MIC5321-MFYML-TR (MLF-6) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MIC5321-MFYML-TR (MLF-6)?

Manufactured by MICROCHIP, the MIC5321-MFYML-TR is housed in a MLF-6 package with 7 pins and a 0.51 mm lead pitch, supporting a VCC supply range of 2.3V to 5.5V. Key pins include: 1 (VIN: Power Supply Input (VIN — 2.3V to 5.5V)), 2 (GND: Ground Reference Pin (GND)), 3 (BYP: Multiplexed I/O & Peripheral Pin BYP (General)), 4 (EN: System Enable & Hardware Reset (EN)), 5 (VOUT2: Power Supply Input (VOUT2 — 2.3V to 5.5V)), 6 (VOUT1: Power Supply Input (VOUT1 — 2.3V to 5.5V)).

Q: What are the IPC-7351B PCB Footprint dimensions for MIC5321-MFYML-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC5321-MFYML-TR (MLF-6) has a nominal body envelope of 1.60 × 1.60 mm, pitch e = 0.51 mm, and 7 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC5321-MFYML-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC5321-MFYML-TR (MICROCHIP, MLF-6) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 1.60mm × 1.60mm · Pitch: 0.51mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (7/7)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	VIN	Power	Power Supply Input (VIN — 2.3V to 5.5V)
2	GND	GND	Ground Reference Pin (GND)
3	BYP	I/O	Multiplexed I/O & Peripheral Pin BYP (General)
4	EN	I	System Enable & Hardware Reset (EN)
5	VOUT2	Power	Power Supply Input (VOUT2 — 2.3V to 5.5V)
6	VOUT1	Power	Power Supply Input (VOUT1 — 2.3V to 5.5V)
7	EP	GND	Exposed Thermal & Ground Pad (EP)

PIN 1 VIN

Power

Power Supply Input (VIN — 2.3V to 5.5V)

Design note: SupplyInput .

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 9 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MIC5321-MFYML-TR (MLF-6) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MIC5321-MFYML-TR (MLF-6) - 2. Standard Pinout (Top View)

True package pinout (7 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MIC5321-MFYML-TR (MLF-6) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MIC5321-MFYML-TR (MLF-6) - 4. Package Dimensions (D×E×A)

MLF-6 · 1.60×1.60mm · Pitch 0.51mmExpand ›

5. Recommended Land PatternLAND PATTERN

MIC5321-MFYML-TR (MLF-6) - 5. Recommended Land Pattern

IPC-7351B Footprint (7 Pads)Expand ›

6. Application SchematicSCHEMATIC

MIC5321-MFYML-TR (MLF-6) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (9 figures · Page 1/1)

Showing 1–9 of 9 uncropped original figures for MIC5321

P4 · p04_fig02EXACT PACKAGE

Pin Configuration

P11 · p11_fig01EXACT PACKAGE

Micrel, Inc. MIC5321

P11 · p11_fig02EXACT PACKAGE

May 2008 11 M9999-051508-E

P1 · p01_fig01881×517px

ULDO is a trademark of Micrel, Inc. MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc.

P1 · p01_fig01P1

Datasheet Page 1 (p01_fig01)

P4 · p04_fig01458×608px

VIN GND | VOUT1 EN | BYP | 3 1 | 6 | 2 | 4 5 | VOUT2 | TSOT-23-6 (D6) | Top View Pin Description

P4 · p04_fig01P4

Datasheet Page 4 (p04_fig01)

P4 · p04_fig02P4

Datasheet Page 4 (p04_fig02)

P9 · p09_fig011025×333px

May 2008 9 M9999-051508-E

Technical Specifications & Part Details (MIC5321-MFYML-TR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MIC5321-MFYML-TR (MLF-6) is a 6-pin standard electronic & interconnect component featuring a 1.60 × 1.60 × 0.75 mm mechanical envelope (lead pitch e = 0.51 mm). Rated for 2.3V to 5.5V supply operation across 40°C to +125°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

2.3V to 5.5V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

40°C to +125°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

DC / Broadband Passive

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

150µA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

1.60 × 1.60 × 0.75 mm (A1=0.02 mm)

Package family: OTHER (MLF-6)

Pin Count & Lead PitchN / e

6 Pins | Pitch e = 0.51 mm (20.0 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol7 auto-grouped pins

IPC-7351B Land Pattern7 pads · Pitch 0.51mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (MLF-6)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

1.60 × 1.60 mm

Height (A) & Pitch (e)IPC-7351B

A=0.75mm · e=0.51mm

Pad Size (W × L)Level B

0.30 × 0.60 mm

Pins / Total PadsTopology

7P / 7Pad (CUSTOM_ARRAY)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit MLF-6	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC5321-MFYML-TR (MLF-6)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC5321-MFYML-TR (MLF-6)?

Manufactured by MICROCHIP, the MIC5321-MFYML-TR is housed in a MLF-6 package with 7 pins and a 0.51 mm lead pitch, supporting a VCC supply range of 2.3V to 5.5V. Key pins include: 1 (VIN: Power Supply Input (VIN — 2.3V to 5.5V)), 2 (GND: Ground Reference Pin (GND)), 3 (BYP: Multiplexed I/O & Peripheral Pin BYP (General)), 4 (EN: System Enable & Hardware Reset (EN)), 5 (VOUT2: Power Supply Input (VOUT2 — 2.3V to 5.5V)), 6 (VOUT1: Power Supply Input (VOUT1 — 2.3V to 5.5V)).

What are the IPC-7351B PCB Footprint dimensions for MIC5321-MFYML-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC5321-MFYML-TR (MLF-6) has a nominal body envelope of 1.60 × 1.60 mm, pitch e = 0.51 mm, and 7 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC5321-MFYML-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC5321-MFYML-TR (MICROCHIP, MLF-6) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (7 pins) & MIC5321 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	VIN	Power_In	Primary positive power supply input (VIN) operating in the 2.3V to 5.5V domain (Max rating: 5.5V).
2	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
3	BYP	Digital_IO	Signal terminal BYP (I/O, 2.3V to 5.5V domain). Multiplexed alternate functions: BYP. Supported peripheral buses: General.
4	EN	Digital_IO	Chip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
5	VOUT2	Power_In	Primary positive power supply input (VOUT2) operating in the 2.3V to 5.5V domain (Max rating: 5.5V).
6	VOUT1	Power_In	Primary positive power supply input (VOUT1) operating in the 2.3V to 5.5V domain (Max rating: 5.5V).
7	EP	GND	Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.

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