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STM32WL33KCV6 (VFQFPN-32-EP(5x5)) — Symbol, Footprint IPC-7351B & 3D STEP Model

STM32WL33KCV6

STVFQFPN-32-EP(5x5) · 33 Pins · Pitch 0.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · STM32WL33KCV6 (VFQFPN-32-EP(5x5))1PA22PA33VDD_14PA05PA116PA107PA98PA89PB610PB1211PB1312PB1413PB1514RXLPAWUR15RX16EXTGND17TX_HP33EP32PB231PB130PB029VCAP28VFBSD27VSSSD26VLXSD25VDDSD24NRST23PB722PA121OSCIN20OSCOUT19VDDRF18TXGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.827.922.917.812.77.62.5-2.5-7.6-12.7-17.8-22.9-27.9mm
2. 2D FOOTPRINT
123456789101112131415161718192021222324252627282930313233E=5.00mm · Pitch e=0.50mmD=5.00mm-5-4-3-2-1012345543210-1-2-3-4-5mm
3. 3D CAD MODEL
Package Body: 5.00mm × 5.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (33/33)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1PA2I/OMultiplexed I/O & Peripheral Pin PA2 (General)
2PA3I/OMultiplexed I/O & Peripheral Pin PA3 (General)
3VDD_1PowerPower Supply Input (VDD_1 — 3.3V VDD (Max 4.0V))
4PA0I/OMultiplexed I/O & Peripheral Pin PA0 (General)
5PA11I/OMultiplexed I/O & Peripheral Pin PA11 (General)
6PA10I/OMultiplexed I/O & Peripheral Pin PA10 (General)
7PA9I/OMultiplexed I/O & Peripheral Pin PA9 (General)
8PA8I/OMultiplexed I/O & Peripheral Pin PA8 (General)
9PB6I/OMultiplexed I/O & Peripheral Pin PB6 (General)
10PB12I/OMultiplexed I/O & Peripheral Pin PB12 (General)
11PB13I/OMultiplexed I/O & Peripheral Pin PB13 (General)
12PB14I/OMultiplexed I/O & Peripheral Pin PB14 (General)
13PB15I/OMultiplexed I/O & Peripheral Pin PB15 (General)
14RXLPAWURI/OMultiplexed I/O & Peripheral Pin RXLPAWUR (General)
15RXI/OMultiplexed I/O & Peripheral Pin RX (General)
16EXTGNDGNDGround Reference Pin (EXTGND)
17TX_HPI/OMultiplexed I/O & Peripheral Pin TX_HP (General)
18TXI/OMultiplexed I/O & Peripheral Pin TX (General)
19VDDRFPowerPower Supply Input (VDDRF — 3.3V VDD (Max 4.0V))
20OSCOUTI/OMultiplexed I/O & Peripheral Pin OSCOUT (RTC/CLK)
21OSCINI/OMultiplexed I/O & Peripheral Pin OSCIN (RTC/CLK)
22PA1I/OMultiplexed I/O & Peripheral Pin PA1 (General)
23PB7I/OMultiplexed I/O & Peripheral Pin PB7 (General)
24NRSTISystem Enable & Hardware Reset (NRST)
25VDDSDPowerPower Supply Input (VDDSD — 3.3V VDD (Max 4.0V))
26VLXSDI/OMultiplexed I/O & Peripheral Pin VLXSD (General)
27VSSSDGNDGround Reference Pin (VSSSD)
28VFBSDI/OMultiplexed I/O & Peripheral Pin VFBSD (General)
29VCAPI/OMultiplexed I/O & Peripheral Pin VCAP (General)
30PB0I/OMultiplexed I/O & Peripheral Pin PB0 (General)
31PB1I/OMultiplexed I/O & Peripheral Pin PB1 (General)
32PB2I/OMultiplexed I/O & Peripheral Pin PB2 (General)
33EPGNDExposed Thermal & Ground Pad (EP)
PIN 1 PA2
I/O
Multiplexed I/O & Peripheral Pin PA2 (General)
Design note: Signal terminal PA2 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA2. Supported peripheral buses: General.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 10 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: STM32WL33KCV6 (ST · VFQFPN-32-EP(5x5))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) - 2. Standard Pinout (Top View)
True package pinout (33 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) - 4. Package Dimensions (D×E×A)
VFQFPN-32-EP(5x5) · 5.00×5.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) - 5. Recommended Land Pattern
IPC-7351B Footprint (33 Pads)Expand ›
6. Application SchematicSCHEMATIC
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (10 figures · Page 1/1)
Showing 1–10 of 10 uncropped original figures for STM32WL33
P1 · p01_fig02EXACT PACKAGE
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) — VFQFPN32 (5 x 5 mm)
VFQFPN32 (5 x 5 mm)
P31 · p31_fig01EXACT PACKAGE
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) — Figure 9. Pinout top view (QFN32 package - 5 mm x 5 mm)
Figure 9. Pinout top view (QFN32 package - 5 mm x 5 mm)
P80 · p80_fig01EXACT PACKAGE
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) — Figure 21. VFQFPN32 - Outline
Figure 21. VFQFPN32 - Outline
P81 · p81_fig01EXACT PACKAGE
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) — A1 0 - 0.05 0 - 0.0020
A1 0 - 0.05 0 - 0.0020
P81 · p81_fig02EXACT PACKAGE
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) — Figure 22. VFQFPN32 - Footprint example
Figure 22. VFQFPN32 - Footprint example
P1 · p01_fig01308×216px
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) — VFQFPN48 (6 x 6 mm)
VFQFPN48 (6 x 6 mm)
P31 · p31_fig021044×821px
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) — Figure 10. Pinout top view (VFQFPN48 package - 6 mm x 6 mm)
Figure 10. Pinout top view (VFQFPN48 package - 6 mm x 6 mm)
P36 · p36_fig011878×1244px
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) — Figure 11. STM32WL33xx application circuit without SMPS, VFQFPN48 package
Figure 11. STM32WL33xx application circuit without SMPS, VFQFPN48 package
P37 · p37_fig011857×1428px
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) — Figure 12. STM32WL33xx application circuit with SMPS, VFQFPN48 package
Figure 12. STM32WL33xx application circuit with SMPS, VFQFPN48 package
P76 · p76_fig011059×1796px
STM32WL33KCV6 (VFQFPN-32-EP(5x5)) — Figure 19. VFQFPN48 - Outline
Figure 19. VFQFPN48 - Outline

