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ATWINC1510-MR210UB (SMD) — Symbol, Footprint IPC-7351B & 3D STEP Model

ATWINC1510-MR210UB

MICROCHIPID: C6508792SMD · 29 Pins · Pitch 1.02mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · ATWINC1510-MR210UB (SMD)1GPIO_62I2C_SCL3I2C_SDA4RESET_N5NC6NC7NC8NC9GND_110SPI_CFG11WAKE12GND_213IRQN14UART_TXD15SPI_RXD29PADDLEGND28GND_327GPIO_526GPIO_425GPIO_3241P3V_TP23VDDIO22CHIP_EN21GPIO 1/RTC_20VBATT19UART_RXD18SPI_SCK17SPI_TXD16SPI_SSNGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.825.420.315.210.25.10-5.1-10.2-15.2-20.3-25.4mm
2. 2D FOOTPRINT
ANTENNA KEEPOUT (6.2mm)2919181716151413121110987654321282726252423222120E=14.80mm · Pitch e=1.02mmD=21.80mm-14-12-10-8-6-4-2024681012141715131197531-1-3-5-7-9-11-13-15-17mm
3. 3D CAD MODEL
Package Body: 14.80mm × 21.80mm · Pitch: 1.02mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (29/29)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1GPIO_6I/OMultiplexed I/O & Peripheral Pin GPIO_6 (General)
2I2C_SCLI/OMultiplexed I/O & Peripheral Pin I2C_SCL (I2C)
3I2C_SDAI/OMultiplexed I/O & Peripheral Pin I2C_SDA (I2C)
4RESET_NISystem Enable & Hardware Reset (RESET_N)
5NCI/OMultiplexed I/O & Peripheral Pin NC (General)
6NCI/OMultiplexed I/O & Peripheral Pin NC (General)
7NCI/OMultiplexed I/O & Peripheral Pin NC (General)
8NCI/OMultiplexed I/O & Peripheral Pin NC (General)
9GND_1GNDGround Reference Pin (GND_1)
10SPI_CFGI/OMultiplexed I/O & Peripheral Pin SPI_CFG (SPI)
11WAKEI/OMultiplexed I/O & Peripheral Pin WAKE (CAN)
12GND_2GNDGround Reference Pin (GND_2)
13IRQNI/OMultiplexed I/O & Peripheral Pin IRQN (General)
14UART_TXDI/OMultiplexed I/O & Peripheral Pin UART_TXD (UART)
15SPI_RXDI/OMultiplexed I/O & Peripheral Pin SPI_RXD (UART, SPI)
16SPI_SSNI/OMultiplexed I/O & Peripheral Pin SPI_SSN (SPI)
17SPI_TXDI/OMultiplexed I/O & Peripheral Pin SPI_TXD (UART, SPI)
18SPI_SCKI/OMultiplexed I/O & Peripheral Pin SPI_SCK (SPI)
19UART_RXDI/OMultiplexed I/O & Peripheral Pin UART_RXD (UART)
20VBATTPowerPower Supply Input (VBATT — 2.7V to 3.6V)
21GPIO 1/RTC_I/OMultiplexed I/O & Peripheral Pin GPIO 1/RTC_ (RTC/CLK)
22CHIP_ENI/OMultiplexed I/O & Peripheral Pin CHIP_EN (General)
23VDDIOPowerPower Supply Input (VDDIO — 2.7V to 3.6V)
241P3V_TPI/OMultiplexed I/O & Peripheral Pin 1P3V_TP (General)
25GPIO_3I/OMultiplexed I/O & Peripheral Pin GPIO_3 (General)
26GPIO_4I/OMultiplexed I/O & Peripheral Pin GPIO_4 (General)
27GPIO_5I/OMultiplexed I/O & Peripheral Pin GPIO_5 (General)
28GND_3GNDGround Reference Pin (GND_3)
29PADDLEGNDGNDGround Reference Pin (PADDLEGND)
PIN 1 GPIO_6
I/O
Multiplexed I/O & Peripheral Pin GPIO_6 (General)
Design note: GeneralpurposeI/O .
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 10 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: ATWINC1510-MR210UB (MICROCHIP · SMD)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
ATWINC1510-MR210UB (SMD) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
ATWINC1510-MR210UB (SMD) - 2. Standard Pinout (Top View)
True package pinout (29 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
ATWINC1510-MR210UB (SMD) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
ATWINC1510-MR210UB (SMD) - 4. Package Dimensions (D×E×A)
SMD · 14.80×21.80mm · Pitch 1.02mmExpand ›
5. Recommended Land PatternLAND PATTERN
ATWINC1510-MR210UB (SMD) - 5. Recommended Land Pattern
IPC-7351B Footprint (29 Pads)Expand ›
6. Application SchematicSCHEMATIC
ATWINC1510-MR210UB (SMD) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (10 figures · Page 1/1)
Showing 1–10 of 10 uncropped original figures for ATWINC1510
P1 · p01_fig01456×280px
ATWINC1510-MR210UB (SMD) — ATWINC15x0-MR210xB IEEE® 802.11 b/g/n SmartConnect
ATWINC15x0-MR210xB IEEE® 802.11 b/g/n SmartConnect
P8 · p08_fig011420×1048px
ATWINC1510-MR210UB (SMD) — Pin #
Pin #
P28 · p28_fig011651×949px
ATWINC1510-MR210UB (SMD) — Note: Add 10uF and 0.01uF decoupling capacitors between the pin 24 (1P3V_TP) and GND.
Note: Add 10uF and 0.01uF decoupling capacitors between the pin 24 (1P3V_TP) and GND.
P28 · p28_fig01P28
ATWINC1510-MR210UB (SMD) — Datasheet Page 28 (p28_fig01)
Datasheet Page 28 (p28_fig01)
P29 · p29_fig011726×870px
ATWINC1510-MR210UB (SMD) — Figure 11-1. Module Drawing - ATWINC15x0-MR210PB (unit = mm)
Figure 11-1. Module Drawing - ATWINC15x0-MR210PB (unit = mm)
P29 · p29_fig01P29
ATWINC1510-MR210UB (SMD) — Datasheet Page 29 (p29_fig01)
Datasheet Page 29 (p29_fig01)
P30 · p30_fig011739×950px
ATWINC1510-MR210UB (SMD) — Figure 11-2. Module Drawings - ATWINC15x0-MR210UB (unit = mm)
Figure 11-2. Module Drawings - ATWINC15x0-MR210UB (unit = mm)
P38 · p38_fig011376×933px
ATWINC1510-MR210UB (SMD) — Figure 13-1. Solder Reflow Profile
Figure 13-1. Solder Reflow Profile
P52 · p52_fig011775×1896px
ATWINC1510-MR210UB (SMD) — Rev C - 09/2018 | Section Changes | Features Added Enterprise security feature and related note. | Ordering Information and Module Marking Updated Table 1-1. | Pin Description Updated Table 3-1. | SPI Timing Added note for Table 7-3. | Sche
Rev C - 09/2018 | Section Changes | Features Added Enterprise security feature and related note. | Ordering Information and Module Marking Updated Table 1-1. | Pin Description Updated Table 3-1. | SPI Timing Added note for Table 7-3. | Sche
P55 · p55_fig011787×1974px
ATWINC1510-MR210UB (SMD) — WLAN Subsystem Radio • Revised Transmit Performance Table 6-3. | Power Consumption • Revised current table references in Table 8-1. | Schematic Design Information • Updated Schematics Section 11 text and figures Figure 11-1 and Figure 11-2.
WLAN Subsystem Radio • Revised Transmit Performance Table 6-3. | Power Consumption • Revised current table references in Table 8-1. | Schematic Design Information • Updated Schematics Section 11 text and figures Figure 11-1 and Figure 11-2.

