- · 39P
Synchronized Pinout (Symbol / 2D / 3D) (39/39)
Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D| Pin | Symbol | Type | Function (EN) |
|---|---|---|---|
| 1 | MTDO | I/O | Multiplexed I/O & Peripheral Pin MTDO (SWD/JTAG) |
| 2 | 3V3 | Power | Power Supply Input (3V3 — 3.3V VDD3P3 (3.0V ~ 3.6V)) |
| 3 | EN | I | System Enable & Hardware Reset (EN) |
| 4 | SENSOR_VP | I | Input-Only Pin SENSOR_VP (ADC, RTC/CLK) |
| 5 | SENSOR_VN | I | Input-Only Pin SENSOR_VN (ADC, RTC/CLK) |
| 6 | IO34 | I | Input-Only Pin IO34 (ADC, RTC/CLK) |
| 7 | IO35 | I | Input-Only Pin IO35 (ADC, RTC/CLK) |
| 8 | IO32 | I/O | Multiplexed I/O & Peripheral Pin IO32 (ADC, RTC/CLK, TOUCH) |
| 9 | IO33 | I/O | Multiplexed I/O & Peripheral Pin IO33 (ADC, RTC/CLK, TOUCH) |
| 10 | IO25 | I/O | Multiplexed I/O & Peripheral Pin IO25 (UART, ADC, DAC, RTC/CLK) |
| 11 | IO26 | I/O | Multiplexed I/O & Peripheral Pin IO26 (UART, ADC, DAC, RTC/CLK) |
| 12 | IO27 | I/O | Multiplexed I/O & Peripheral Pin IO27 (ADC, RTC/CLK, TOUCH) |
| 13 | IO14 | I/O | Multiplexed I/O & Peripheral Pin IO14 (ADC, SWD/JTAG, RTC/CLK, TOUCH) |
| 14 | IO12 | I/O | Multiplexed I/O & Peripheral Pin IO12 (ADC, SWD/JTAG, RTC/CLK, TOUCH) |
| 15 | GND | GND | Ground Reference Pin (GND) |
| 16 | IO13 | I/O | Multiplexed I/O & Peripheral Pin IO13 (ADC, SWD/JTAG, RTC/CLK, TOUCH) |
| 17 | NC* | I/O | Multiplexed I/O & Peripheral Pin NC* (General) |
| 18 | NC* | I/O | Multiplexed I/O & Peripheral Pin NC* (General) |
| 19 | NC* | I/O | Multiplexed I/O & Peripheral Pin NC* (General) |
| 20 | NC* | I/O | Multiplexed I/O & Peripheral Pin NC* (General) |
| 21 | NC* | I/O | Multiplexed I/O & Peripheral Pin NC* (General) |
| 22 | NC* | I/O | Multiplexed I/O & Peripheral Pin NC* (General) |
| 23 | IO15 | I/O | Multiplexed I/O & Peripheral Pin IO15 (ADC, SWD/JTAG, RTC/CLK, TOUCH) |
| 24 | IO2 | I/O | Multiplexed I/O & Peripheral Pin IO2 (ADC, RTC/CLK, TOUCH) |
| 25 | IO0 | I/O | Multiplexed I/O & Peripheral Pin IO0 (ADC, RTC/CLK, TOUCH) |
| 26 | IO4 | I/O | Multiplexed I/O & Peripheral Pin IO4 (ADC, RTC/CLK, TOUCH) |
| 27 | NC | I/O | Multiplexed I/O & Peripheral Pin NC (General) |
| 28 | NC | I/O | Multiplexed I/O & Peripheral Pin NC (General) |
| 29 | IO5 | I/O | Multiplexed I/O & Peripheral Pin IO5 (General) |
| 30 | IO18 | I/O | Multiplexed I/O & Peripheral Pin IO18 (General) |
| 31 | IO19 | I/O | Multiplexed I/O & Peripheral Pin IO19 (UART) |
| 32 | NC | I/O | Multiplexed I/O & Peripheral Pin NC (General) |
| 33 | IO21 | I/O | Multiplexed I/O & Peripheral Pin IO21 (General) |
| 34 | RXD0 | I/O | Multiplexed I/O & Peripheral Pin RXD0 (UART) |
| 35 | TXD0 | I/O | Multiplexed I/O & Peripheral Pin TXD0 (UART) |
| 36 | IO22 | I/O | Multiplexed I/O & Peripheral Pin IO22 (UART) |
| 37 | IO23 | I/O | Multiplexed I/O & Peripheral Pin IO23 (General) |
| 38 | GND | GND | Ground Reference Pin (GND) |
| 39 | GND | GND | Exposed Thermal & Ground Pad (GND) |
PIN 1 MTDO
I/OMultiplexed I/O & Peripheral Pin MTDO (SWD/JTAG)
Design note: Signal terminal MTDO (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: MTDO. Supported peripheral buses: SWD/JTAG.