Technical Specifications & Part Details (STM32WL33KCV6)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Embedded Microcontroller Unit (MCU)
Detailed Overview:STM32WL33KCV6 (VFQFPN-32-EP(5x5)) is a 32-pin embedded microcontroller unit (mcu) featuring a 5.00 × 5.00 × 0.85 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 3.0V ~ 3.6V (Typ 3.3V) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated UART, SPI, I2C, I2S, ADC, DAC, JTAG / SWD, IrDA, RTC/CLK interfaces.
Operating Supply VoltageV_CC / V_DD
3.0V ~ 3.6V (Typ 3.3V)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
1GHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
5.00 × 5.00 × 0.85 mm (A1=0.05 mm)
Package family: QFN (VFQFPN-32-EP(5x5))
Pin Count & Lead PitchN / e
32 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
UART, SPI, I2C, I2S, ADC, DAC, JTAG / SWD, IrDA, RTC/CLK
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol33 auto-grouped pins
OK
IPC-7351B Land Pattern33 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteEPAD 3.80×3.80mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (VFQFPN-32-EP(5x5))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
5.00 × 5.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.85mm · e=0.50mm
Pad Size (W × L)Level B
0.29 × 0.80 mm
Pins / Total PadsTopology
33P / 33Pad (QUAD_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
VFQFPN-32-EP(5x5)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — STM32WL33KCV6 (VFQFPN-32-EP(5x5))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of STM32WL33KCV6 (VFQFPN-32-EP(5x5))?

Manufactured by ST, the STM32WL33KCV6 is housed in a VFQFPN-32-EP(5x5) package with 33 pins and a 0.50 mm lead pitch. Key pins include: 1 (PA2: Multiplexed I/O & Peripheral Pin PA2 (General)), 2 (PA3: Multiplexed I/O & Peripheral Pin PA3 (General)), 3 (VDD_1: Power Supply Input (VDD_1 — 3.3V VDD (Max 4.0V))), 4 (PA0: Multiplexed I/O & Peripheral Pin PA0 (General)), 5 (PA11: Multiplexed I/O & Peripheral Pin PA11 (General)), 6 (PA10: Multiplexed I/O & Peripheral Pin PA10 (General)).