Technical Specifications & Part Details (ATWINC1510-MR210UB)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Wireless Wi-Fi / Bluetooth LE SoC Module
Detailed Overview:ATWINC1510-MR210UB (SMD) is a 29-pin wireless wi-fi / bluetooth le soc module featuring a 21.80 × 14.80 × 2.40 mm mechanical envelope (lead pitch e = 1.02 mm). Rated for 2.7V to 3.6V supply operation across -40°C to +85°C with integrated Wi-Fi, UART, SPI, CAN, I2C, RTC/CLK interfaces.
Operating Supply VoltageV_CC / V_DD
2.7V to 3.6V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to +85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
20 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
21.80 × 14.80 × 2.40 mm (A1=0.00 mm)
Package family: CASTELLATED_MODULE (SMD)
Pin Count & Lead PitchN / e
29 Pins | Pitch e = 1.02 mm (40.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Wi-Fi, UART, SPI, CAN, I2C, RTC/CLK
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol29 auto-grouped pins
OK
IPC-7351B Land Pattern29 pads · Pitch 1.02mm
OK
IPC-7525 60% Solder PasteEPAD 3.70×3.70mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SMD)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
21.80 × 14.80 mm
Height (A) & Pitch (e)IPC-7351B
A=2.40mm · e=1.02mm
Pad Size (W × L)Level B
0.80 × 2.00 mm
Pins / Total PadsTopology
29P / 29Pad (CASTELLATED_MODULE)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SMD
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — ATWINC1510-MR210UB (SMD)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of ATWINC1510-MR210UB (SMD)?

