KP18062ESPA (SSOP-10-EP-150mil) — Symbol, Footprint IPC-7351B & 3D STEP Model

KP18062ESPA

Kiwi InstrumentsID: C2692540SSOP-10-EP-150mil · 11 Pins · Pitch 1.00mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · KP18062ESPA (SSOP-10-EP-150mil)1PWM12RCS13PWM24RCS25RSL6COUT11EP10Vin9NC8LED17LED2Grid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.812.77.62.5-2.5-7.6-12.7mm
2. 2D FOOTPRINT
1234567891011E=3.90mm · Pitch e=1.00mmD=4.90mm-5-4-3-2-101234543210-1-2-3-4mm
3. 3D CAD MODEL
Package Body: 3.90mm × 4.90mm · Pitch: 1.00mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (11/11)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1PWM1I/OMultiplexed I/O & Peripheral Pin PWM1 (PWM)
2RCS1I/OMultiplexed I/O & Peripheral Pin RCS1 (General)
3PWM2I/OMultiplexed I/O & Peripheral Pin PWM2 (PWM)
4RCS2I/OMultiplexed I/O & Peripheral Pin RCS2 (General)
5RSLI/OMultiplexed I/O & Peripheral Pin RSL (General)
6COUTI/OMultiplexed I/O & Peripheral Pin COUT (General)
7LED2I/OMultiplexed I/O & Peripheral Pin LED2 (General)
8LED1I/OMultiplexed I/O & Peripheral Pin LED1 (General)
9NCI/OMultiplexed I/O & Peripheral Pin NC (General)
10VinPowerPower Supply Input (Vin — 3.3V / 5.0V Standard Logic)
11EPGNDExposed Thermal & Ground Pad (EP)
PIN 1 PWM1
I/O
Multiplexed I/O & Peripheral Pin PWM1 (PWM)
Design note: Signal terminal PWM1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PWM1. Supported peripheral buses: PWM.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 10 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: KP18062ESPA (Kiwi Instruments · SSOP-10-EP-150mil)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
KP18062ESPA (SSOP-10-EP-150mil) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
KP18062ESPA (SSOP-10-EP-150mil) - 2. Standard Pinout (Top View)
True package pinout (11 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
KP18062ESPA (SSOP-10-EP-150mil) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
KP18062ESPA (SSOP-10-EP-150mil) - 4. Package Dimensions (D×E×A)
SSOP-10-EP-150mil · 3.90×4.90mm · Pitch 1.00mmExpand ›
5. Recommended Land PatternLAND PATTERN
KP18062ESPA (SSOP-10-EP-150mil) - 5. Recommended Land Pattern
IPC-7351B Footprint (11 Pads)Expand ›
6. Application SchematicSCHEMATIC
KP18062ESPA (SSOP-10-EP-150mil) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (10 figures · Page 1/1)
Showing 1–10 of 10 uncropped original figures for KP18062
P1 · p01_fig01245×223px
KP18062ESPA (SSOP-10-EP-150mil) — PF>0.7、双通道 PWM 调光 LED 线性恒流驱动
PF>0.7、双通道 PWM 调光 LED 线性恒流驱动
P1 · p01_fig021910×2217px
KP18062ESPA (SSOP-10-EP-150mil) — PF>0.7、双通道 PWM 调光 LED 线性恒流驱动
PF>0.7、双通道 PWM 调光 LED 线性恒流驱动
P1 · p01_fig02P1
KP18062ESPA (SSOP-10-EP-150mil) — Datasheet Page 1 (p01_fig02)
Datasheet Page 1 (p01_fig02)
P2 · p02_fig011870×2487px
KP18062ESPA (SSOP-10-EP-150mil) — KP18062ESPA PF>0.7、双通道 PWM 调光 LED 线性恒流驱动
KP18062ESPA PF>0.7、双通道 PWM 调光 LED 线性恒流驱动
P2 · p02_fig02463×459px
KP18062ESPA (SSOP-10-EP-150mil) — ESSOP-10L
ESSOP-10L
P2 · p02_fig03464×464px
KP18062ESPA (SSOP-10-EP-150mil) — ESSOP-10L
ESSOP-10L
P2 · p02_fig03P2
KP18062ESPA (SSOP-10-EP-150mil) — Datasheet Page 2 (p02_fig03)
Datasheet Page 2 (p02_fig03)
P3 · p03_fig011650×1689px
KP18062ESPA (SSOP-10-EP-150mil) — Si Ko Ss af
Si Ko Ss af
P6 · p06_fig011879×2114px
KP18062ESPA (SSOP-10-EP-150mil) — 声明
声明
P6 · p06_fig01P6
KP18062ESPA (SSOP-10-EP-150mil) — Datasheet Page 6 (p06_fig01)
Datasheet Page 6 (p06_fig01)

