ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) — Symbol, Footprint IPC-7351B & 3D STEP Model

ESP32-S2-WROOM(M22S2H3200PS3Q0)

ESPRESSIFID: C7274974VFQFN-56-EP · 43 Pins · Pitch 1.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP)1GPIO023V33IO04IO15IO26IO37IO48IO59IO610IO711IO812IO913IO1014IO1115IO1216IO1317IO1418IO1519IO1620IO1721IO1822IO1943EP42GND41EN40IO4639IO4538RXD037TXD036IO4235IO4134IO4033IO3932IO3831IO3730IO3629IO3528IO3427IO3326GND25IO2624IO2123IO20Grid Pitch = 2.54mm (IEEE-315)-20.3-15.2-10.2-5.105.110.215.220.333.027.922.917.812.77.62.5-2.5-7.6-12.7-17.8-22.9-27.9-33.0mm
2. 2D FOOTPRINT
ANTENNA KEEPOUT (6.7mm)123456789101112131415161718192021222324252627282930313233343536373839404142434343434343434343E=18.00mm · Pitch e=1.50mmD=31.00mm-18-16-14-12-10-8-6-4-2024681012141618242220181614121086420-2-4-6-8-10-12-14-16-18-20-22-24mm
3. 3D CAD MODEL
Package Body: 18.00mm × 31.00mm · Pitch: 1.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (43/43)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1GPIO0I/OMultiplexed I/O & Peripheral Pin GPIO0 (General)
23V3PowerPower Supply Input (3V3 — 3.3V VDD3P3 (3.0V ~ 3.6V))
3IO0I/OMultiplexed I/O & Peripheral Pin IO0 (RTC/CLK)
4IO1I/OMultiplexed I/O & Peripheral Pin IO1 (RTC/CLK, TOUCH)
5IO2I/OMultiplexed I/O & Peripheral Pin IO2 (RTC/CLK, TOUCH)
6IO3I/OMultiplexed I/O & Peripheral Pin IO3 (RTC/CLK, TOUCH)
7IO4I/OMultiplexed I/O & Peripheral Pin IO4 (RTC/CLK, TOUCH)
8IO5I/OMultiplexed I/O & Peripheral Pin IO5 (RTC/CLK, TOUCH)
9IO6I/OMultiplexed I/O & Peripheral Pin IO6 (RTC/CLK, TOUCH)
10IO7I/OMultiplexed I/O & Peripheral Pin IO7 (RTC/CLK, TOUCH)
11IO8I/OMultiplexed I/O & Peripheral Pin IO8 (RTC/CLK, TOUCH)
12IO9I/OMultiplexed I/O & Peripheral Pin IO9 (ADC, RTC/CLK, TOUCH)
13IO10I/OMultiplexed I/O & Peripheral Pin IO10 (ADC, RTC/CLK, TOUCH)
14IO11I/OMultiplexed I/O & Peripheral Pin IO11 (ADC, RTC/CLK, TOUCH)
15IO12I/OMultiplexed I/O & Peripheral Pin IO12 (ADC, RTC/CLK, TOUCH)
16IO13I/OMultiplexed I/O & Peripheral Pin IO13 (ADC, RTC/CLK, TOUCH)
17IO14I/OMultiplexed I/O & Peripheral Pin IO14 (ADC, RTC/CLK, TOUCH)
18IO15I/OMultiplexed I/O & Peripheral Pin IO15 (ADC, RTC/CLK)
19IO16I/OMultiplexed I/O & Peripheral Pin IO16 (ADC, RTC/CLK)
20IO17I/OMultiplexed I/O & Peripheral Pin IO17 (UART, ADC, RTC/CLK)
21IO18I/OMultiplexed I/O & Peripheral Pin IO18 (UART, ADC, DAC, RTC/CLK)
22IO19I/OMultiplexed I/O & Peripheral Pin IO19 (ADC, RTC/CLK)
23IO20I/OMultiplexed I/O & Peripheral Pin IO20 (USB, ADC, RTC/CLK)
24IO21I/OMultiplexed I/O & Peripheral Pin IO21 (RTC/CLK)
25IO26I/OMultiplexed I/O & Peripheral Pin IO26 (SPI)
26GNDGNDGround Reference Pin (GND)
27IO33I/OMultiplexed I/O & Peripheral Pin IO33 (SPI)
28IO34IInput-Only Pin IO34 (SPI)
29IO35IInput-Only Pin IO35 (SPI)
30IO36IInput-Only Pin IO36 (SPI)
31IO37IInput-Only Pin IO37 (SPI)
32IO38IInput-Only Pin IO38 (SPI)
33IO39IInput-Only Pin IO39 (SWD/JTAG)
