ESP32-MINI-1U-H4 (SMD-55P) — Symbol, Footprint IPC-7351B & 3D STEP Model

ESP32-MINI-1U-H4

ESPRESSIFID: C7274970SMD-55P · 55 Pins · Pitch 0.80mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · ESP32-MINI-1U-H4 (SMD-55P)1MTDO2GND33V34I365I376I387I398EN9I3410I3511IO3212IO3313IO2514IO2615IO2716IO1417IO1218IO1319IO1520IO221IO022IO423NC24NC25IO926IO1027GND28NC55GND54GND53GND52GND51GND50GND49GND48GND47GND46GND45GND44GND43GND42GND41GND40GND39GND38GND37NC36TXD035RXD034IO2133IO2232IO1931IO2330IO1829IO5Grid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.840.635.630.525.420.315.210.25.10-5.1-10.2-15.2-20.3-25.4-30.5-35.6-40.6mm
2. 2D FOOTPRINT
5555555555555555545352515049484746454443424140393837363534333231302928272625242322212019181716151413121110987654321E=13.20mm · Pitch e=0.80mmD=13.50mm-10-8-6-4-202468101086420-2-4-6-8-10mm
3. 3D CAD MODEL
Package Body: 13.20mm × 13.50mm · Pitch: 0.80mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (55/55)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1MTDOI/OMultiplexed I/O & Peripheral Pin MTDO (SWD/JTAG)
2GNDGNDGround Reference Pin (GND)
33V3PowerPower Supply Input (3V3 — 3.3V VDD3P3 (3.0V ~ 3.6V))
4I36I/OMultiplexed I/O & Peripheral Pin I36 (ADC, RTC/CLK)
5I37I/OMultiplexed I/O & Peripheral Pin I37 (ADC, RTC/CLK)
6I38I/OMultiplexed I/O & Peripheral Pin I38 (ADC, RTC/CLK)
7I39I/OMultiplexed I/O & Peripheral Pin I39 (ADC, RTC/CLK)
8ENISystem Enable & Hardware Reset (EN)
9I34I/OMultiplexed I/O & Peripheral Pin I34 (ADC, RTC/CLK)
10I35I/OMultiplexed I/O & Peripheral Pin I35 (ADC, RTC/CLK)
11IO32I/OMultiplexed I/O & Peripheral Pin IO32 (ADC, RTC/CLK, TOUCH)
12IO33I/OMultiplexed I/O & Peripheral Pin IO33 (ADC, RTC/CLK, TOUCH)
13IO25I/OMultiplexed I/O & Peripheral Pin IO25 (UART, ADC, DAC, RTC/CLK)
14IO26I/OMultiplexed I/O & Peripheral Pin IO26 (UART, ADC, DAC, RTC/CLK)
15IO27I/OMultiplexed I/O & Peripheral Pin IO27 (ADC, RTC/CLK, TOUCH)
16IO14I/OMultiplexed I/O & Peripheral Pin IO14 (ADC, SWD/JTAG, RTC/CLK, TOUCH)
17IO12I/OMultiplexed I/O & Peripheral Pin IO12 (ADC, SWD/JTAG, RTC/CLK, TOUCH)
18IO13I/OMultiplexed I/O & Peripheral Pin IO13 (ADC, SWD/JTAG, RTC/CLK, TOUCH)
19IO15I/OMultiplexed I/O & Peripheral Pin IO15 (ADC, SWD/JTAG, RTC/CLK, TOUCH)
20IO2I/OMultiplexed I/O & Peripheral Pin IO2 (ADC, RTC/CLK, TOUCH)
21IO0I/OMultiplexed I/O & Peripheral Pin IO0 (ADC, RTC/CLK, TOUCH)
22IO4I/OMultiplexed I/O & Peripheral Pin IO4 (ADC, RTC/CLK, TOUCH)
23NCI/OMultiplexed I/O & Peripheral Pin NC (General)
24NCI/OMultiplexed I/O & Peripheral Pin NC (General)
25IO9I/OMultiplexed I/O & Peripheral Pin IO9 (UART)
26IO10I/OMultiplexed I/O & Peripheral Pin IO10 (UART)
27GNDGNDGround Reference Pin (GND)
28NCI/OMultiplexed I/O & Peripheral Pin NC (General)
29IO5I/OMultiplexed I/O & Peripheral Pin IO5 (General)
30IO18I/OMultiplexed I/O & Peripheral Pin IO18 (General)
31IO23I/OMultiplexed I/O & Peripheral Pin IO23 (General)
32IO19I/OMultiplexed I/O & Peripheral Pin IO19 (UART)
33IO22I/OMultiplexed I/O & Peripheral Pin IO22 (UART)
34IO21I/OMultiplexed I/O & Peripheral Pin IO21 (General)
35RXD0I/OMultiplexed I/O & Peripheral Pin RXD0 (UART)
36TXD0I/OMultiplexed I/O & Peripheral Pin TXD0 (UART)
37NCI/OMultiplexed I/O & Peripheral Pin NC (General)
38GNDGNDGround Reference Pin (GND)
39GNDGNDExposed Thermal & Ground Pad (GND)
40GNDGNDGround Reference Pin (GND)
41GNDGNDGround Reference Pin (GND)
42GNDGNDGround Reference Pin (GND)