What are the IPC-7351B PCB Footprint dimensions for STM32WL33KCV6?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), STM32WL33KCV6 (VFQFPN-32-EP(5x5)) has a nominal body envelope of 5.00 × 5.00 mm, pitch e = 0.50 mm, and 33 copper pads plus a central exposed thermal pad (EPAD) of 3.80 × 3.80 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for STM32WL33KCV6?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for STM32WL33KCV6 (ST, VFQFPN-32-EP(5x5)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (33 pins) & STM32WL33 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1PA2Digital_IOSignal terminal PA2 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA2. Supported peripheral buses: General.
2PA3Digital_IOSignal terminal PA3 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA3. Supported peripheral buses: General.
3VDD_1Power_InPrimary positive power supply input (VDD_1) operating in the 3.3V VDD (Max 4.0V) domain (Max rating: 4.0V).
4PA0Digital_IOSignal terminal PA0 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA0. Supported peripheral buses: General.
5PA11Digital_IOSignal terminal PA11 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA11. Supported peripheral buses: General.
6PA10Digital_IOSignal terminal PA10 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA10. Supported peripheral buses: General.
7PA9Digital_IOSignal terminal PA9 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA9. Supported peripheral buses: General.
8PA8Digital_IOSignal terminal PA8 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA8. Supported peripheral buses: General.
9PB6Digital_IOSignal terminal PB6 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB6. Supported peripheral buses: General.
10PB12Digital_IOSignal terminal PB12 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB12. Supported peripheral buses: General.
11PB13Digital_IOSignal terminal PB13 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB13. Supported peripheral buses: General.
12PB14Digital_IOSignal terminal PB14 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB14. Supported peripheral buses: General.
13PB15Digital_IOSignal terminal PB15 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB15. Supported peripheral buses: General.
14RXLPAWURDigital_IOSignal terminal RXLPAWUR (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: RXLPAWUR. Supported peripheral buses: General.
15RXDigital_IOSignal terminal RX (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: RX. Supported peripheral buses: General.
16EXTGNDGND0V electrical ground return terminal (EXTGND) for internal core logic, I/O drivers, and analog sub-blocks.
17TX_HPDigital_IOSignal terminal TX_HP (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: TX_HP. Supported peripheral buses: General.
18TXDigital_IOSignal terminal TX (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: TX. Supported peripheral buses: General.
19VDDRFPower_InPrimary positive power supply input (VDDRF) operating in the 3.3V VDD (Max 4.0V) domain (Max rating: 4.0V).
20OSCOUTDigital_IOSignal terminal OSCOUT (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: OSCOUT. Supported peripheral buses: RTC/CLK.
21OSCINDigital_IOSignal terminal OSCIN (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: OSCIN. Supported peripheral buses: RTC/CLK.
22PA1Digital_IOSignal terminal PA1 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA1. Supported peripheral buses: General.
23PB7Digital_IOSignal terminal PB7 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB7. Supported peripheral buses: General.
24NRSTDigital_IOActive-low hardware reset terminal (NRST): pulling this pin Low resets the processor core and peripherals.
25VDDSDPower_InPrimary positive power supply input (VDDSD) operating in the 3.3V VDD (Max 4.0V) domain (Max rating: 4.0V).
26VLXSDDigital_IOSignal terminal VLXSD (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: VLXSD. Supported peripheral buses: General.
27VSSSDGND0V electrical ground return terminal (VSSSD) for internal core logic, I/O drivers, and analog sub-blocks.
28VFBSDDigital_IOSignal terminal VFBSD (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: VFBSD. Supported peripheral buses: General.
29VCAPDigital_IOSignal terminal VCAP (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: VCAP. Supported peripheral buses: General.
30PB0Digital_IOSignal terminal PB0 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB0. Supported peripheral buses: General.
31PB1Digital_IOSignal terminal PB1 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB1. Supported peripheral buses: General.
32PB2Digital_IOSignal terminal PB2 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB2. Supported peripheral buses: General.
33EPGNDBottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.
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