FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) — Symbol, Footprint IPC-7351B & 3D STEP Model

FAN5341UMPX-F106

onsemiID: C3213615UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT · 7 Pins · Pitch 0.65mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT)1VOUT2VIN3EN4FB7EP6GND5SWGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.810.25.10-5.1-10.2mm
2. 2D FOOTPRINT
1234567E=2.00mm · Pitch e=0.65mmD=2.00mm-3-2-101233210-1-2-3mm
3. 3D CAD MODEL
Package Body: 2.00mm × 2.00mm · Pitch: 0.65mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (7/7)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1VOUTPowerRegulated Power Output (VOUT — 2.7 V to 5.5 V)
2VINPowerPower Supply Input (VIN — 2.7 V to 5.5 V)
3ENISystem Enable & Hardware Reset (EN)
4FBI/OMultiplexed I/O & Peripheral Pin FB (General)
5SWI/OMultiplexed I/O & Peripheral Pin SW (General)
6GNDGNDGround Reference Pin (GND)
7EPGNDExposed Thermal & Ground Pad (EP)
PIN 1 VOUT
Power
Regulated Power Output (VOUT — 2.7 V to 5.5 V)
Design note: BoostOutputVoltage Outputoftheboostregulator ConnecttheLEDstothispin Connect Capaci. . . COUT (Output t or) to G ND .
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 11 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: FAN5341UMPX-F106 (onsemi · UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) - 2. Standard Pinout (Top View)
True package pinout (7 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) - 4. Package Dimensions (D×E×A)
UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT · 2.00×2.00mm · Pitch 0.65mmExpand ›
5. Recommended Land PatternLAND PATTERN
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) - 5. Recommended Land Pattern
IPC-7351B Footprint (7 Pads)Expand ›
6. Application SchematicSCHEMATIC
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (11 figures · Page 1/1)
Showing 1–11 of 11 uncropped original figures for FAN5341
P10 · p10_fig01EXACT PACKAGE
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) — UDFN6 2x2, 0.65P | CASE 517DS | ISSUE O | DATE 31 OCT 2016 | MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS | 98AON13697G DOCUMENT NUMBER: | DESCRIPTION: | Electronic versions are uncontrolled except when accessed directly from the Document Rep
UDFN6 2x2, 0.65P | CASE 517DS | ISSUE O | DATE 31 OCT 2016 | MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS | 98AON13697G DOCUMENT NUMBER: | DESCRIPTION: | Electronic versions are uncontrolled except when accessed directly from the Document Rep
P1 · p01_fig01424×386px
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) — www.onsemi.com
www.onsemi.com
P1 · p01_fig01P1
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) — Datasheet Page 1 (p01_fig01)
Datasheet Page 1 (p01_fig01)
P2 · p02_fig011480×870px
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) — Figure 1. Typical Application
Figure 1. Typical Application
P2 · p02_fig021489×927px
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) — Figure 2. Functional Block Diagram
Figure 2. Functional Block Diagram
P2 · p02_fig02P2
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) — Datasheet Page 2 (p02_fig02)
Datasheet Page 2 (p02_fig02)
P3 · p03_fig01547×350px
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) — Figure 3. UMLP6 Package (Top View)
Figure 3. UMLP6 Package (Top View)
P3 · p03_fig021869×1354px
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) — Figure 3. UMLP6 Package (Top View)
Figure 3. UMLP6 Package (Top View)
P3 · p03_fig02P3
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) — Datasheet Page 3 (p03_fig02)
Datasheet Page 3 (p03_fig02)
P9 · p09_fig011496×702px
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) — Figure 15. Recommended Component Placement
Figure 15. Recommended Component Placement
P10 · p10_fig01P10
FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) — Datasheet Page 10 (p10_fig01)
Datasheet Page 10 (p10_fig01)

Technical Specifications & Part Details (FAN5341UMPX-F106)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) is a 7-pin standard electronic & interconnect component featuring a 2.00 × 2.00 × 0.85 mm mechanical envelope (lead pitch e = 0.65 mm). Rated for 2.7 V to 5.5 V supply operation across 40°C to 85°C with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
2.7 V to 5.5 V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
40°C to 85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
1.2 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
2.00 × 2.00 × 0.85 mm (A1=0.03 mm)
Package family: DFN (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT)
Pin Count & Lead PitchN / e
7 Pins | Pitch e = 0.65 mm (25.6 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol7 auto-grouped pins
OK
IPC-7351B Land Pattern7 pads · Pitch 0.65mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
2.00 × 2.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.85mm · e=0.65mm
Pad Size (W × L)Level B
0.34 × 0.58 mm
Pins / Total PadsTopology
7P / 7Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT)?

Manufactured by onsemi, the FAN5341UMPX-F106 is housed in a UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT package with 7 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 2.7 V to 5.5 V. Key pins include: 1 (VOUT: Regulated Power Output (VOUT — 2.7 V to 5.5 V)), 2 (VIN: Power Supply Input (VIN — 2.7 V to 5.5 V)), 3 (EN: System Enable & Hardware Reset (EN)), 4 (FB: Multiplexed I/O & Peripheral Pin FB (General)), 5 (SW: Multiplexed I/O & Peripheral Pin SW (General)), 6 (GND: Ground Reference Pin (GND)).

What are the IPC-7351B PCB Footprint dimensions for FAN5341UMPX-F106?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), FAN5341UMPX-F106 (UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) has a nominal body envelope of 2.00 × 2.00 mm, pitch e = 0.65 mm, and 7 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for FAN5341UMPX-F106?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for FAN5341UMPX-F106 (onsemi, UDFN-6_L2.0-W2.0-P0.65-BL-EP_MICROCHIP_MT) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (7 pins) & FAN5341 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1VOUTPower_OutRegulated power output rail (VOUT) operating in the 2.7 V to 5.5 V domain (Max rating: 5.5V).
2VINPower_InPrimary positive power supply input (VIN) operating in the 2.7 V to 5.5 V domain (Max rating: 5.5V).
3ENDigital_IOChip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
4FBDigital_IOSignal terminal FB (I/O, 2.7 V to 5.5 V domain). Multiplexed alternate functions: FB. Supported peripheral buses: General.
5SWDigital_IOSignal terminal SW (I/O, 2.7 V to 5.5 V domain). Multiplexed alternate functions: SW. Supported peripheral buses: General.
6GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
7EPGNDBottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.