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STM32F042F6P7 (TSSOP-20(4.4x6.5)) — Symbol, Footprint IPC-7351B & 3D STEP Model

STM32F042F6P7

STID: C2969784TSSOP-20(4.4x6.5) · 20 Pins · Pitch 0.65mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · STM32F042F6P7 (TSSOP-20(4.4x6.5))1PB8BOOT0 -2PF0OSC IN -_3PF1OSC OUT -4NRST510 -Jan-20176PA07PA18PA29PA310PA420PA1419PA1318PA1017PA916VDDIO215VSS14PB113PA712PA611PA5Grid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.817.812.77.62.5-2.5-7.6-12.7-17.8mm
2. 2D FOOTPRINT
1234567891011121314151617181920E=4.40mm · Pitch e=0.65mmD=6.50mm-5-4-3-2-1012345543210-1-2-3-4-5mm
3. 3D CAD MODEL
Package Body: 4.40mm × 6.50mm · Pitch: 0.65mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (20/20)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1PB8BOOT0 -I/OMultiplexed I/O & Peripheral Pin PB8BOOT0 - (I2C, CAN)
2PF0OSC IN -_ (PF0)I/OMultiplexed I/O & Peripheral Pin PF0OSC IN -_ (PF0) (I2C, RTC/CLK)
3PF1OSC OUT -_ (PF1)I/OMultiplexed I/O & Peripheral Pin PF1OSC OUT -_ (PF1) (I2C, RTC/CLK)
4NRSTISystem Enable & Hardware Reset (NRST)
510 -Jan-2017I/OMultiplexed I/O & Peripheral Pin 10 -Jan-2017 (General)
6PA0I/OMultiplexed I/O & Peripheral Pin PA0 (UART, ADC, PWM, RTC/CLK)
7PA1I/OMultiplexed I/O & Peripheral Pin PA1 (UART, ADC, PWM)
8PA2I/OMultiplexed I/O & Peripheral Pin PA2 (UART, ADC, PWM)
9PA3I/OMultiplexed I/O & Peripheral Pin PA3 (UART, ADC, PWM)
10PA4I/OMultiplexed I/O & Peripheral Pin PA4 (USB, UART, SPI, ADC)
11PA5I/OMultiplexed I/O & Peripheral Pin PA5 (SPI, ADC, PWM)
12PA6I/OMultiplexed I/O & Peripheral Pin PA6 (SPI, ADC, PWM)
13PA7I/OMultiplexed I/O & Peripheral Pin PA7 (SPI, ADC, PWM)
14PB1I/OMultiplexed I/O & Peripheral Pin PB1 (ADC, PWM)
15VSSGNDGround Reference Pin (VSS)
16VDDIO2PowerPower Supply Input (VDDIO2 — 3.3V VDD (Max 4.0V))
17PA9I/OMultiplexed I/O & Peripheral Pin PA9 (UART, I2C, PWM)
18PA10I/OMultiplexed I/O & Peripheral Pin PA10 (UART, I2C, PWM)
19PA13I/OMultiplexed I/O & Peripheral Pin PA13 (USB)
20PA14I/OMultiplexed I/O & Peripheral Pin PA14 (UART)
PIN 1 PB8BOOT0 -
I/O
Multiplexed I/O & Peripheral Pin PB8BOOT0 - (I2C, CAN)
Design note: Alt: I2C1_SCLCEC , , TIM16_CH1 , TSC_SYNC , CAN_RX | Add: Bootmemory selection
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 17 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: STM32F042F6P7 (ST · TSSOP-20(4.4x6.5))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
STM32F042F6P7 (TSSOP-20(4.4x6.5)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
STM32F042F6P7 (TSSOP-20(4.4x6.5)) - 2. Standard Pinout (Top View)
True package pinout (20 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
STM32F042F6P7 (TSSOP-20(4.4x6.5)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
STM32F042F6P7 (TSSOP-20(4.4x6.5)) - 4. Package Dimensions (D×E×A)
TSSOP-20(4.4x6.5) · 4.40×6.50mm · Pitch 0.65mmExpand ›
5. Recommended Land PatternLAND PATTERN
STM32F042F6P7 (TSSOP-20(4.4x6.5)) - 5. Recommended Land Pattern
IPC-7351B Footprint (20 Pads)Expand ›
6. Application SchematicSCHEMATIC
STM32F042F6P7 (TSSOP-20(4.4x6.5)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (17 figures · Page 1/2)
Showing 1–12 of 17 uncropped original figures for STM32F042
P1 · p01_fig01EXACT PACKAGE
STM32F042F6P7 (TSSOP-20(4.4x6.5)) — ARM®-based 32-bit MCU, up to 32 KB Flash, crystal-less USB FS 2.0, CAN, 9 timers, ADC and comm. interfaces, 2.0 - 3.6 V | Datasheet - production data | LQFP48 7x7 mm UFQFPN48 7x7 mm WLCSP36 UFQFPN32 5x5 mm UFQFPN28 4x4 mm | TSSOP20 LQFP32 7
ARM®-based 32-bit MCU, up to 32 KB Flash, crystal-less USB FS 2.0, CAN, 9 timers, ADC and comm. interfaces, 2.0 - 3.6 V | Datasheet - production data | LQFP48 7x7 mm UFQFPN48 7x7 mm WLCSP36 UFQFPN32 5x5 mm UFQFPN28 4x4 mm | TSSOP20 LQFP32 7
P31 · p31_fig01EXACT PACKAGE
STM32F042F6P7 (TSSOP-20(4.4x6.5)) — Figure 9. TSSOP20 package
Figure 9. TSSOP20 package
P108 · p108_fig01EXACT PACKAGE
STM32F042F6P7 (TSSOP-20(4.4x6.5)) — Figure 51.TSSOP20 package outline
Figure 51.TSSOP20 package outline
P109 · p109_fig01EXACT PACKAGE
STM32F042F6P7 (TSSOP-20(4.4x6.5)) — Figure 52. Recommended footprint for TSSOP20 package
Figure 52. Recommended footprint for TSSOP20 package
P29 · p29_fig011546×995px
STM32F042F6P7 (TSSOP-20(4.4x6.5)) — Figure 5. WLCSP36 package pinout
Figure 5. WLCSP36 package pinout
P29 · p29_fig021546×799px
STM32F042F6P7 (TSSOP-20(4.4x6.5)) — Figure 6. LQFP32 package pinout
Figure 6. LQFP32 package pinout
P31 · p31_fig01P31
STM32F042F6P7 (TSSOP-20(4.4x6.5)) — Datasheet Page 31 (p31_fig01)
Datasheet Page 31 (p31_fig01)
P43 · p43_fig011546×1755px
STM32F042F6P7 (TSSOP-20(4.4x6.5)) — Figure 13. Power supply scheme
Figure 13. Power supply scheme
P43 · p43_fig01P43
STM32F042F6P7 (TSSOP-20(4.4x6.5)) — Datasheet Page 43 (p43_fig01)
Datasheet Page 43 (p43_fig01)
P63 · p63_fig011546×718px
STM32F042F6P7 (TSSOP-20(4.4x6.5)) — Figure 17. Typical application with an 8 MHz crystal
Figure 17. Typical application with an 8 MHz crystal
P81 · p81_fig011751×902px
STM32F042F6P7 (TSSOP-20(4.4x6.5)) — Figure 26. ADC accuracy characteristics
Figure 26. ADC accuracy characteristics
P81 · p81_fig021546×667px
STM32F042F6P7 (TSSOP-20(4.4x6.5)) — Figure 27. Typical connection diagram using the ADC
Figure 27. Typical connection diagram using the ADC
Page 1 / 2 (17 extracted figures)

