TSSOP-20 · 20P
Synchronized Pinout (Symbol / 2D / 3D) (21/21)
Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D| Pin | Symbol | Type | Function (EN) |
|---|---|---|---|
| 1 | IO1 | I/O | General Purpose Digital I/O Pin IO1 |
| 2 | IO2 | I/O | General Purpose Digital I/O Pin IO2 |
| 3 | 3V3 | Power | 3.3V Main Power Supply Rail (3.0V ~ 3.6V) |
| 4 | NC | NC | No Connect (Leave Floating) |
| 5 | PC1 I/O/A PC1 | I/O | Multiplexed I/O & Peripheral Pin PC1 I/O/A PC1 (General) |
| 6 | PA0 I/O/A PA0 | I/O | Multiplexed I/O & Peripheral Pin PA0 I/O/A PA0 (UART) |
| 7 | GND P GND | GND | Ground Reference Pin (GND P GND) |
| 8 | IO0 | I/O | GPIO0 / RTC_GPIO0 (Chip Boot Mode Strapping Pin) |
| 9 | V P VDD DD | Power | Power Supply Input (V P VDD DD — 2V~5.5V) |
| 10 | PA4 I/O/A PA4 | I/O | Multiplexed I/O & Peripheral Pin PA4 I/O/A PA4 (UART) |
| 11 | IO6 | I/O | GPIO6 / RTC_GPIO6 / TOUCH6 / ADC1_CH5 |
| 12 | PA6 I/O/A PA6 | I/O | Multiplexed I/O & Peripheral Pin PA6 I/O/A PA6 (UART, SPI) |
| 13 | PB11/T1C3/T2C1N_/RX1 | I/O | Multiplexed I/O & Peripheral Pin PB11/T1C3/T2C1N_/RX1 (General) |
| 14 | IO16 | I/O | GPIO16 / RTC_GPIO16 / U0CTS / ADC2_CH5 / XTAL_32K_N |
| 15 | PB12/T1C4_/T2C2N_ | I/O | Multiplexed I/O & Peripheral Pin PB12/T1C4_/T2C2N_ (General) |
| 16 | IO18 | I/O | GPIO18 / RTC_GPIO18 / U1RXD / ADC2_CH7 / CLK_OUT3 |
| 17 | IO8 | I/O | GPIO8 / RTC_GPIO8 / TOUCH8 / ADC1_CH7 / SUBSPICS1 |
| 18 | IO19 | I/O | GPIO19 / RTC_GPIO19 / USB_D- / U1RTS / ADC2_CH8 |
| 19 | IO20 | I/O | GPIO20 / RTC_GPIO20 / USB_D+ / U1CTS / ADC2_CH9 |
| 20 | IO9 | I/O | GPIO9 / RTC_GPIO9 / TOUCH9 / ADC1_CH8 / FSPIHD |
| 21 | GND | GND | Ground Reference Pin (GND) |
PIN 1 IO1
I/OGeneral Purpose Digital I/O Pin IO1
Design note: 3.3V logic domain (3.6V absolute max), 40mA max drive current.
IPC-7351B Solder Density & Span C/G/Z Tuner
Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 8 Extracted Figures)
Read the original datasheet PDF directly or click any drawing to view fullscreen1. Realistic 3D PackageREPRESENTATIVE
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
True package pinout (21 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
QFN-20-EP(3x3) · 3.00×3.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
IPC-7351B Footprint (21 Pads)Expand ›
6. Application SchematicSCHEMATIC
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (8 figures · Page 1/1)
Showing 1–8 of 8 uncropped original figures for CH32X035 / CH32X033
P18 · p18_fig01EXACT PACKAGE
P2 · p02_fig011815×850px
P11 · p11_fig011874×1871px
P11 · p11_fig01P11
P18 · p18_fig01P18
P25 · p25_fig01454×306px
P32 · p32_fig011852×1256px
P32 · p32_fig021852×506px
Technical Specifications & Part Details (CH32X035F8U6)
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)Detailed Overview:CH32X035F8U6 (QFN-20-EP(3x3)) is a 20-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 0.85 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 2V~5.5V supply operation across -40°C ~ +85°C (Industrial Grade) with integrated USB, UART, SPI, I2C, ADC, PWM interfaces.
Operating Supply VoltageV_CC / V_DD
2V~5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
48
MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
3.00 × 3.00 × 0.85 mm (A1=0.03 mm)
Package family: QFN (QFN-20-EP(3x3))
Pin Count & Lead PitchN / e
20 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
USB, UART, SPI, I2C, ADC, PWM
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.
5-Point Standards Verification
Automated compliance checks prior to exportIEEE-315 Symbol21 auto-grouped pins
IPC-7351B Land Pattern21 pads · Pitch 0.50mm
IPC-7525 60% Solder PasteEPAD 1.70×1.70mm windowed grid
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
Hardware Verification & Community Engineering Reviews
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet5.00 PCB Verified
IPC-7351B
Select package variant or sibling MPN sharing this datasheetFamily Variants & Same Datasheet Chips — CH32X035 / CH32X033 (5)
QFN-20-EP(3x3) · 21P
IPC-7351B
21P3.0×3.0×0.85mmP=0.4mm
CH32X035 / CH32X033 (QFN-20-EP(3x3))
QSOP28 · 28P
QFN-28(4X4) · 29P
IPC-7351B
29P4.0×4.0×0.85mmP=0.5mm
CH32X035 / CH32X033 (QFN-28(4X4))
LQFP-48(7x7) · 48P
IPC-7351B
48P7.0×7.0×1.40mmP=0.5mm
CH32X035 / CH32X033 (LQFP-48(7x7))
Mechanical Dimensions & Land Pattern (QFN-20-EP(3x3))
Extracted from Datasheet & IPC-7351B NormalizedPackage Body (D × E)Nominal
3.00 × 3.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.85mm · e=0.50mm
Pad Size (W × L)Level B
0.28 × 0.80 mm
Pins / Total PadsTopology
21P / 21Pad (QUAD_ROW)
Recommended Companion BOM & Drop-In Equivalents
Passive external components per reference schematic and 1:1 pin-compatible alternatives| Designator / Replacement MPN | Value / Package | Function & PCB Layout Rule |
|---|---|---|
| N/A BOM | Per application circuit QFN-20-EP(3x3) | Size power & signal trace widths for rated load current following IPC-2221 clearance rules. |
Technical Frequently Asked Questions (FAQ) — CH32X035F8U6 (QFN-20-EP(3x3))
Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formatsWhat is the Pinout and operating voltage specification of CH32X035F8U6 (QFN-20-EP(3x3))?
