MCP809T-450I/TT (SOT-23-3) — Symbol, Footprint IPC-7351B & 3D STEP Model

MCP809T-450I/TT

MICROCHIPSOT-23-3 · 3 Pins · Pitch 1.90mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · MCP809T-450I/TT (SOT-23-3)1VSS2RST#3VDDGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.810.25.10-5.1-10.2mm
2. 2D FOOTPRINT
123E=2.90mm · Pitch e=1.90mmD=1.30mm-3-2-101233210-1-2-3mm
3. 3D CAD MODEL
Package Body: 2.90mm × 1.30mm · Pitch: 1.90mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (3/3)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1VSSGNDGround Reference Pin (VSS)
2RST#I/OMultiplexed I/O & Peripheral Pin RST# (General)
3VDDPowerPower Supply Input (VDD — 3.3V / 5.0V Standard Logic)
PIN 1 VSS
GND
Ground Reference Pin (VSS)
Design note: 0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 6 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
1. Realistic 3D PackageREPRESENTATIVE
MCP809T-450I/TT (SOT-23-3) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
MCP809T-450I/TT (SOT-23-3) - 2. Standard Pinout (Top View)
True package pinout (3 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
MCP809T-450I/TT (SOT-23-3) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
MCP809T-450I/TT (SOT-23-3) - 4. Package Dimensions (D×E×A)
SOT-23-3 · 2.90×1.30mm · Pitch 1.90mmExpand ›
5. Recommended Land PatternLAND PATTERN
MCP809T-450I/TT (SOT-23-3) - 5. Recommended Land Pattern
IPC-7351B Footprint (3 Pads)Expand ›
6. Application SchematicSCHEMATIC
MCP809T-450I/TT (SOT-23-3) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (6 figures · Page 1/1)
Showing 1–6 of 6 uncropped original figures for MCP809
P1 · p01_fig011781×1507px
MCP809T-450I/TT (SOT-23-3) —  MCP809/810
 MCP809/810
P4 · p04_fig011779×1629px
MCP809T-450I/TT (SOT-23-3) — 0&3  |  $33/,&$7,216,1)250$7,21 |  7KH1HHGIRU6XSHUYLVRU\&LUFXLWV | ),*85( 7<3,&$/$33/,&$7,21 |  1HJDWLYH*RLQJ9''7UDQVLHQWV | ),*85( 7<3,&$/75$16,(17 5(63216( | 0LFURFRQWUROOHU | 0&/5 | 966 | 567 0&3 RU 5
0&3  |  $33/,&$7,216,1)250$7,21 |  7KH1HHGIRU6XSHUYLVRU\&LUFXLWV | ),*85( 7<3,&$/$33/,&$7,21 |  1HJDWLYH*RLQJ9''7UDQVLHQWV | ),*85( 7<3,&$/75$16,(17 5(63216( | 0LFURFRQWUROOHU | 0&/5 | 966 | 567 0&3 RU 5
P5 · p05_fig011779×2725px
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P6 · p06_fig011779×1086px
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P7 · p07_fig011100×401px
MCP809T-450I/TT (SOT-23-3) — 0DUN 3DUW1XPEHU 0DUN 3DUW1XPEHU
0DUN 3DUW1XPEHU 0DUN 3DUW1XPEHU
P7 · p07_fig021361×946px
MCP809T-450I/TT (SOT-23-3) — 6273$576/$%(/,1*
6273$576/$%(/,1*

Technical Specifications & Part Details (MCP809T-450I/TT)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:MCP809T-450I/TT (SOT-23-3) is a 3-pin standard electronic & interconnect component featuring a 2.90 × 1.30 × 1.10 mm mechanical envelope (lead pitch e = 1.90 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
2.90 × 1.30 × 1.10 mm (A1=0.07 mm)
Package family: SOT23 (SOT-23-3)
Pin Count & Lead PitchN / e
3 Pins | Pitch e = 1.90 mm (74.8 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol3 auto-grouped pins
OK
IPC-7351B Land Pattern3 pads · Pitch 1.90mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOT-23-3)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
2.90 × 1.30 mm
Height (A) & Pitch (e)IPC-7351B
A=1.10mm · e=1.90mm
Pad Size (W × L)Level B
0.65 × 1.00 mm
Pins / Total PadsTopology
3P / 3Pad (SOT_SMALL)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SOT-23-3
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MCP809T-450I/TT (SOT-23-3)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MCP809T-450I/TT (SOT-23-3)?

Manufactured by MICROCHIP, the MCP809T-450I/TT is housed in a SOT-23-3 package with 3 pins and a 1.90 mm lead pitch. Key pins include: 1 (VSS: Ground Reference Pin (VSS)), 2 (RST#: Multiplexed I/O & Peripheral Pin RST# (General)), 3 (VDD: Power Supply Input (VDD — 3.3V / 5.0V Standard Logic)).

What are the IPC-7351B PCB Footprint dimensions for MCP809T-450I/TT?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP809T-450I/TT (SOT-23-3) has a nominal body envelope of 1.30 × 2.90 mm, pitch e = 1.90 mm, and 3 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP809T-450I/TT?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP809T-450I/TT (MICROCHIP, SOT-23-3) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (3 pins) & MCP809 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1VSSGND0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
2RST#Digital_IOSignal terminal RST# (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: RST#. Supported peripheral buses: General.
3VDDPower_InPrimary positive power supply input (VDD) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).