Technical Specifications & Part Details (STM32F042F6P7)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Embedded Microcontroller Unit (MCU)
Detailed Overview:STM32F042F6P7 (TSSOP-20(4.4x6.5)) is a 20-pin embedded microcontroller unit (mcu) featuring a 6.50 × 4.40 × 1.20 mm mechanical envelope (lead pitch e = 0.65 mm). Rated for 2 V to 3.6 V supply operation across -40°C ~ +85°C (Industrial Grade) with integrated USB, UART, SPI, I2C, I2S, ADC, PWM, JTAG / SWD, IrDA, CAN, RTC/CLK interfaces.
Operating Supply VoltageV_CC / V_DD
2 V to 3.6 V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
48 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
7 5V-tolerant (FT) pins detected
Package Envelope (D × E × A)D × E × A
6.50 × 4.40 × 1.20 mm (A1=0.10 mm)
Package family: TSSOP (TSSOP-20(4.4x6.5))
Pin Count & Lead PitchN / e
20 Pins | Pitch e = 0.65 mm (25.6 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
USB, UART, SPI, I2C, I2S, ADC, PWM, JTAG / SWD, IrDA, CAN, RTC/CLK
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Boot Strapping Pin Alert (PB8BOOT0 -): Do not force conflicting external pull-ups/pull-downs during POR reset.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol20 auto-grouped pins
OK
IPC-7351B Land Pattern20 pads · Pitch 0.65mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (TSSOP-20(4.4x6.5))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
6.50 × 4.40 mm
Height (A) & Pitch (e)IPC-7351B
A=1.20mm · e=0.65mm
Pad Size (W × L)Level B
0.42 × 1.45 mm
Pins / Total PadsTopology
20P / 20Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
TSSOP-20(4.4x6.5)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — STM32F042F6P7 (TSSOP-20(4.4x6.5))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of STM32F042F6P7 (TSSOP-20(4.4x6.5))?