Technical Specifications & Part Details (KP18062ESPA)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:KP18062ESPA (SSOP-10-EP-150mil) is a 10-pin standard electronic & interconnect component featuring a 4.90 × 3.90 × 1.10 mm mechanical envelope (lead pitch e = 1.00 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated PWM interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
4.90 × 3.90 × 1.10 mm (A1=0.10 mm)
Package family: TSSOP (SSOP-10-EP-150mil)
Pin Count & Lead PitchN / e
10 Pins | Pitch e = 1.00 mm (39.4 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
PWM
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol11 auto-grouped pins
OK
IPC-7351B Land Pattern11 pads · Pitch 1.00mm
OK
IPC-7525 60% Solder PasteEPAD 2.10×3.30mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SSOP-10-EP-150mil)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
4.90 × 3.90 mm
Height (A) & Pitch (e)IPC-7351B
A=1.10mm · e=1.00mm
Pad Size (W × L)Level B
0.45 × 1.50 mm
Pins / Total PadsTopology
11P / 11Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SSOP-10-EP-150mil
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — KP18062ESPA (SSOP-10-EP-150mil)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of KP18062ESPA (SSOP-10-EP-150mil)?

Manufactured by Kiwi Instruments, the KP18062ESPA is housed in a SSOP-10-EP-150mil package with 11 pins and a 1.00 mm lead pitch. Key pins include: 1 (PWM1: Multiplexed I/O & Peripheral Pin PWM1 (PWM)), 2 (RCS1: Multiplexed I/O & Peripheral Pin RCS1 (General)), 3 (PWM2: Multiplexed I/O & Peripheral Pin PWM2 (PWM)), 4 (RCS2: Multiplexed I/O & Peripheral Pin RCS2 (General)), 5 (RSL: Multiplexed I/O & Peripheral Pin RSL (General)), 6 (COUT: Multiplexed I/O & Peripheral Pin COUT (General)).

What are the IPC-7351B PCB Footprint dimensions for KP18062ESPA?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), KP18062ESPA (SSOP-10-EP-150mil) has a nominal body envelope of 3.90 × 4.90 mm, pitch e = 1.00 mm, and 11 copper pads plus a central exposed thermal pad (EPAD) of 2.10 × 3.30 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for KP18062ESPA?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for KP18062ESPA (Kiwi Instruments, SSOP-10-EP-150mil) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (11 pins) & KP18062 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1PWM1Digital_IOSignal terminal PWM1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PWM1. Supported peripheral buses: PWM.
2RCS1Digital_IOSignal terminal RCS1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: RCS1. Supported peripheral buses: General.
3PWM2Digital_IOSignal terminal PWM2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PWM2. Supported peripheral buses: PWM.
4RCS2Digital_IOSignal terminal RCS2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: RCS2. Supported peripheral buses: General.
5RSLDigital_IOSignal terminal RSL (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: RSL. Supported peripheral buses: General.
6COUTDigital_IOSignal terminal COUT (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: COUT. Supported peripheral buses: General.
7LED2Digital_IOSignal terminal LED2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: LED2. Supported peripheral buses: General.
8LED1Digital_IOSignal terminal LED1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: LED1. Supported peripheral buses: General.
9NCNCSignal terminal NC (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
10VinPower_InPrimary positive power supply input (Vin) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
11EPGNDBottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.