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25AA256-I/P (DIP-8) — Symbol, Footprint IPC-7351B & 3D STEP Model

25AA256-I/P

MICROCHIPID: C511298DIP-8 · 8 Pins · Pitch 2.54mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · 25AA256-I/P (DIP-8)1CS2SO3WP4VSS8VCC7HOLD6SCK5SIGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.810.25.10-5.1-10.2mm
2. 2D FOOTPRINT
12345678E=6.35mm · Pitch e=2.54mmD=9.62mm-7-5-3-113577531-1-3-5-7mm
3. 3D CAD MODEL
Package Body: 6.35mm × 9.62mm · Pitch: 2.54mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (8/8)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1CSI/OMultiplexed I/O & Peripheral Pin CS (General)
2SOI/OMultiplexed I/O & Peripheral Pin SO (General)
3WPI/OMultiplexed I/O & Peripheral Pin WP (General)
4VSSGNDGround Reference Pin (VSS)
5SII/OMultiplexed I/O & Peripheral Pin SI (General)
6SCKI/OMultiplexed I/O & Peripheral Pin SCK (SPI)
7HOLDI/OMultiplexed I/O & Peripheral Pin HOLD (General)
8VCCPowerPower Supply Input (VCC — 1.8V to 5.5V)
PIN 1 CS
I/O
Multiplexed I/O & Peripheral Pin CS (General)
Design note: ChipSelectInput
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 9 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: 25AA256-I/P (MICROCHIP · DIP-8)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
25AA256-I/P (DIP-8) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
25AA256-I/P (DIP-8) - 2. Standard Pinout (Top View)
True package pinout (8 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
25AA256-I/P (DIP-8) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
25AA256-I/P (DIP-8) - 4. Package Dimensions (D×E×A)
DIP-8 · 6.35×9.62mm · Pitch 2.54mmExpand ›
5. Recommended Land PatternLAND PATTERN
25AA256-I/P (DIP-8) - 5. Recommended Land Pattern
IPC-7351B Footprint (8 Pads)Expand ›
6. Application SchematicSCHEMATIC
25AA256-I/P (DIP-8) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (9 figures · Page 1/1)
Showing 1–9 of 9 uncropped original figures for 25AA256
P1 · p01_fig02EXACT PACKAGE
25AA256-I/P (DIP-8) —  2003-2019 Microchip Technology Inc. DS20001822H-page 1 | • RoHS Compliant | • Automotive AEC-Q100 Qualified Pin Function Table | The 25XX256 is available in standard packages includ- ing 8-lead PDIP and SOIC, and advanced packaging includ
 2003-2019 Microchip Technology Inc. DS20001822H-page 1 | • RoHS Compliant | • Automotive AEC-Q100 Qualified Pin Function Table | The 25XX256 is available in standard packages includ- ing 8-lead PDIP and SOIC, and advanced packaging includ
P1 · p01_fig01376×200px
25AA256-I/P (DIP-8) — 256K SPI Bus Serial EEPROM
256K SPI Bus Serial EEPROM
P1 · p01_fig02P1
25AA256-I/P (DIP-8) — Datasheet Page 1 (p01_fig02)
Datasheet Page 1 (p01_fig02)
P14 · p14_fig011777×2564px
25AA256-I/P (DIP-8) — 25AA256/25LC256
25AA256/25LC256
P14 · p14_fig01P14
25AA256-I/P (DIP-8) — Datasheet Page 14 (p14_fig01)
Datasheet Page 14 (p14_fig01)
P29 · p29_fig011777×1328px
25AA256-I/P (DIP-8) — 25AA256/25LC256 | PRODUCT IDENTIFICATION SYSTEM | To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. | PART NO. X /XX | Package Tape & Reel Device | Device: 25AA256 25LC256 25AA256
25AA256/25LC256 | PRODUCT IDENTIFICATION SYSTEM | To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. | PART NO. X /XX | Package Tape & Reel Device | Device: 25AA256 25LC256 25AA256
P29 · p29_fig01P29
25AA256-I/P (DIP-8) — Datasheet Page 29 (p29_fig01)
Datasheet Page 29 (p29_fig01)
P21 · p21_fig01All Packages in PDF
25AA256-I/P (DIP-8) — 25AA256/25LC256
25AA256/25LC256
P22 · p22_fig01All Packages in PDF
25AA256-I/P (DIP-8) — 25AA256/25LC256
25AA256/25LC256

Technical Specifications & Part Details (25AA256-I/P)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:25AA256-I/P (DIP-8) is a 8-pin standard electronic & interconnect component featuring a 9.62 × 6.35 × 3.50 mm mechanical envelope (lead pitch e = 2.54 mm). Rated for 1.8V to 5.5V supply operation across -40°C to +125°C with integrated SPI interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V to 5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to +125°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
10 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
9.62 × 6.35 × 3.50 mm (A1=0.51 mm)
Package family: DIP (DIP-8)
Pin Count & Lead PitchN / e
8 Pins | Pitch e = 2.54 mm (100.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
SPI
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol8 auto-grouped pins
OK
IPC-7351B Land Pattern8 pads · Pitch 2.54mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (DIP-8)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
9.62 × 6.35 mm
Height (A) & Pitch (e)IPC-7351B
A=3.50mm · e=2.54mm
Pad Size (W × L)Level B
1.60 × 1.60 mm
Pins / Total PadsTopology
8P / 8Pad (THT_DIP)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
DIP-8
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — 25AA256-I/P (DIP-8)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of 25AA256-I/P (DIP-8)?

Manufactured by MICROCHIP, the 25AA256-I/P is housed in a DIP-8 package with 8 pins and a 2.54 mm lead pitch, supporting a VCC supply range of 1.8V to 5.5V. Key pins include: 1 (CS: Multiplexed I/O & Peripheral Pin CS (General)), 2 (SO: Multiplexed I/O & Peripheral Pin SO (General)), 3 (WP: Multiplexed I/O & Peripheral Pin WP (General)), 4 (VSS: Ground Reference Pin (VSS)), 5 (SI: Multiplexed I/O & Peripheral Pin SI (General)), 6 (SCK: Multiplexed I/O & Peripheral Pin SCK (SPI)).

What are the IPC-7351B PCB Footprint dimensions for 25AA256-I/P?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), 25AA256-I/P (DIP-8) has a nominal body envelope of 6.35 × 9.62 mm, pitch e = 2.54 mm, and 8 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for 25AA256-I/P?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for 25AA256-I/P (MICROCHIP, DIP-8) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (8 pins) & 25AA256 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1CSDigital_IOSignal terminal CS (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: CS. Supported peripheral buses: General.
2SODigital_IOSignal terminal SO (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: SO. Supported peripheral buses: General.
3WPDigital_IOSignal terminal WP (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: WP. Supported peripheral buses: General.
4VSSGND0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
5SIDigital_IOSignal terminal SI (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: SI. Supported peripheral buses: General.
6SCKDigital_IOSignal terminal SCK (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: SCK. Supported peripheral buses: SPI.
7HOLDDigital_IOSignal terminal HOLD (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: HOLD. Supported peripheral buses: General.
8VCCPower_InPrimary positive power supply input (VCC) operating in the 1.8V to 5.5V domain (Max rating: 5.5V).
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