IPC-7351B Solder Density & Span C/G/Z Tuner
Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 15 Extracted Figures)
Read the original datasheet PDF directly or click any drawing to view fullscreen1. Realistic 3D PackageREPRESENTATIVE
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
True package pinout (39 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
SMD,31.4x18mm · 18.00×31.40mm · Pitch 1.27mmExpand ›
5. Recommended Land PatternLAND PATTERN
IPC-7351B Footprint (47 Pads)Expand ›
6. Application SchematicSCHEMATIC
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (15 figures · Page 1/2)
Showing 1–12 of 15 uncropped original figures for ESP32-WROVER
P8 · p08_fig02EXACT PACKAGE
P20 · p20_fig02EXACT PACKAGE
P1 · p01_fig01642×314px
P8 · p08_fig011793×1143px
P19 · p19_fig011127×1175px
P19 · p19_fig021364×668px
P20 · p20_fig01267×613px
P20 · p20_fig031360×670px
P21 · p21_fig011746×1064px
P21 · p21_fig01P21
P22 · p22_fig01954×767px
P22 · p22_fig02881×1082px
Page 1 / 2 (15 extracted figures)
Technical Specifications & Part Details (ESP32-WROVER-IE(8MB))
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)Detailed Overview:ESP32-WROVER-IE(8MB) (SMD,31.4x18mm) is a 39-pin wireless wi-fi / bluetooth le soc module featuring a 31.40 × 18.00 × 3.30 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 3.0V ~ 3.6V (Typ 3.3V) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Wi-Fi, ADC, DAC, RTC/CLK, SWD/JTAG, TOUCH, UART interfaces.
Operating Supply VoltageV_CC / V_DD
3.0V ~ 3.6V (Typ 3.3V)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
2484
MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_TX(peak) ≈ 310 mA @ 3.3V | Deep-Sleep ≈ 10 µA | I_GPIO(max) = 40 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
31.40 × 18.00 × 3.30 mm (A1=0.00 mm)
Package family: CASTELLATED_MODULE (SMD,31.4x18mm)
Pin Count & Lead PitchN / e
39 Pins | Pitch e = 1.27 mm (50.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Wi-Fi, ADC, DAC, RTC/CLK, SWD/JTAG, TOUCH, UART
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Boot Strapping Pin Alert (MTDO, IO0): Do not force conflicting external pull-ups/pull-downs during POR reset.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.
5-Point Standards Verification
Automated compliance checks prior to exportIEEE-315 Symbol39 auto-grouped pins
IPC-7351B Land Pattern47 pads · Pitch 1.27mm
IPC-7525 60% Solder PasteEPAD 3.69×3.69mm windowed grid
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
Hardware Verification & Community Engineering Reviews
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet5.00 PCB Verified
IPC-7351B
Select package variant or sibling MPN sharing this datasheetFamily Variants & Same Datasheet Chips — ESP32-WROVER (20)
SMD,18x31.4mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,18x31.4mm)
SMD,18x31.4mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,18x31.4mm)
SMD,18x31.4mm · 39P
39P31.4×18.0×3.50mmP=1.27mm
ESP32-WROVER (SMD,18x31.4mm)
SMD,18x31.4mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,18x31.4mm)
SMD,18x31.4mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,18x31.4mm)
SMD,18x31.4mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,18x31.4mm)
SMD,31.4x18mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,31.4x18mm)
SMD,31.4x18mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,31.4x18mm)
SMD,31.4x18mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,31.4x18mm)
