MIC61150YMME-TR (MSOP-10-EP) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MIC61150YMME-TR (MSOP-10-EP)?

Manufactured by MICROCHIP, the MIC61150YMME-TR is housed in a MSOP-10-EP package with 11 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 1.1V to 3.6V. Key pins include: 1 (IN: Multiplexed I/O & Peripheral Pin IN (General)), 2 (IN: Multiplexed I/O & Peripheral Pin IN (General)), 3 (GND: Ground Reference Pin (GND)), 4 (EN: System Enable & Hardware Reset (EN)), 5 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 6 (NC: Multiplexed I/O & Peripheral Pin NC (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for MIC61150YMME-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC61150YMME-TR (MSOP-10-EP) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.50 mm, and 11 copper pads plus a central exposed thermal pad (EPAD) of 1.68 × 1.88 mm with a 60% IPC-7525 windowed solder paste grid.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC61150YMME-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC61150YMME-TR (MICROCHIP, MSOP-10-EP) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 3.00mm × 3.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (11/11)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	IN	I/O	Multiplexed I/O & Peripheral Pin IN (General)
2	IN	I/O	Multiplexed I/O & Peripheral Pin IN (General)
3	GND	GND	Ground Reference Pin (GND)
4	EN	I	System Enable & Hardware Reset (EN)
5	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
6	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
7	CP	I/O	Multiplexed I/O & Peripheral Pin CP (General)
8	FB	I/O	Multiplexed I/O & Peripheral Pin FB (General)
9	OUT	Power	Regulated Power Output (OUT — 1.1V to 3.6V)
10	OUT	Power	Regulated Power Output (OUT — 1.1V to 3.6V)
11	EP	GND	Exposed Thermal & Ground Pad (EP)

PIN 1 IN

I/O

Multiplexed I/O & Peripheral Pin IN (General)

Design note: InputVoltage .

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 14 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MIC61150YMME-TR (MSOP-10-EP) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MIC61150YMME-TR (MSOP-10-EP) - 2. Standard Pinout (Top View)

True package pinout (11 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MIC61150YMME-TR (MSOP-10-EP) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MIC61150YMME-TR (MSOP-10-EP) - 4. Package Dimensions (D×E×A)

MSOP-10-EP · 3.00×3.00mm · Pitch 0.50mmExpand ›

5. Recommended Land PatternLAND PATTERN

MIC61150YMME-TR (MSOP-10-EP) - 5. Recommended Land Pattern

IPC-7351B Footprint (11 Pads)Expand ›

6. Application SchematicSCHEMATIC

MIC61150YMME-TR (MSOP-10-EP) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (14 figures · Page 1/2)

Showing 1–12 of 14 uncropped original figures for MIC61150

P1 · p01_fig01750×709px

MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc.

P1 · p01_fig02647×553px

MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc.

P2 · p02_fig01669×411px

10-Pin ePad MSOP (MME) 10-Pin 3mm x 3mm MLF® (ML) Pin Description

P2 · p02_fig02679×406px

10-Pin ePad MSOP (MME) 10-Pin 3mm x 3mm MLF® (ML) Pin Description

P2 · p02_fig01P2

Datasheet Page 2 (p02_fig01)

P2 · p02_fig02P2

Datasheet Page 2 (p02_fig02)

P16 · p16_fig01621×1009px

MIC61150YML PCB Layout Recommendations

P16 · p16_fig02619×1009px

MIC61150YML Evaluation Board - Top Layer

P16 · p16_fig01P16

Datasheet Page 16 (p16_fig01)

P18 · p18_fig01608×988px

MIC61150YMME PCB Layout Recommendations

P18 · p18_fig02607×992px

MIC61150YMME Evaluation Board - Top Layer

P19 · p19_fig011794×1129px

10-Pin 3mm x 3mm MLF® (ML)

Page 1 / 2 (14 extracted figures)

Technical Specifications & Part Details (MIC61150YMME-TR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MIC61150YMME-TR (MSOP-10-EP) is a 10-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 1.10 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 1.1V to 3.6V supply operation across 40°C to +125°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

1.1V to 3.6V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

40°C to +125°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

DC / Broadband Passive

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

3.00 × 3.00 × 1.10 mm (A1=0.08 mm)

Package family: TSSOP (MSOP-10-EP)

Pin Count & Lead PitchN / e

10 Pins | Pitch e = 0.50 mm (19.7 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol11 auto-grouped pins

IPC-7351B Land Pattern11 pads · Pitch 0.50mm

IPC-7525 60% Solder PasteEPAD 1.68×1.88mm windowed grid

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (MSOP-10-EP)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

3.00 × 3.00 mm

Height (A) & Pitch (e)IPC-7351B

A=1.10mm · e=0.50mm

Pad Size (W × L)Level B

0.30 × 1.25 mm

Pins / Total PadsTopology

11P / 11Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit MSOP-10-EP	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC61150YMME-TR (MSOP-10-EP)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC61150YMME-TR (MSOP-10-EP)?

Manufactured by MICROCHIP, the MIC61150YMME-TR is housed in a MSOP-10-EP package with 11 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 1.1V to 3.6V. Key pins include: 1 (IN: Multiplexed I/O & Peripheral Pin IN (General)), 2 (IN: Multiplexed I/O & Peripheral Pin IN (General)), 3 (GND: Ground Reference Pin (GND)), 4 (EN: System Enable & Hardware Reset (EN)), 5 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 6 (NC: Multiplexed I/O & Peripheral Pin NC (General)).

What are the IPC-7351B PCB Footprint dimensions for MIC61150YMME-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC61150YMME-TR (MSOP-10-EP) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.50 mm, and 11 copper pads plus a central exposed thermal pad (EPAD) of 1.68 × 1.88 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC61150YMME-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC61150YMME-TR (MICROCHIP, MSOP-10-EP) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (11 pins) & MIC61150 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	IN	Digital_IO	Signal terminal IN (I/O, 1.1V to 3.6V domain). Multiplexed alternate functions: IN. Supported peripheral buses: General.
2	IN	Digital_IO	Signal terminal IN (I/O, 1.1V to 3.6V domain). Multiplexed alternate functions: IN. Supported peripheral buses: General.
3	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
4	EN	Digital_IO	Chip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
5	NC	NC	Signal terminal NC (I/O, 1.1V to 3.6V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
6	NC	NC	Signal terminal NC (I/O, 1.1V to 3.6V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
7	CP	Digital_IO	Signal terminal CP (I/O, 1.1V to 3.6V domain). Multiplexed alternate functions: CP. Supported peripheral buses: General.
8	FB	Digital_IO	Signal terminal FB (I/O, 1.1V to 3.6V domain). Multiplexed alternate functions: FB. Supported peripheral buses: General.
9	OUT	Power_Out	Regulated power output rail (OUT) operating in the 1.1V to 3.6V domain (Max rating: 3.6V).
10	OUT	Power_Out	Regulated power output rail (OUT) operating in the 1.1V to 3.6V domain (Max rating: 3.6V).
11	EP	GND	Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.

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