34IO40I/OMultiplexed I/O & Peripheral Pin IO40 (SWD/JTAG)
35IO41I/OMultiplexed I/O & Peripheral Pin IO41 (SWD/JTAG)
36IO42I/OMultiplexed I/O & Peripheral Pin IO42 (SWD/JTAG)
37TXD0I/OMultiplexed I/O & Peripheral Pin TXD0 (UART)
38RXD0I/OMultiplexed I/O & Peripheral Pin RXD0 (UART)
39IO45I/OMultiplexed I/O & Peripheral Pin IO45 (General)
40IO46I/OMultiplexed I/O & Peripheral Pin IO46 (General)
41ENISystem Enable & Hardware Reset (EN)
42GNDGNDGround Reference Pin (GND)
43EPGNDExposed Thermal & Ground Pad (EP)
PIN 1 GPIO0
I/O
Multiplexed I/O & Peripheral Pin GPIO0 (General)
Design note: Pull -up
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 15 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: ESP32-S2-WROOM(M22S2H3200PS3Q0) (ESPRESSIF · VFQFN-56-EP)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) - 2. Standard Pinout (Top View)
True package pinout (43 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) - 4. Package Dimensions (D×E×A)
VFQFN-56-EP · 18.00×31.00mm · Pitch 1.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) - 5. Recommended Land Pattern
IPC-7351B Footprint (51 Pads)Expand ›
6. Application SchematicSCHEMATIC
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (15 figures · Page 1/2)
Showing 1–12 of 15 uncropped original figures for ESP32-S2-WROOM
P1 · p01_fig01EXACT PACKAGE
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) — Version1.3
Version1.3
P1 · p01_fig02EXACT PACKAGE
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) — ESP32-S2-WROOM ESP32-S2-WROOM-I
ESP32-S2-WROOM ESP32-S2-WROOM-I
P1 · p01_fig03EXACT PACKAGE
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) — ESP32-S2-WROOM ESP32-S2-WROOM-I
ESP32-S2-WROOM ESP32-S2-WROOM-I
P1 · p01_fig04726×314px
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) — www.espressif.com
www.espressif.com
P1 · p01_fig02P1
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) — Datasheet Page 1 (p01_fig02)
Datasheet Page 1 (p01_fig02)
P8 · p08_fig011197×1971px
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) — Figure 3: Pin Layout (Top View)
Figure 3: Pin Layout (Top View)
P17 · p17_fig011046×1034px
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) — VDD_SPI
VDD_SPI
P17 · p17_fig021272×681px
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) — 0.1uF
0.1uF
P19 · p19_fig011797×1600px
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) — Figure 6: Peripheral Schematics
Figure 6: Peripheral Schematics
P19 · p19_fig01P19
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) — Datasheet Page 19 (p19_fig01)
Datasheet Page 19 (p19_fig01)
P20 · p20_fig011576×1046px
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) — Figure 7: Physical Dimensions
Figure 7: Physical Dimensions
P20 · p20_fig01P20
ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) — Datasheet Page 20 (p20_fig01)
Datasheet Page 20 (p20_fig01)
Page 1 / 2 (15 extracted figures)