SMD,31.4x18mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,31.4x18mm)
SMD,31.4x18mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,31.4x18mm)
SMD,31.4x18mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,31.4x18mm)
SMD,31.4x18mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,31.4x18mm)
SMD,31.4x18mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,31.4x18mm)
SMD,31.4x18mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,31.4x18mm)
SMD,31.4x18mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,31.4x18mm)
SMD,31.4x18mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,31.4x18mm)
SMD,31.4x18mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,31.4x18mm)
SMD,31.4x18mm · 39P
39P31.4×18.0×3.30mmP=1.27mm
ESP32-WROVER (SMD,31.4x18mm)
Mechanical Dimensions & Land Pattern (SMD,31.4x18mm)
Extracted from Datasheet & IPC-7351B NormalizedPackage Body (D × E)Nominal
31.40 × 18.00 mm
Height (A) & Pitch (e)IPC-7351B
A=3.30mm · e=1.27mm
Pad Size (W × L)Level B
0.90 × 2.00 mm
Pins / Total PadsTopology
39P / 47Pad (CASTELLATED_MODULE)
Recommended Companion BOM & Drop-In Equivalents
Passive external components per reference schematic and 1:1 pin-compatible alternatives| Designator / Replacement MPN | Value / Package | Function & PCB Layout Rule |
|---|---|---|
| C1, C2 BOM | 22µF (or 10µF) X5R + 100nF X7R 0805 + 0402 | 3V3 supply decoupling for ~500mA Wi-Fi TX bursts — place closest to 3V3 pin; supply must deliver >= 600mA. |
| R_en + C_en BOM | R = 10kΩ to 3V3 + C = 1µF to GND 0402 / 0603 | Power-On Reset RC delay at EN (CHIP_PU) — 1µF capacitor at EN is REQUIRED for reliable cold boot. |
| R_boot + SW1 BOM | 10kΩ Pull-up + BOOT button 0402 + SMD | Firmware boot-mode strap (IO0 on ESP32/S2/S3, IO9 on ESP32-C3) — on C3 pull IO8 high via 10kΩ for UART/USB download. |
| D_esd BOM | USBLC6-2SC6 / LESD5D5.0CT1G SOT-23-6 / SOD-523 | ESD surge protection on USB D+/D- — place right next to USB Type-C connector before IO18/IO19/IO20. |
| ESP32-S3-MINI-1-N8 / 1U-N4R2 Espressif | 100% Drop-in | Same 15.4×15.4mm 65-pad footprint as ESP32-S2-MINI-2 — verify USB GPIO 19/20 pin mapping. |
Technical Frequently Asked Questions (FAQ) — ESP32-WROVER-IE(8MB) (SMD,31.4x18mm)
Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formatsWhat is the Pinout and operating voltage specification of ESP32-WROVER-IE(8MB) (SMD,31.4x18mm)?
Manufactured by ESPRESSIF, the ESP32-WROVER-IE(8MB) is housed in a SMD,31.4x18mm package with 39 pins and a 1.27 mm lead pitch. Key pins include: 1 (MTDO: Multiplexed I/O & Peripheral Pin MTDO (SWD/JTAG)), 2 (3V3: Power Supply Input (3V3 — 3.3V VDD3P3 (3.0V ~ 3.6V))), 3 (EN: System Enable & Hardware Reset (EN)), 4 (SENSOR_VP: Input-Only Pin SENSOR_VP (ADC, RTC/CLK)), 5 (SENSOR_VN: Input-Only Pin SENSOR_VN (ADC, RTC/CLK)), 6 (IO34: Input-Only Pin IO34 (ADC, RTC/CLK)).
What are the IPC-7351B PCB Footprint dimensions for ESP32-WROVER-IE(8MB)?
Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), ESP32-WROVER-IE(8MB) (SMD,31.4x18mm) has a nominal body envelope of 18.00 × 31.40 mm, pitch e = 1.27 mm, and 47 copper pads plus a central exposed thermal pad (EPAD) of 3.69 × 3.69 mm with a 60% IPC-7525 windowed solder paste grid.
Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for ESP32-WROVER-IE(8MB)?
You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for ESP32-WROVER-IE(8MB) (ESPRESSIF, SMD,31.4x18mm) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.
