

8P9.6×6.3×4.20mmP=2.54mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

DFN-8-EP(5x6) · 9P

25AA256-E/MF (DFN-8-EP(5x6)) - 3D-Modell (DFN-8-EP(5x6))

25AA256-E/MF

MICROCHIP·DFN-8-EP(5x6)

READY

9P6.0×5.0×1.00mmP=1.27mm2.5V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

DFN-8-EP(3x3) · 9P

MCP1602T-180I/MF (DFN-8-EP(3x3)) - 3D-Modell (DFN-8-EP(3x3))

MCP1602T-180I/MF

MICROCHIP·DFN-8-EP(3x3)

READY

9P3.0×3.0×0.90mmP=0.65mm8V to 4.5V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

PIC18LF13K50T-I/SS (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

PIC18LF13K50T-I/SS

MICROCHIP·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm1.8V-3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-44-EP(8x8) · 45P

PIC18F45K20T-I/ML (QFN-44-EP(8x8)) - 3D-Modell (QFN-44-EP(8x8))

PIC18F45K20T-I/ML

MICROCHIP·QFN-44-EP(8x8)

READY

45P8.0×8.0×1.00mmP=0.5mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TDFN-4(1x1) · 5P

MIC5504-3.1YMT-TR

MICROCHIP·TDFN-4(1x1)

READY

5P1.0×1.0×0.85mmP=0.57mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28 · 28P

AT27C256R-45RI (SOIC-28) - 3D-Modell (SOIC-28)

AT27C256R-45RI

MICROCHIP·SOIC-28

READY

28P18.3×8.6×2.50mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-32(11.4x14) · 32P

AT27C256R-15JI (PLCC-32(11.4x14)) - 3D-Modell (PLCC-32(11.4x14))

AT27C256R-15JI

MICROCHIP·PLCC-32(11.4x14)

READY

32P14.0×11.4×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-32(11.4x14) · 32P

AT27C256R-90JC (PLCC-32(11.4x14)) - 3D-Modell (PLCC-32(11.4x14))

AT27C256R-90JC

MICROCHIP·PLCC-32(11.4x14)

READY

32P14.0×11.4×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

TSOP-28 · 28P

AT27C256R-45TU (TSOP-28) - 3D-Modell (TSOP-28)

AT27C256R-45TU

MICROCHIP·TSOP-28

READY

28P11.8×8.0×2.50mmP=0.55mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-32(11.4x14) · 32P

AT27C256R-70JI (PLCC-32(11.4x14)) - 3D-Modell (PLCC-32(11.4x14))

AT27C256R-70JI

MICROCHIP·PLCC-32(11.4x14)

READY

32P14.0×11.4×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

0402 · 2P

MPP4205-206/TR (0402) - 3D-Modell (0402)

MPP4205-206/TR

MICROCHIP·0402

READY

2P1.0×0.5×0.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC16F873-04/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC16F873-04/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.50mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

UQFN-40-EP(5x5) · 41P

PIC18LF47K40-E/MV (UQFN-40-EP(5x5)) - 3D-Modell (UQFN-40-EP(5x5))

PIC18LF47K40-E/MV

MICROCHIP·UQFN-40-EP(5x5)

READY

41P5.0×5.0×0.50mmP=0.4mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

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