Technical Specifications & Part Details (ESP32-S2-WROOM(M22S2H3200PS3Q0))

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Wireless Wi-Fi / Bluetooth LE SoC Module
Detailed Overview:ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) is a 56-pin wireless wi-fi / bluetooth le soc module featuring a 31.00 × 18.00 × 3.30 mm mechanical envelope (lead pitch e = 1.50 mm). Rated for 3.0 ~ 3.6 V supply operation across 40 °C ~+105 °C with integrated Wi-Fi, USB, UART, SPI, I2C, I2S, ADC, DAC, PWM, RTC/CLK, SWD/JTAG, TOUCH interfaces.
Operating Supply VoltageV_CC / V_DD
3.0 ~ 3.6 V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
40 °C ~+105 °C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
2.4 GHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_TX(peak) ≈ 310 mA @ 3.3V | Deep-Sleep ≈ 10 µA | I_GPIO(max) = 40 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
31.00 × 18.00 × 3.30 mm (A1=0.00 mm)
Package family: CASTELLATED_MODULE (VFQFN-56-EP)
Pin Count & Lead PitchN / e
56 Pins | Pitch e = 1.50 mm (59.1 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Wi-Fi, USB, UART, SPI, I2C, I2S, ADC, DAC, PWM, RTC/CLK, SWD/JTAG, TOUCH
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Boot Strapping Pin Alert (GPIO0, IO0, IO45, IO46): Do not force conflicting external pull-ups/pull-downs during POR reset.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol43 auto-grouped pins
OK
IPC-7351B Land Pattern51 pads · Pitch 1.50mm
OK
IPC-7525 60% Solder PasteEPAD 4.10×4.10mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (VFQFN-56-EP)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
31.00 × 18.00 mm
Height (A) & Pitch (e)IPC-7351B
A=3.30mm · e=1.50mm
Pad Size (W × L)Level B
1.00 × 1.80 mm
Pins / Total PadsTopology
43P / 51Pad (CASTELLATED_MODULE)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
C1, C2
BOM
22µF (or 10µF) X5R + 100nF X7R
0805 + 0402
3V3 supply decoupling for ~500mA Wi-Fi TX bursts — place closest to 3V3 pin; supply must deliver >= 600mA.
R_en + C_en
BOM
R = 10kΩ to 3V3 + C = 1µF to GND
0402 / 0603
Power-On Reset RC delay at EN (CHIP_PU) — 1µF capacitor at EN is REQUIRED for reliable cold boot.
R_boot + SW1
BOM
10kΩ Pull-up + BOOT button
0402 + SMD
Firmware boot-mode strap (IO0 on ESP32/S2/S3, IO9 on ESP32-C3) — on C3 pull IO8 high via 10kΩ for UART/USB download.
D_esd
BOM
USBLC6-2SC6 / LESD5D5.0CT1G
SOT-23-6 / SOD-523
ESD surge protection on USB D+/D- — place right next to USB Type-C connector before IO18/IO19/IO20.
ESP32-S3-MINI-1-N8 / 1U-N4R2
Espressif
100% Drop-inSame 15.4×15.4mm 65-pad footprint as ESP32-S2-MINI-2 — verify USB GPIO 19/20 pin mapping.

Technical Frequently Asked Questions (FAQ) — ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP)?

Manufactured by ESPRESSIF, the ESP32-S2-WROOM(M22S2H3200PS3Q0) is housed in a VFQFN-56-EP package with 43 pins and a 1.50 mm lead pitch, supporting a VCC supply range of 3.0 ~ 3.6 V. Key pins include: 1 (GPIO0: Multiplexed I/O & Peripheral Pin GPIO0 (General)), 2 (3V3: Power Supply Input (3V3 — 3.3V VDD3P3 (3.0V ~ 3.6V))), 3 (IO0: Multiplexed I/O & Peripheral Pin IO0 (RTC/CLK)), 4 (IO1: Multiplexed I/O & Peripheral Pin IO1 (RTC/CLK, TOUCH)), 5 (IO2: Multiplexed I/O & Peripheral Pin IO2 (RTC/CLK, TOUCH)), 6 (IO3: Multiplexed I/O & Peripheral Pin IO3 (RTC/CLK, TOUCH)).

What are the IPC-7351B PCB Footprint dimensions for ESP32-S2-WROOM(M22S2H3200PS3Q0)?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), ESP32-S2-WROOM(M22S2H3200PS3Q0) (VFQFN-56-EP) has a nominal body envelope of 18.00 × 31.00 mm, pitch e = 1.50 mm, and 51 copper pads plus a central exposed thermal pad (EPAD) of 4.10 × 4.10 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for ESP32-S2-WROOM(M22S2H3200PS3Q0)?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for ESP32-S2-WROOM(M22S2H3200PS3Q0) (ESPRESSIF, VFQFN-56-EP) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (43 pins) & ESP32-S2-WROOM Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1GPIO0Digital_IOSignal terminal GPIO0 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO0. Supported peripheral buses: General.
23V3Power_InPrimary positive power supply input (3V3) operating in the 3.3V VDD3P3 (3.0V ~ 3.6V) domain (Max rating: 3.6V).
3IO0Digital_IOSignal terminal IO0 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: IO0. Supported peripheral buses: RTC/CLK.
4IO1Digital_IOSignal terminal IO1 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO1. Supported peripheral buses: RTC/CLK, TOUCH.
5IO2Digital_IOSignal terminal IO2 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO2. Supported peripheral buses: RTC/CLK, TOUCH.
6IO3Digital_IOSignal terminal IO3 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO3. Supported peripheral buses: RTC/CLK, TOUCH.
7IO4Digital_IOSignal terminal IO4 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO4. Supported peripheral buses: RTC/CLK, TOUCH.
8IO5Digital_IOSignal terminal IO5 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO5. Supported peripheral buses: RTC/CLK, TOUCH.
9IO6Digital_IOSignal terminal IO6 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO6. Supported peripheral buses: RTC/CLK, TOUCH.
10IO7Digital_IOSignal terminal IO7 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO7. Supported peripheral buses: RTC/CLK, TOUCH.
11IO8Digital_IOSignal terminal IO8 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO8. Supported peripheral buses: RTC/CLK, TOUCH.
12IO9Digital_IOSignal terminal IO9 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO9, GPIO9. Supported peripheral buses: ADC, RTC/CLK, TOUCH.
13IO10Digital_IOSignal terminal IO10 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO10, GPIO10, TOUCH10. Supported peripheral buses: ADC, RTC/CLK, TOUCH.
14IO11Digital_IOSignal terminal IO11 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO11, GPIO11, TOUCH11. Supported peripheral buses: ADC, RTC/CLK, TOUCH.
15IO12Digital_IOSignal terminal IO12 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO12, GPIO12, TOUCH12. Supported peripheral buses: ADC, RTC/CLK, TOUCH.
16IO13Digital_IOSignal terminal IO13 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO13, GPIO13, TOUCH13. Supported peripheral buses: ADC, RTC/CLK, TOUCH.
17IO14Digital_IOSignal terminal IO14 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO14, GPIO14, TOUCH14. Supported peripheral buses: ADC, RTC/CLK, TOUCH.
18IO15Digital_IOSignal terminal IO15 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO15, GPIO15, U0RTS. Supported peripheral buses: ADC, RTC/CLK.
19IO16Digital_IOSignal terminal IO16 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO16, GPIO16, U0CTS. Supported peripheral buses: ADC, RTC/CLK.
20IO17Digital_IOSignal terminal IO17 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO17, GPIO17, U1TXD. Supported peripheral buses: UART, ADC, RTC/CLK.
21IO18Digital_IOSignal terminal IO18 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7. Supported peripheral buses: UART, ADC, DAC, RTC/CLK.
22IO19Digital_IOSignal terminal IO19 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8. Supported peripheral buses: ADC, RTC/CLK.
23IO20Digital_IOSignal terminal IO20 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1. Supported peripheral buses: USB, ADC, RTC/CLK.
24IO21Digital_IOSignal terminal IO21 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: IO21. Supported peripheral buses: RTC/CLK.
25IO26Digital_IOSignal terminal IO26 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: SPICS1, GPIO26. Supported peripheral buses: SPI.
26GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
27IO33Digital_IOSignal terminal IO33 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: SPIIO4, GPIO33, FSPIHD. Supported peripheral buses: SPI.
28IO34Digital_IOSignal terminal IO34 (I, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: SPIIO5, GPIO34, FSPICS0. Supported peripheral buses: SPI.
29IO35Digital_IOSignal terminal IO35 (I, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: SPIIO6, GPIO35, FSPID. Supported peripheral buses: SPI.
30IO36Digital_IOSignal terminal IO36 (I, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: SPIIO7, GPIO36, FSPICLK. Supported peripheral buses: SPI.
31IO37Digital_IOSignal terminal IO37 (I, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: SPIDQS, GPIO37, FSPIQ. Supported peripheral buses: SPI.
32IO38Digital_IOSignal terminal IO38 (I, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO38, FSPIWP. Supported peripheral buses: SPI.
33IO39Digital_IOSignal terminal IO39 (I, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: MTCK, GPIO39, CLK_OUT3. Supported peripheral buses: SWD/JTAG.
34IO40Digital_IOSignal terminal IO40 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: MTDO, GPIO40, CLK_OUT2. Supported peripheral buses: SWD/JTAG.
35IO41Digital_IOSignal terminal IO41 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: MTDI, GPIO41, CLK_OUT1. Supported peripheral buses: SWD/JTAG.
36IO42Digital_IOSignal terminal IO42 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: MTMS, GPIO42. Supported peripheral buses: SWD/JTAG.
37TXD0Digital_IOSignal terminal TXD0 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: U0TXD, GPIO43, CLK_OUT1. Supported peripheral buses: UART.
38RXD0Digital_IOSignal terminal RXD0 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: U0RXD, GPIO44, CLK_OUT2. Supported peripheral buses: UART.
39IO45Digital_IOSignal terminal IO45 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO45. Supported peripheral buses: General.
40IO46Digital_IOSignal terminal IO46 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO46. Supported peripheral buses: General.
41ENDigital_IOChip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
42GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
43EPGNDBottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.