Manufactured by MICROCHIP, the ATWINC1510-MR210UB is housed in a SMD package with 29 pins and a 1.02 mm lead pitch, supporting a VCC supply range of 2.7V to 3.6V. Key pins include: 1 (GPIO_6: Multiplexed I/O & Peripheral Pin GPIO_6 (General)), 2 (I2C_SCL: Multiplexed I/O & Peripheral Pin I2C_SCL (I2C)), 3 (I2C_SDA: Multiplexed I/O & Peripheral Pin I2C_SDA (I2C)), 4 (RESET_N: System Enable & Hardware Reset (RESET_N)), 5 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 6 (NC: Multiplexed I/O & Peripheral Pin NC (General)).

What are the IPC-7351B PCB Footprint dimensions for ATWINC1510-MR210UB?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), ATWINC1510-MR210UB (SMD) has a nominal body envelope of 14.80 × 21.80 mm, pitch e = 1.02 mm, and 29 copper pads plus a central exposed thermal pad (EPAD) of 3.70 × 3.70 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for ATWINC1510-MR210UB?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for ATWINC1510-MR210UB (MICROCHIP, SMD) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (29 pins) & ATWINC1510 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1GPIO_6Digital_IOSignal terminal GPIO_6 (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: GPIO_6. Supported peripheral buses: General.
2I2C_SCLDigital_IOSignal terminal I2C_SCL (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: I2C_SCL. Supported peripheral buses: I2C.
3I2C_SDADigital_IOSignal terminal I2C_SDA (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: I2C_SDA. Supported peripheral buses: I2C.
4RESET_NDigital_IOActive-low hardware reset terminal (RESET_N): pulling this pin Low resets the processor core and peripherals.
5NCNCSignal terminal NC (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
6NCNCSignal terminal NC (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
7NCNCSignal terminal NC (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
8NCNCSignal terminal NC (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
9GND_1GND0V electrical ground return terminal (GND_1) for internal core logic, I/O drivers, and analog sub-blocks.
10SPI_CFGDigital_IOSignal terminal SPI_CFG (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: SPIINTERFACE. Supported peripheral buses: SPI.
11WAKEDigital_IOSignal terminal WAKE (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: WAKE. Supported peripheral buses: CAN.
12GND_2GND0V electrical ground return terminal (GND_2) for internal core logic, I/O drivers, and analog sub-blocks.
13IRQNDigital_IOSignal terminal IRQN (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: IRQN. Supported peripheral buses: General.
14UART_TXDDigital_IOSignal terminal UART_TXD (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: UART_TXD. Supported peripheral buses: UART.
15SPI_RXDDigital_IOSignal terminal SPI_RXD (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: SPIMOSI. Supported peripheral buses: UART, SPI.
16SPI_SSNDigital_IOSignal terminal SPI_SSN (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: SPI_SLAVE. Supported peripheral buses: SPI.
17SPI_TXDDigital_IOSignal terminal SPI_TXD (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: SPIMISO. Supported peripheral buses: UART, SPI.
18SPI_SCKDigital_IOSignal terminal SPI_SCK (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: SPICLOCK. Supported peripheral buses: SPI.
19UART_RXDDigital_IOSignal terminal UART_RXD (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: UART_RXD. Supported peripheral buses: UART.
20VBATTPower_InPrimary positive power supply input (VBATT) operating in the 2.7V to 3.6V domain (Max rating: 3.6V).
21GPIO 1/RTC_Digital_IOSignal terminal GPIO 1/RTC_ (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: GPIO 1/RTC_. Supported peripheral buses: RTC/CLK.
22CHIP_ENDigital_IOSignal terminal CHIP_EN (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: CHIP_EN. Supported peripheral buses: General.
23VDDIOPower_InPrimary positive power supply input (VDDIO) operating in the 2.7V to 3.6V domain (Max rating: 3.6V).
241P3V_TPDigital_IOSignal terminal 1P3V_TP (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: 1P3V_TP. Supported peripheral buses: General.
25GPIO_3Digital_IOSignal terminal GPIO_3 (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: GPIO_3. Supported peripheral buses: General.
26GPIO_4Digital_IOSignal terminal GPIO_4 (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: GPIO_4. Supported peripheral buses: General.
27GPIO_5Digital_IOSignal terminal GPIO_5 (I/O, 2.7V to 3.6V domain). Multiplexed alternate functions: GPIO_5. Supported peripheral buses: General.
28GND_3GND0V electrical ground return terminal (GND_3) for internal core logic, I/O drivers, and analog sub-blocks.
29PADDLEGNDGND0V electrical ground return terminal (PADDLEGND) for internal core logic, I/O drivers, and analog sub-blocks.
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