Static Reference Appendix: Pinout Table (39 pins) & ESP32-WROVER Family VariantsExpand static table
| Pin # | Signal Name | Electrical Type | Functional Description & Design Notes |
|---|---|---|---|
| 1 | MTDO | Digital_IO | Signal terminal MTDO (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: MTDO. Supported peripheral buses: SWD/JTAG. |
| 2 | 3V3 | Power_In | Primary positive power supply input (3V3) operating in the 3.3V VDD3P3 (3.0V ~ 3.6V) domain (Max rating: 3.6V). |
| 3 | EN | Digital_IO | Chip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset. |
| 4 | SENSOR_VP | Digital_IO | Signal terminal SENSOR_VP (I, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO36, ADC1_CH0, RTC_GPIO0. Supported peripheral buses: ADC, RTC/CLK. |
| 5 | SENSOR_VN | Digital_IO | Signal terminal SENSOR_VN (I, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO39, ADC1_CH3, RTC_GPIO3. Supported peripheral buses: ADC, RTC/CLK. |
| 6 | IO34 | Digital_IO | Signal terminal IO34 (I, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO34, ADC1_CH6, RTC_GPIO4. Supported peripheral buses: ADC, RTC/CLK. |
| 7 | IO35 | Digital_IO | Signal terminal IO35 (I, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO35, ADC1_CH7, RTC_GPIO5. Supported peripheral buses: ADC, RTC/CLK. |
| 8 | IO32 | Digital_IO | Signal terminal IO32 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO32, ADC1_CH4, TOUCH9, RTC_GPIO9. Supported peripheral buses: ADC, RTC/CLK, TOUCH. |
| 9 | IO33 | Digital_IO | Signal terminal IO33 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO33, ADC1_CH5, TOUCH8, RTC_GPIO8. Supported peripheral buses: ADC, RTC/CLK, TOUCH. |
| 10 | IO25 | Digital_IO | Signal terminal IO25 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO25, ADC2_CH8, RTC_GPIO6. Supported peripheral buses: UART, ADC, DAC, RTC/CLK. |
| 11 | IO26 | Digital_IO | Signal terminal IO26 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO26, ADC2_CH9, RTC_GPIO7. Supported peripheral buses: UART, ADC, DAC, RTC/CLK. |
| 12 | IO27 | Digital_IO | Signal terminal IO27 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17. Supported peripheral buses: ADC, RTC/CLK, TOUCH. |
| 13 | IO14 | Digital_IO | Signal terminal IO14 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS. Supported peripheral buses: ADC, SWD/JTAG, RTC/CLK, TOUCH. |
| 14 | IO12 | Digital_IO | Signal terminal IO12 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI. Supported peripheral buses: ADC, SWD/JTAG, RTC/CLK, TOUCH. |
| 15 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |
| 16 | IO13 | Digital_IO | Signal terminal IO13 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK. Supported peripheral buses: ADC, SWD/JTAG, RTC/CLK, TOUCH. |
| 17 | NC* | Digital_IO | Signal terminal NC* (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC*. Supported peripheral buses: General. |
| 18 | NC* | Digital_IO | Signal terminal NC* (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC*. Supported peripheral buses: General. |
| 19 | NC* | Digital_IO | Signal terminal NC* (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC*. Supported peripheral buses: General. |
| 20 | NC* | Digital_IO | Signal terminal NC* (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC*. Supported peripheral buses: General. |
| 21 | NC* | Digital_IO | Signal terminal NC* (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC*. Supported peripheral buses: General. |
| 22 | NC* | Digital_IO | Signal terminal NC* (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC*. Supported peripheral buses: General. |
| 23 | IO15 | Digital_IO | Signal terminal IO15 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO15, ADC2_CH3, TOUCH3, MTDO, RTC_GPIO13. Supported peripheral buses: ADC, SWD/JTAG, RTC/CLK, TOUCH. |
| 24 | IO2 | Digital_IO | Signal terminal IO2 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12. Supported peripheral buses: ADC, RTC/CLK, TOUCH. |
| 25 | IO0 | Digital_IO | Signal terminal IO0 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1. Supported peripheral buses: ADC, RTC/CLK, TOUCH. |
| 26 | IO4 | Digital_IO | Signal terminal IO4 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10. Supported peripheral buses: ADC, RTC/CLK, TOUCH. |
| 27 | NC | NC | Signal terminal NC (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC. Supported peripheral buses: General. |
| 28 | NC | NC | Signal terminal NC (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC. Supported peripheral buses: General. |
| 29 | IO5 | Digital_IO | Signal terminal IO5 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO5. Supported peripheral buses: General. |
| 30 | IO18 | Digital_IO | Signal terminal IO18 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO18. Supported peripheral buses: General. |
| 31 | IO19 | Digital_IO | Signal terminal IO19 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO19, U0CTS. Supported peripheral buses: UART. |
| 32 | NC | NC | Signal terminal NC (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: NC. Supported peripheral buses: General. |
| 33 | IO21 | Digital_IO | Signal terminal IO21 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO21. Supported peripheral buses: General. |
| 34 | RXD0 | Digital_IO | Signal terminal RXD0 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO3, U0RXD, CLK_OUT2. Supported peripheral buses: UART. |
| 35 | TXD0 | Digital_IO | Signal terminal TXD0 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO1, U0TXD, CLK_OUT3. Supported peripheral buses: UART. |
| 36 | IO22 | Digital_IO | Signal terminal IO22 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO22, U0RTS. Supported peripheral buses: UART. |
| 37 | IO23 | Digital_IO | Signal terminal IO23 (I/O, 3.3V VDD3P3 (3.0V ~ 3.6V) domain). Multiplexed alternate functions: GPIO23. Supported peripheral buses: General. |
| 38 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |
| 39 | GND | GND | Bottom exposed die attach pad (GND) providing primary thermal conduction path to the PCB and low-inductance 0V ground return. |