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CH282P (QFN-16(3x3)) — Symbol, Footprint IPC-7351B & 3D STEP Model

CH282P

WCHID: C54973463QFN-16(3x3) · 17 Pins · Pitch 0.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · CH282P (QFN-16(3x3))1HIN12LIN33LIN24LIN15VDD5/3V36VHREG7VHV8HO19LO117GND16HIN215HIN314PU5L313LO312HO311LO210HO2Grid Pitch = 2.54mm (IEEE-315)-15.2-10.2-5.105.110.215.217.812.77.62.5-2.5-7.6-12.7-17.8mm
2. 2D FOOTPRINT
1234567891011121314151617E=3.00mm · Pitch e=0.50mmD=3.00mm-4-3-2-10123443210-1-2-3-4mm
3. 3D CAD MODEL
Package Body: 3.00mm × 3.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (17/17)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1HIN1I/OMultiplexed I/O & Peripheral Pin HIN1 (General)
2LIN3I/OMultiplexed I/O & Peripheral Pin LIN3 (General)
3LIN2I/OMultiplexed I/O & Peripheral Pin LIN2 (General)
4LIN1I/OMultiplexed I/O & Peripheral Pin LIN1 (General)
5VDD5/3V3PowerPower Supply Input (VDD5/3V3 — 3.3V / 5.0V Standard Logic)
6VHREGI/OMultiplexed I/O & Peripheral Pin VHREG (General)
7VHVI/OMultiplexed I/O & Peripheral Pin VHV (General)
8HO1I/OMultiplexed I/O & Peripheral Pin HO1 (General)
9LO1I/OMultiplexed I/O & Peripheral Pin LO1 (General)
10HO2I/OMultiplexed I/O & Peripheral Pin HO2 (General)
11LO2I/OMultiplexed I/O & Peripheral Pin LO2 (General)
12HO3I/OMultiplexed I/O & Peripheral Pin HO3 (General)
13LO3I/OMultiplexed I/O & Peripheral Pin LO3 (General)
14PU5L3I/OMultiplexed I/O & Peripheral Pin PU5L3 (General)
15HIN3I/OMultiplexed I/O & Peripheral Pin HIN3 (General)
16HIN2I/OMultiplexed I/O & Peripheral Pin HIN2 (General)
17GNDGNDGround Reference Pin (GND)
PIN 1 HIN1
I/O
Multiplexed I/O & Peripheral Pin HIN1 (General)
Design note: Signal terminal HIN1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: HIN1. Supported peripheral buses: General.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: CH282P (WCH · QFN-16(3x3))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
CH282P (QFN-16(3x3)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
CH282P (QFN-16(3x3)) - 2. Standard Pinout (Top View)
True package pinout (17 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
CH282P (QFN-16(3x3)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
CH282P (QFN-16(3x3)) - 4. Package Dimensions (D×E×A)
QFN-16(3x3) · 3.00×3.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
CH282P (QFN-16(3x3)) - 5. Recommended Land Pattern
IPC-7351B Footprint (17 Pads)Expand ›
6. Application SchematicSCHEMATIC
CH282P (QFN-16(3x3)) - 6. Application Schematic
Typical Application SchematicExpand ›

Technical Specifications & Part Details (CH282P)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:CH282P (QFN-16(3x3)) is a 16-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 0.85 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
3.00 × 3.00 × 0.85 mm (A1=0.03 mm)
Package family: QFN (QFN-16(3x3))
Pin Count & Lead PitchN / e
16 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol17 auto-grouped pins
OK
IPC-7351B Land Pattern17 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteEPAD 1.60×1.60mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (QFN-16(3x3))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
3.00 × 3.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.85mm · e=0.50mm
Pad Size (W × L)Level B
0.28 × 0.75 mm
Pins / Total PadsTopology
17P / 17Pad (QUAD_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
QFN-16(3x3)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — CH282P (QFN-16(3x3))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of CH282P (QFN-16(3x3))?

Manufactured by WCH, the CH282P is housed in a QFN-16(3x3) package with 17 pins and a 0.50 mm lead pitch. Key pins include: 1 (HIN1: Multiplexed I/O & Peripheral Pin HIN1 (General)), 2 (LIN3: Multiplexed I/O & Peripheral Pin LIN3 (General)), 3 (LIN2: Multiplexed I/O & Peripheral Pin LIN2 (General)), 4 (LIN1: Multiplexed I/O & Peripheral Pin LIN1 (General)), 5 (VDD5/3V3: Power Supply Input (VDD5/3V3 — 3.3V / 5.0V Standard Logic)), 6 (VHREG: Multiplexed I/O & Peripheral Pin VHREG (General)).

What are the IPC-7351B PCB Footprint dimensions for CH282P?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), CH282P (QFN-16(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.50 mm, and 17 copper pads plus a central exposed thermal pad (EPAD) of 1.60 × 1.60 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for CH282P?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for CH282P (WCH, QFN-16(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (17 pins) & CH282 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1HIN1Digital_IOSignal terminal HIN1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: HIN1. Supported peripheral buses: General.
2LIN3Digital_IOSignal terminal LIN3 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: LIN3. Supported peripheral buses: General.
3LIN2Digital_IOSignal terminal LIN2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: LIN2. Supported peripheral buses: General.
4LIN1Digital_IOSignal terminal LIN1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: LIN1. Supported peripheral buses: General.
5VDD5/3V3Power_InPrimary positive power supply input (VDD5/3V3) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
6VHREGDigital_IOSignal terminal VHREG (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VHREG. Supported peripheral buses: General.
7VHVDigital_IOSignal terminal VHV (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VHV. Supported peripheral buses: General.
8HO1Digital_IOSignal terminal HO1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: HO1. Supported peripheral buses: General.
9LO1Digital_IOSignal terminal LO1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: LO1. Supported peripheral buses: General.
10HO2Digital_IOSignal terminal HO2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: HO2. Supported peripheral buses: General.
11LO2Digital_IOSignal terminal LO2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: LO2. Supported peripheral buses: General.
12HO3Digital_IOSignal terminal HO3 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: HO3. Supported peripheral buses: General.
13LO3Digital_IOSignal terminal LO3 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: LO3. Supported peripheral buses: General.
14PU5L3Digital_IOSignal terminal PU5L3 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PU5L3. Supported peripheral buses: General.
15HIN3Digital_IOSignal terminal HIN3 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: HIN3. Supported peripheral buses: General.
16HIN2Digital_IOSignal terminal HIN2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: HIN2. Supported peripheral buses: General.
17GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
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