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MIC37302WU-TR (TO-263-5) — Symbol, Footprint IPC-7351B & 3D STEP Model

MIC37302WU-TR

MICROCHIPID: C461586TO-263-5 · 6 Pins · Pitch 1.70mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · MIC37302WU-TR (TO-263-5)1EN2VIN3GND6TAB5FLG/ADJ4VOUTGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.810.25.10-5.1-10.2mm
2. 2D FOOTPRINT
123456E=9.00mm · Pitch e=1.70mmD=10.10mm-13-11-9-7-5-3-1135791197531-1-3-5-7-9mm
3. 3D CAD MODEL
Package Body: 9.00mm × 10.10mm · Pitch: 1.70mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (6/6)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1ENISystem Enable & Hardware Reset (EN)
2VINPowerRegulated Power Output (VIN — 3.0V to 2.5V)
3GNDGNDGround Reference Pin (GND)
4VOUTPowerRegulated Power Output (VOUT — 3.0V to 2.5V)
5FLG/ADJI/OMultiplexed I/O & Peripheral Pin FLG/ADJ (General)
6TABI/OMultiplexed I/O & Peripheral Pin TAB (General)
PIN 1 EN
I
System Enable & Hardware Reset (EN)
Design note: Enable(Input):CMOScompatiblecontrolinput . Logichigh=enable Logiclow=shutdown Donotleavefloating , . .
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 15 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: MIC37302WU-TR (MICROCHIP · TO-263-5)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
MIC37302WU-TR (TO-263-5) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
MIC37302WU-TR (TO-263-5) - 2. Standard Pinout (Top View)
True package pinout (6 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
MIC37302WU-TR (TO-263-5) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
MIC37302WU-TR (TO-263-5) - 4. Package Dimensions (D×E×A)
TO-263-5 · 9.00×10.10mm · Pitch 1.70mmExpand ›
5. Recommended Land PatternLAND PATTERN
MIC37302WU-TR (TO-263-5) - 5. Recommended Land Pattern
IPC-7351B Footprint (6 Pads)Expand ›
6. Application SchematicSCHEMATIC
MIC37302WU-TR (TO-263-5) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (15 figures · Page 1/2)
Showing 1–12 of 15 uncropped original figures for MIC37302
P3 · p03_fig01EXACT PACKAGE
MIC37302WU-TR (TO-263-5) — (Top View)
(Top View)
P3 · p03_fig03EXACT PACKAGE
MIC37302WU-TR (TO-263-5) — (Top View)
(Top View)
P1 · p01_fig01376×200px
MIC37302WU-TR (TO-263-5) — 3.0A, Low Voltage μCap LDO Regulator
3.0A, Low Voltage μCap LDO Regulator
P2 · p02_fig01644×309px
MIC37302WU-TR (TO-263-5) — Typical Application Circuits
Typical Application Circuits
P2 · p02_fig02861×327px
MIC37302WU-TR (TO-263-5) — 2.5V Regulator Adjustable Regulator
2.5V Regulator Adjustable Regulator
P2 · p02_fig01P2
MIC37302WU-TR (TO-263-5) — Datasheet Page 2 (p02_fig01)
Datasheet Page 2 (p02_fig01)
P3 · p03_fig04646×317px
MIC37302WU-TR (TO-263-5) — (Top View)
(Top View)
P3 · p03_fig05477×299px
MIC37302WU-TR (TO-263-5) — 3 mm x 3 mm (DFN) (Top View)
3 mm x 3 mm (DFN) (Top View)
P15 · p15_fig011777×2336px
MIC37302WU-TR (TO-263-5) — 5.1 Package Marking Information
5.1 Package Marking Information
P15 · p15_fig01P15
MIC37302WU-TR (TO-263-5) — Datasheet Page 15 (p15_fig01)
Datasheet Page 15 (p15_fig01)
P17 · p17_fig011567×1651px
MIC37302WU-TR (TO-263-5) — Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.
P17 · p17_fig01P17
MIC37302WU-TR (TO-263-5) — Datasheet Page 17 (p17_fig01)
Datasheet Page 17 (p17_fig01)
Page 1 / 2 (15 extracted figures)

Technical Specifications & Part Details (MIC37302WU-TR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:MIC37302WU-TR (TO-263-5) is a 6-pin standard electronic & interconnect component featuring a 10.10 × 9.00 × 4.50 mm mechanical envelope (lead pitch e = 1.70 mm). Rated for 3.0V to 2.5V supply operation across 40°C to +125°C with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
3.0V to 2.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
40°C to +125°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
10.10 × 9.00 × 4.50 mm (A1=0.08 mm)
Package family: TO263 (TO-263-5)
Pin Count & Lead PitchN / e
6 Pins | Pitch e = 1.70 mm (66.9 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol6 auto-grouped pins
OK
IPC-7351B Land Pattern6 pads · Pitch 1.70mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (TO-263-5)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
10.10 × 9.00 mm
Height (A) & Pitch (e)IPC-7351B
A=4.50mm · e=1.70mm
Pad Size (W × L)Level B
1.02 × 3.36 mm
Pins / Total PadsTopology
6P / 6Pad (SOT_TAB)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
TO-263-5
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC37302WU-TR (TO-263-5)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC37302WU-TR (TO-263-5)?

Manufactured by MICROCHIP, the MIC37302WU-TR is housed in a TO-263-5 package with 6 pins and a 1.70 mm lead pitch, supporting a VCC supply range of 3.0V to 2.5V. Key pins include: 1 (EN: System Enable & Hardware Reset (EN)), 2 (VIN: Regulated Power Output (VIN — 3.0V to 2.5V)), 3 (GND: Ground Reference Pin (GND)), 4 (VOUT: Regulated Power Output (VOUT — 3.0V to 2.5V)), 5 (FLG/ADJ: Multiplexed I/O & Peripheral Pin FLG/ADJ (General)), 6 (TAB: Multiplexed I/O & Peripheral Pin TAB (General)).

What are the IPC-7351B PCB Footprint dimensions for MIC37302WU-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC37302WU-TR (TO-263-5) has a nominal body envelope of 9.00 × 10.10 mm, pitch e = 1.70 mm, and 6 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC37302WU-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC37302WU-TR (MICROCHIP, TO-263-5) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (6 pins) & MIC37302 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1ENDigital_IOChip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
2VINPower_OutRegulated power output rail (VIN) operating in the 3.0V to 2.5V domain (Max rating: 3.0V).
3GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
4VOUTPower_OutRegulated power output rail (VOUT) operating in the 3.0V to 2.5V domain (Max rating: 3.0V).
5FLG/ADJDigital_IOSignal terminal FLG/ADJ (I/O, 3.0V to 2.5V domain). Multiplexed alternate functions: FLG/ADJ. Supported peripheral buses: General.
6TABDigital_IOSignal terminal TAB (I/O, 3.0V to 2.5V domain). Multiplexed alternate functions: TAB. Supported peripheral buses: General.
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