Manufactured by ST, the STM32F042F6P7 is housed in a TSSOP-20(4.4x6.5) package with 20 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 2 V to 3.6 V. Key pins include: 1 (PB8BOOT0 -: Multiplexed I/O & Peripheral Pin PB8BOOT0 - (I2C, CAN)), 2 (PF0OSC IN -_ (PF0): Multiplexed I/O & Peripheral Pin PF0OSC IN -_ (PF0) (I2C, RTC/CLK)), 3 (PF1OSC OUT -_ (PF1): Multiplexed I/O & Peripheral Pin PF1OSC OUT -_ (PF1) (I2C, RTC/CLK)), 4 (NRST: System Enable & Hardware Reset (NRST)), 5 (10 -Jan-2017: Multiplexed I/O & Peripheral Pin 10 -Jan-2017 (General)), 6 (PA0: Multiplexed I/O & Peripheral Pin PA0 (UART, ADC, PWM, RTC/CLK)).

What are the IPC-7351B PCB Footprint dimensions for STM32F042F6P7?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), STM32F042F6P7 (TSSOP-20(4.4x6.5)) has a nominal body envelope of 4.40 × 6.50 mm, pitch e = 0.65 mm, and 20 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for STM32F042F6P7?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for STM32F042F6P7 (ST, TSSOP-20(4.4x6.5)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (20 pins) & STM32F042 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1PB8BOOT0 -Digital_IOSignal terminal PB8BOOT0 - (I/O, 3.3V VDD (5V-Tolerant FT) domain). Multiplexed alternate functions: I2C1_SCLCEC. Supported peripheral buses: I2C, CAN.
2PF0OSC IN -_ (PF0)Digital_IOSignal terminal PF0OSC IN -_ (PF0) (I/O, 3.3V VDD (5V-Tolerant FT) domain). Multiplexed alternate functions: I2C1_SDA. Supported peripheral buses: I2C, RTC/CLK.
3PF1OSC OUT -_ (PF1)Digital_IOSignal terminal PF1OSC OUT -_ (PF1) (I/O, 3.3V VDD (5V-Tolerant FT) domain). Multiplexed alternate functions: I2C1_SCL. Supported peripheral buses: I2C, RTC/CLK.
4NRSTDigital_IOActive-low hardware reset terminal (NRST): pulling this pin Low resets the processor core and peripherals.
510 -Jan-2017Digital_IOSignal terminal 10 -Jan-2017 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: 10 -Jan-2017. Supported peripheral buses: General.
6PA0Digital_IOSignal terminal PA0 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA0. Supported peripheral buses: UART, ADC, PWM, RTC/CLK.
7PA1Digital_IOSignal terminal PA1 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA1. Supported peripheral buses: UART, ADC, PWM.
8PA2Digital_IOSignal terminal PA2 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA2. Supported peripheral buses: UART, ADC, PWM.
9PA3Digital_IOSignal terminal PA3 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PA3. Supported peripheral buses: UART, ADC, PWM.
10PA4Digital_IOSignal terminal PA4 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: SPI1_NSSI2S1WS. Supported peripheral buses: USB, UART, SPI, ADC.
11PA5Digital_IOSignal terminal PA5 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: SPI1_SCKI2S1CK. Supported peripheral buses: SPI, ADC, PWM.
12PA6Digital_IOSignal terminal PA6 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: SPI1_MISOI2S1MCK. Supported peripheral buses: SPI, ADC, PWM.
13PA7Digital_IOSignal terminal PA7 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: SPI1_MOSII2S1SD. Supported peripheral buses: SPI, ADC, PWM.
14PB1Digital_IOSignal terminal PB1 (I/O, 3.3V VDD (Max 4.0V) domain). Multiplexed alternate functions: PB1. Supported peripheral buses: ADC, PWM.
15VSSGND0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
16VDDIO2Power_InPrimary positive power supply input (VDDIO2) operating in the 3.3V VDD (Max 4.0V) domain (Max rating: 4.0V).
17PA9Digital_IOSignal terminal PA9 (I/O, 3.3V VDD (5V-Tolerant FT) domain). Multiplexed alternate functions: I2C1_SCL. Supported peripheral buses: UART, I2C, PWM.
18PA10Digital_IOSignal terminal PA10 (I/O, 3.3V VDD (5V-Tolerant FT) domain). Multiplexed alternate functions: I2C1_SDA. Supported peripheral buses: UART, I2C, PWM.
19PA13Digital_IOSignal terminal PA13 (I/O, 3.3V VDD (5V-Tolerant FT) domain). Multiplexed alternate functions: PA13. Supported peripheral buses: USB.
20PA14Digital_IOSignal terminal PA14 (I/O, 3.3V VDD (5V-Tolerant FT) domain). Multiplexed alternate functions: PA14. Supported peripheral buses: UART.
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