43GNDGNDGround Reference Pin (GND)
44GNDGNDGround Reference Pin (GND)
45GNDGNDGround Reference Pin (GND)
46GNDGNDGround Reference Pin (GND)
47GNDGNDGround Reference Pin (GND)
48GNDGNDGround Reference Pin (GND)
49GNDGNDExposed Thermal & Ground Pad (GND)
50GNDGNDGround Reference Pin (GND)
51GNDGNDGround Reference Pin (GND)
52GNDGNDGround Reference Pin (GND)
53GNDGNDGround Reference Pin (GND)
54GNDGNDGround Reference Pin (GND)
55GNDGNDGround Reference Pin (GND)
PIN 1 MTDO
I/O
Multiplexed I/O & Peripheral Pin MTDO (SWD/JTAG)
Design note: Pull -up
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 20 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: ESP32-MINI-1U-H4 (ESPRESSIF · SMD-55P)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
ESP32-MINI-1U-H4 (SMD-55P) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
ESP32-MINI-1U-H4 (SMD-55P) - 2. Standard Pinout (Top View)
True package pinout (55 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
ESP32-MINI-1U-H4 (SMD-55P) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
ESP32-MINI-1U-H4 (SMD-55P) - 4. Package Dimensions (D×E×A)
SMD-55P · 13.20×13.50mm · Pitch 0.80mmExpand ›
5. Recommended Land PatternLAND PATTERN
ESP32-MINI-1U-H4 (SMD-55P) - 5. Recommended Land Pattern
IPC-7351B Footprint (62 Pads)Expand ›
6. Application SchematicSCHEMATIC
ESP32-MINI-1U-H4 (SMD-55P) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (20 figures · Page 1/2)
Showing 1–12 of 20 uncropped original figures for ESP32-MINI
P1 · p01_fig01EXACT PACKAGE
ESP32-MINI-1U-H4 (SMD-55P) — ESP32-MINI-1 ESP32-MINI-1U
ESP32-MINI-1 ESP32-MINI-1U
P1 · p01_fig02EXACT PACKAGE
ESP32-MINI-1U-H4 (SMD-55P) — ESP32-MINI-1 ESP32-MINI-1U
ESP32-MINI-1 ESP32-MINI-1U
P10 · p10_fig01EXACT PACKAGE
ESP32-MINI-1U-H4 (SMD-55P) — Figure 4: ESP32-MINI-1U Pin Layout (Top View)
Figure 4: ESP32-MINI-1U Pin Layout (Top View)
P23 · p23_fig01EXACT PACKAGE
ESP32-MINI-1U-H4 (SMD-55P) — Figure 7: ESP32-MINI-1U Schematics
Figure 7: ESP32-MINI-1U Schematics
P23 · p23_fig02EXACT PACKAGE
ESP32-MINI-1U-H4 (SMD-55P) — R3 499
R3 499
P23 · p23_fig03EXACT PACKAGE
ESP32-MINI-1U-H4 (SMD-55P) — Figure 7: ESP32-MINI-1U Schematics
Figure 7: ESP32-MINI-1U Schematics
P24 · p24_fig01EXACT PACKAGE
ESP32-MINI-1U-H4 (SMD-55P) — Figure 8: Peripheral Schematics
Figure 8: Peripheral Schematics
P25 · p25_fig03EXACT PACKAGE
ESP32-MINI-1U-H4 (SMD-55P) — Figure 10: ESP32-MINI-1U Physical Dimensions
Figure 10: ESP32-MINI-1U Physical Dimensions
P1 · p01_fig03722×314px
ESP32-MINI-1U-H4 (SMD-55P) — www.espressif.com
www.espressif.com
P1 · p01_fig02P1
ESP32-MINI-1U-H4 (SMD-55P) — Datasheet Page 1 (p01_fig02)
Datasheet Page 1 (p01_fig02)
P24 · p24_fig01P24
ESP32-MINI-1U-H4 (SMD-55P) — Datasheet Page 24 (p24_fig01)
Datasheet Page 24 (p24_fig01)
P25 · p25_fig03P25
ESP32-MINI-1U-H4 (SMD-55P) — Datasheet Page 25 (p25_fig03)
Datasheet Page 25 (p25_fig03)
Page 1 / 2 (20 extracted figures)

Technical Specifications & Part Details (ESP32-MINI-1U-H4)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Wireless Wi-Fi / Bluetooth LE SoC Module
Detailed Overview:ESP32-MINI-1U-H4 (SMD-55P) is a 55-pin wireless wi-fi / bluetooth le soc module featuring a 13.50 × 13.20 × 2.40 mm mechanical envelope (lead pitch e = 0.80 mm). Rated for 3.0 ~ 3.6 V supply operation across 85 °C – 105 °C with integrated Wi-Fi, Bluetooth / BLE, UART, SPI, I2C, I2S, ADC, DAC, PWM, SDIO, RTC/CLK, SWD/JTAG, TOUCH interfaces.