Manufactured by WCH, the CH32X035F8U6 is housed in a QFN-20-EP(3x3) package with 21 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 2V~5.5V. Key pins include: 1 (IO1: General Purpose Digital I/O Pin IO1), 2 (IO2: General Purpose Digital I/O Pin IO2), 3 (3V3: 3.3V Main Power Supply Rail (3.0V ~ 3.6V)), 4 (NC: No Connect (Leave Floating)), 5 (PC1 I/O/A PC1: Multiplexed I/O & Peripheral Pin PC1 I/O/A PC1 (General)), 6 (PA0 I/O/A PA0: Multiplexed I/O & Peripheral Pin PA0 I/O/A PA0 (UART)).
What are the IPC-7351B PCB Footprint dimensions for CH32X035F8U6?
Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), CH32X035F8U6 (QFN-20-EP(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.50 mm, and 21 copper pads plus a central exposed thermal pad (EPAD) of 1.70 × 1.70 mm with a 60% IPC-7525 windowed solder paste grid.
Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for CH32X035F8U6?
You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for CH32X035F8U6 (WCH, QFN-20-EP(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.
Static Reference Appendix: Pinout Table (21 pins) & CH32X035 / CH32X033 Family VariantsExpand static table
| Pin # | Signal Name | Electrical Type | Functional Description & Design Notes |
|---|---|---|---|
| 1 | IO1 | Digital_IO | General Purpose Digital I/O Pin IO1 |
| 2 | IO2 | Digital_IO | General Purpose Digital I/O Pin IO2 |
| 3 | 3V3 | Power_In | 3.3V Main Power Supply Rail (3.0V ~ 3.6V) |
| 4 | NC | No_Connect | No Connect (Leave Floating) |
| 5 | PC1 I/O/A PC1 | Digital_IO | Signal terminal PC1 I/O/A PC1 (I/O, 2V~5.5V domain). Multiplexed alternate functions: PC1 I/O/A PC1. Supported peripheral buses: General. |
| 6 | PA0 I/O/A PA0 | Digital_IO | Signal terminal PA0 I/O/A PA0 (I/O, 2V~5.5V domain). Multiplexed alternate functions: PA0 I/O/A PA0. Supported peripheral buses: UART. |
| 7 | GND P GND | GND | 0V electrical ground return terminal (GND P GND) for internal core logic, I/O drivers, and analog sub-blocks. |
| 8 | IO0 | Digital_IO | GPIO0 / RTC_GPIO0 (Chip Boot Mode Strapping Pin) |
| 9 | V P VDD DD | Power_In | Primary positive power supply input (V P VDD DD) operating in the 2V~5.5V domain (Max rating: 5.5V). |
| 10 | PA4 I/O/A PA4 | Digital_IO | Signal terminal PA4 I/O/A PA4 (I/O, 2V~5.5V domain). Multiplexed alternate functions: PA4 I/O/A PA4. Supported peripheral buses: UART. |
| 11 | IO6 | Digital_IO | GPIO6 / RTC_GPIO6 / TOUCH6 / ADC1_CH5 |
| 12 | PA6 I/O/A PA6 | Digital_IO | Signal terminal PA6 I/O/A PA6 (I/O, 2V~5.5V domain). Multiplexed alternate functions: PA6 I/O/A PA6. Supported peripheral buses: UART, SPI. |
| 13 | PB11/T1C3/T2C1N_/RX1 | Digital_IO | Signal terminal PB11/T1C3/T2C1N_/RX1 (I/O, 2V~5.5V domain). Multiplexed alternate functions: PB11/T1C3/T2C1N_/RX1. Supported peripheral buses: General. |
| 14 | IO16 | Digital_IO | GPIO16 / RTC_GPIO16 / U0CTS / ADC2_CH5 / XTAL_32K_N |
| 15 | PB12/T1C4_/T2C2N_ | Digital_IO | Signal terminal PB12/T1C4_/T2C2N_ (I/O, 2V~5.5V domain). Multiplexed alternate functions: PB12/T1C4_/T2C2N_. Supported peripheral buses: General. |
| 16 | IO18 | Digital_IO | GPIO18 / RTC_GPIO18 / U1RXD / ADC2_CH7 / CLK_OUT3 |
| 17 | IO8 | Digital_IO | GPIO8 / RTC_GPIO8 / TOUCH8 / ADC1_CH7 / SUBSPICS1 |
| 18 | IO19 | Digital_IO | GPIO19 / RTC_GPIO19 / USB_D- / U1RTS / ADC2_CH8 |
| 19 | IO20 | Digital_IO | GPIO20 / RTC_GPIO20 / USB_D+ / U1CTS / ADC2_CH9 |
| 20 | IO9 | Digital_IO | GPIO9 / RTC_GPIO9 / TOUCH9 / ADC1_CH8 / FSPIHD |
| 21 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |