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W25Q64JVSSIQ (SOIC-8-208mil) — Symbol, Footprint IPC-7351B & 3D STEP Model

W25Q64JVSSIQ

WinbondID: C83140SOIC-8-208mil · 8 Pins · Pitch 1.27mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · W25Q64JVSSIQ (SOIC-8-208mil)1/CS2DO(IO1)3IO24GND8VCC7IO36CLK5DI(IO0)Grid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.810.25.10-5.1-10.2mm
2. 2D FOOTPRINT
12345678E=5.30mm · Pitch e=1.27mmD=5.30mm-6-5-4-3-2-10123456543210-1-2-3-4-5mm
3. 3D CAD MODEL
Package Body: 5.30mm × 5.30mm · Pitch: 1.27mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (8/8)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1/CSI/OMultiplexed I/O & Peripheral Pin /CS (General)
2DO(IO1)I/OMultiplexed I/O & Peripheral Pin DO(IO1) (General)
3IO2I/OMultiplexed I/O & Peripheral Pin IO2 (General)
4GNDGNDGround Reference Pin (GND)
5DI(IO0)I/OMultiplexed I/O & Peripheral Pin DI(IO0) (General)
6CLKI/OMultiplexed I/O & Peripheral Pin CLK (General)
7IO3I/OMultiplexed I/O & Peripheral Pin IO3 (General)
8VCCPowerPower Supply Input (VCC — 3.3V / 5.0V Standard Logic)
PIN 1 /CS
I/O
Multiplexed I/O & Peripheral Pin /CS (General)
Design note: ChipSelectInput
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 18 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: W25Q64JVSSIQ (Winbond · SOIC-8-208mil)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
W25Q64JVSSIQ (SOIC-8-208mil) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
W25Q64JVSSIQ (SOIC-8-208mil) - 2. Standard Pinout (Top View)
True package pinout (8 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
W25Q64JVSSIQ (SOIC-8-208mil) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
W25Q64JVSSIQ (SOIC-8-208mil) - 4. Package Dimensions (D×E×A)
SOIC-8-208mil · 5.30×5.30mm · Pitch 1.27mmExpand ›
5. Recommended Land PatternLAND PATTERN
W25Q64JVSSIQ (SOIC-8-208mil) - 5. Recommended Land Pattern
IPC-7351B Footprint (8 Pads)Expand ›
6. Application SchematicSCHEMATIC
W25Q64JVSSIQ (SOIC-8-208mil) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (18 figures · Page 1/2)
Showing 1–12 of 18 uncropped original figures for W25Q64JVSSIQ
P6 · p06_fig01EXACT PACKAGE
W25Q64JVSSIQ (SOIC-8-208mil) — Figure 1a. W25Q64JV Pin Assignments, 8-pin SOIC / VSOP 208-mil (Package Code SS / ST)
Figure 1a. W25Q64JV Pin Assignments, 8-pin SOIC / VSOP 208-mil (Package Code SS / ST)
P1 · p01_fig011041×232px
W25Q64JVSSIQ (SOIC-8-208mil) — 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI
3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI
P6 · p06_fig01P6
W25Q64JVSSIQ (SOIC-8-208mil) — Datasheet Page 6 (p06_fig01)
Datasheet Page 6 (p06_fig01)
P66 · p66_fig01986×1534px
W25Q64JVSSIQ (SOIC-8-208mil) — Millimeters Inches
Millimeters Inches
P66 · p66_fig02659×538px
W25Q64JVSSIQ (SOIC-8-208mil) — θ
θ
P66 · p66_fig03655×653px
W25Q64JVSSIQ (SOIC-8-208mil) — θ
θ
P67 · p67_fig01630×536px
W25Q64JVSSIQ (SOIC-8-208mil) — θ GAGE PLANE i 4 X ° L 5 DETAIL"A”
θ GAGE PLANE i 4 X ° L 5 DETAIL"A”
P67 · p67_fig02510×388px
W25Q64JVSSIQ (SOIC-8-208mil) — PIN 1 a
PIN 1 a
P67 · p67_fig03577×546px
W25Q64JVSSIQ (SOIC-8-208mil) — Millimeters Inches
Millimeters Inches
P67 · p67_fig04879×493px
W25Q64JVSSIQ (SOIC-8-208mil) — Millimeters Inches
Millimeters Inches
P71 · p71_fig02675×620px
W25Q64JVSSIQ (SOIC-8-208mil) — % w im 5 DETAIL A
% w im 5 DETAIL A
P71 · p71_fig031033×560px
W25Q64JVSSIQ (SOIC-8-208mil) — Symbol Millimeters Inches Min Nom Max Min Nom Max
Symbol Millimeters Inches Min Nom Max Min Nom Max
Page 1 / 2 (18 extracted figures)

Technical Specifications & Part Details (W25Q64JVSSIQ)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:W25Q64JVSSIQ (SOIC-8-208mil) is a 8-pin standard electronic & interconnect component featuring a 5.30 × 5.30 × 1.90 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated SPI interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
5.30 × 5.30 × 1.90 mm (A1=0.15 mm)
Package family: SOIC (SOIC-8-208mil)
Pin Count & Lead PitchN / e
8 Pins | Pitch e = 1.27 mm (50.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
SPI
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol8 auto-grouped pins
OK
IPC-7351B Land Pattern8 pads · Pitch 1.27mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOIC-8-208mil)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
5.30 × 5.30 mm
Height (A) & Pitch (e)IPC-7351B
A=1.90mm · e=1.27mm
Pad Size (W × L)Level B
0.60 × 1.95 mm
Pins / Total PadsTopology
8P / 8Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SOIC-8-208mil
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — W25Q64JVSSIQ (SOIC-8-208mil)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of W25Q64JVSSIQ (SOIC-8-208mil)?

Manufactured by Winbond, the W25Q64JVSSIQ is housed in a SOIC-8-208mil package with 8 pins and a 1.27 mm lead pitch. Key pins include: 1 (/CS: Multiplexed I/O & Peripheral Pin /CS (General)), 2 (DO(IO1): Multiplexed I/O & Peripheral Pin DO(IO1) (General)), 3 (IO2: Multiplexed I/O & Peripheral Pin IO2 (General)), 4 (GND: Ground Reference Pin (GND)), 5 (DI(IO0): Multiplexed I/O & Peripheral Pin DI(IO0) (General)), 6 (CLK: Multiplexed I/O & Peripheral Pin CLK (General)).

What are the IPC-7351B PCB Footprint dimensions for W25Q64JVSSIQ?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), W25Q64JVSSIQ (SOIC-8-208mil) has a nominal body envelope of 5.30 × 5.30 mm, pitch e = 1.27 mm, and 8 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for W25Q64JVSSIQ?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for W25Q64JVSSIQ (Winbond, SOIC-8-208mil) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (8 pins) & W25Q64JVSSIQ Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1/CSDigital_IOSignal terminal /CS (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: /CS. Supported peripheral buses: General.
2DO(IO1)Digital_IOSignal terminal DO(IO1) (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DO(IO1). Supported peripheral buses: General.
3IO2Digital_IOSignal terminal IO2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: IO2. Supported peripheral buses: General.
4GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
5DI(IO0)Digital_IOSignal terminal DI(IO0) (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DI(IO0). Supported peripheral buses: General.
6CLKDigital_IOSignal terminal CLK (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: CLK. Supported peripheral buses: General.
7IO3Digital_IOSignal terminal IO3 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: IO3. Supported peripheral buses: General.
8VCCPower_InPrimary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
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