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MCP14T0517BT-E/CH (SOT-23-6) — Symbol, Footprint IPC-7351B & 3D STEP Model

MCP14T0517BT-E/CH

MICROCHIPID: C53124192SOT-23-6 · 6 Pins · Pitch 0.95mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · MCP14T0517BT-E/CH (SOT-23-6)1D12VDD3D26SYNC5EN4GNDGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.810.25.10-5.1-10.2mm
2. 2D FOOTPRINT
123456E=2.90mm · Pitch e=0.95mmD=1.60mm-3-2-1012343210-1-2-3-4mm
3. 3D CAD MODEL
Package Body: 2.90mm × 1.60mm · Pitch: 0.95mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (6/6)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1D1I/OMultiplexed I/O & Peripheral Pin D1 (General)
2VDDPowerPower Supply Input (VDD — 3.3V / 5.0V Standard Logic)
3D2I/OMultiplexed I/O & Peripheral Pin D2 (General)
4GNDGNDGround Reference Pin (GND)
5ENISystem Enable & Hardware Reset (EN)
6SYNCI/OMultiplexed I/O & Peripheral Pin SYNC (General)
PIN 1 D1
I/O
Multiplexed I/O & Peripheral Pin D1 (General)
Design note: Signal terminal D1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: D1. Supported peripheral buses: General.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: MCP14T0517BT-E/CH (MICROCHIP · SOT-23-6)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
MCP14T0517BT-E/CH (SOT-23-6) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
MCP14T0517BT-E/CH (SOT-23-6) - 2. Standard Pinout (Top View)
True package pinout (6 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
MCP14T0517BT-E/CH (SOT-23-6) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
MCP14T0517BT-E/CH (SOT-23-6) - 4. Package Dimensions (D×E×A)
SOT-23-6 · 2.90×1.60mm · Pitch 0.95mmExpand ›
5. Recommended Land PatternLAND PATTERN
MCP14T0517BT-E/CH (SOT-23-6) - 5. Recommended Land Pattern
IPC-7351B Footprint (6 Pads)Expand ›
6. Application SchematicSCHEMATIC
MCP14T0517BT-E/CH (SOT-23-6) - 6. Application Schematic
Typical Application SchematicExpand ›

Technical Specifications & Part Details (MCP14T0517BT-E/CH)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:MCP14T0517BT-E/CH (SOT-23-6) is a 6-pin standard electronic & interconnect component featuring a 2.90 × 1.60 × 1.10 mm mechanical envelope (lead pitch e = 0.95 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
2.90 × 1.60 × 1.10 mm (A1=0.08 mm)
Package family: SOT23 (SOT-23-6)
Pin Count & Lead PitchN / e
6 Pins | Pitch e = 0.95 mm (37.4 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol6 auto-grouped pins
OK
IPC-7351B Land Pattern6 pads · Pitch 0.95mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOT-23-6)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
2.90 × 1.60 mm
Height (A) & Pitch (e)IPC-7351B
A=1.10mm · e=0.95mm
Pad Size (W × L)Level B
0.60 × 1.00 mm
Pins / Total PadsTopology
6P / 6Pad (SOT_SMALL)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SOT-23-6
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MCP14T0517BT-E/CH (SOT-23-6)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MCP14T0517BT-E/CH (SOT-23-6)?

Manufactured by MICROCHIP, the MCP14T0517BT-E/CH is housed in a SOT-23-6 package with 6 pins and a 0.95 mm lead pitch. Key pins include: 1 (D1: Multiplexed I/O & Peripheral Pin D1 (General)), 2 (VDD: Power Supply Input (VDD — 3.3V / 5.0V Standard Logic)), 3 (D2: Multiplexed I/O & Peripheral Pin D2 (General)), 4 (GND: Ground Reference Pin (GND)), 5 (EN: System Enable & Hardware Reset (EN)), 6 (SYNC: Multiplexed I/O & Peripheral Pin SYNC (General)).

What are the IPC-7351B PCB Footprint dimensions for MCP14T0517BT-E/CH?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP14T0517BT-E/CH (SOT-23-6) has a nominal body envelope of 1.60 × 2.90 mm, pitch e = 0.95 mm, and 6 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP14T0517BT-E/CH?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP14T0517BT-E/CH (MICROCHIP, SOT-23-6) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (6 pins) & MCP14T0517BT Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1D1Digital_IOSignal terminal D1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: D1. Supported peripheral buses: General.
2VDDPower_InPrimary positive power supply input (VDD) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
3D2Digital_IOSignal terminal D2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: D2. Supported peripheral buses: General.
4GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
5ENDigital_IOChip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
6SYNCDigital_IOSignal terminal SYNC (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: SYNC. Supported peripheral buses: General.
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