Operating Supply VoltageV_CC / V_DD
3.0 ~ 3.6 V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
85 °C – 105 °C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
2.4 GHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_TX(peak) ≈ 310 mA @ 3.3V | Deep-Sleep ≈ 10 µA | I_GPIO(max) = 40 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
13.50 × 13.20 × 2.40 mm (A1=0.00 mm)
Package family: CASTELLATED_MODULE (SMD-55P)
Pin Count & Lead PitchN / e
55 Pins | Pitch e = 0.80 mm (31.5 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Wi-Fi, Bluetooth / BLE, UART, SPI, I2C, I2S, ADC, DAC, PWM, SDIO, RTC/CLK, SWD/JTAG, TOUCH
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Boot Strapping Pin Alert (MTDO, IO0): Do not force conflicting external pull-ups/pull-downs during POR reset.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol55 auto-grouped pins
OK
IPC-7351B Land Pattern62 pads · Pitch 0.80mm
OK
IPC-7525 60% Solder PasteEPAD 4.00×4.00mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SMD-55P)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
13.50 × 13.20 mm
Height (A) & Pitch (e)IPC-7351B
A=2.40mm · e=0.80mm
Pad Size (W × L)Level B
0.40 × 0.80 mm
Pins / Total PadsTopology
55P / 62Pad (CASTELLATED_MODULE)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
C1, C2
BOM
22µF (or 10µF) X5R + 100nF X7R
0805 + 0402
3V3 supply decoupling for ~500mA Wi-Fi TX bursts — place closest to 3V3 pin; supply must deliver >= 600mA.
R_en + C_en
BOM
R = 10kΩ to 3V3 + C = 1µF to GND
0402 / 0603
Power-On Reset RC delay at EN (CHIP_PU) — 1µF capacitor at EN is REQUIRED for reliable cold boot.
R_boot + SW1
BOM
10kΩ Pull-up + BOOT button
0402 + SMD
Firmware boot-mode strap (IO0 on ESP32/S2/S3, IO9 on ESP32-C3) — on C3 pull IO8 high via 10kΩ for UART/USB download.
D_esd
BOM
USBLC6-2SC6 / LESD5D5.0CT1G
SOT-23-6 / SOD-523
ESD surge protection on USB D+/D- — place right next to USB Type-C connector before IO18/IO19/IO20.
ESP32-S3-MINI-1-N8 / 1U-N4R2
Espressif
100% Drop-inSame 15.4×15.4mm 65-pad footprint as ESP32-S2-MINI-2 — verify USB GPIO 19/20 pin mapping.

Technical Frequently Asked Questions (FAQ) — ESP32-MINI-1U-H4 (SMD-55P)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of ESP32-MINI-1U-H4 (SMD-55P)?

Manufactured by ESPRESSIF, the ESP32-MINI-1U-H4 is housed in a SMD-55P package with 55 pins and a 0.80 mm lead pitch, supporting a VCC supply range of 3.0 ~ 3.6 V. Key pins include: 1 (MTDO: Multiplexed I/O & Peripheral Pin MTDO (SWD/JTAG)), 2 (GND: Ground Reference Pin (GND)), 3 (3V3: Power Supply Input (3V3 — 3.3V VDD3P3 (3.0V ~ 3.6V))), 4 (I36: Multiplexed I/O & Peripheral Pin I36 (ADC, RTC/CLK)), 5 (I37: Multiplexed I/O & Peripheral Pin I37 (ADC, RTC/CLK)), 6 (I38: Multiplexed I/O & Peripheral Pin I38 (ADC, RTC/CLK)).

What are the IPC-7351B PCB Footprint dimensions for ESP32-MINI-1U-H4?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), ESP32-MINI-1U-H4 (SMD-55P) has a nominal body envelope of 13.20 × 13.50 mm, pitch e = 0.80 mm, and 62 copper pads plus a central exposed thermal pad (EPAD) of 4.00 × 4.00 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for ESP32-MINI-1U-H4?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for ESP32-MINI-1U-H4 (ESPRESSIF, SMD-55P) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (55 pins) & ESP32-MINI Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1MTDODigital_IOSignal terminal MTDO (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: MTDO. Supported peripheral buses: SWD/JTAG.
2GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
33V3Power_InPrimary positive power supply input (3V3) operating in the 3.3V VDD3P3 (3.0V ~ 3.6V) domain (Max rating: 3.6V).
4I36Digital_IOSignal terminal I36 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO36, ADC1_CH0, RTC_GPIO0. Supported peripheral buses: ADC, RTC/CLK.
5I37Digital_IOSignal terminal I37 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO37, ADC1_CH1, RTC_GPIO1. Supported peripheral buses: ADC, RTC/CLK.
6I38Digital_IOSignal terminal I38 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO38, ADC1_CH2, RTC_GPIO2. Supported peripheral buses: ADC, RTC/CLK.
7I39Digital_IOSignal terminal I39 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO39, ADC1_CH3, RTC_GPIO3. Supported peripheral buses: ADC, RTC/CLK.
8ENDigital_IOChip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
9I34Digital_IOSignal terminal I34 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO34, ADC1_CH6, RTC_GPIO4. Supported peripheral buses: ADC, RTC/CLK.
10I35Digital_IOSignal terminal I35 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO35, ADC1_CH7, RTC_GPIO5. Supported peripheral buses: ADC, RTC/CLK.
11IO32Digital_IOSignal terminal IO32 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO32, ADC1_CH4, TOUCH9, RTC_GPIO9. Supported peripheral buses: ADC, RTC/CLK, TOUCH.
12IO33Digital_IOSignal terminal IO33 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO33, ADC1_CH5, TOUCH8, RTC_GPIO8. Supported peripheral buses: ADC, RTC/CLK, TOUCH.
13IO25Digital_IOSignal terminal IO25 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO25, ADC2_CH8, RTC_GPIO6. Supported peripheral buses: UART, ADC, DAC, RTC/CLK.
14IO26Digital_IOSignal terminal IO26 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO26, ADC2_CH9, RTC_GPIO7. Supported peripheral buses: UART, ADC, DAC, RTC/CLK.
15IO27Digital_IOSignal terminal IO27 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17. Supported peripheral buses: ADC, RTC/CLK, TOUCH.
16IO14Digital_IOSignal terminal IO14 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS. Supported peripheral buses: ADC, SWD/JTAG, RTC/CLK, TOUCH.
17IO12Digital_IOSignal terminal IO12 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI. Supported peripheral buses: ADC, SWD/JTAG, RTC/CLK, TOUCH.
18IO13Digital_IOSignal terminal IO13 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK. Supported peripheral buses: ADC, SWD/JTAG, RTC/CLK, TOUCH.
19IO15Digital_IOSignal terminal IO15 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO15, ADC2_CH3, TOUCH3, RTC_GPIO13, MTDO. Supported peripheral buses: ADC, SWD/JTAG, RTC/CLK, TOUCH.
20IO2Digital_IOSignal terminal IO2 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12. Supported peripheral buses: ADC, RTC/CLK, TOUCH.
21IO0Digital_IOSignal terminal IO0 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1. Supported peripheral buses: ADC, RTC/CLK, TOUCH.
22IO4Digital_IOSignal terminal IO4 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10. Supported peripheral buses: ADC, RTC/CLK, TOUCH.
23NCNCSignal terminal NC (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
24NCNCSignal terminal NC (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
25IO9Digital_IOSignal terminal IO9 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO9, U1RXD. Supported peripheral buses: UART.
26IO10Digital_IOSignal terminal IO10 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO10, U1TXD. Supported peripheral buses: UART.
27GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
28NCNCSignal terminal NC (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
29IO5Digital_IOSignal terminal IO5 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO5. Supported peripheral buses: General.
30IO18Digital_IOSignal terminal IO18 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO18. Supported peripheral buses: General.
31IO23Digital_IOSignal terminal IO23 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO23. Supported peripheral buses: General.
32IO19Digital_IOSignal terminal IO19 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO19, U0CTS. Supported peripheral buses: UART.
33IO22Digital_IOSignal terminal IO22 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO22, U0RTS. Supported peripheral buses: UART.
34IO21Digital_IOSignal terminal IO21 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO21. Supported peripheral buses: General.
35RXD0Digital_IOSignal terminal RXD0 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO3, U0RXD, CLK_OUT2. Supported peripheral buses: UART.
36TXD0Digital_IOSignal terminal TXD0 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO1, U0TXD, CLK_OUT3. Supported peripheral buses: UART.
37NCNCSignal terminal NC (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
38GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
39GNDGNDBottom exposed die attach pad (GND) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.
40GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
41GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
42GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
43GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
44GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
45GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
46GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
47GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
48GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
49GNDGNDBottom exposed die attach pad (GND) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.
50GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
51GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
52GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
53GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
54GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
55GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.