PIC16LF876A-I/SO (SOIC-28-300mil) — Symbol, Footprint IPC-7351B & 3D STEP Model

PIC16LF876A-I/SO

MICROCHIPSOIC-28-300mil · 28 Pins · Pitch 1.27mmIPC TOLERANCE VARIATION5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · PIC16LF876A-I/SO (SOIC-28-300mil)1MCLR#/VPP2RA0/AN03RA1/AN14RA2/AN2/VREF5RA3/AN3/VREF6RA4/T0CKI/C17RA5/AN4/SS#/8VSS9OSC1/CLKI10OSC2/CLKO11RC0/T1OSO/T112RC1/T1OSI/CC13RC2/CCP114RC3/SCK/SCL28RB7/PGD27RB6/PGC26RB525RB424RB3/PGM23RB222RB121RB0/INT20VDD19VSS18RC7/RX/DT17RC6/TX/CK16RC5/SDO15RC4/SDI/SDAGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.822.917.812.77.62.5-2.5-7.6-12.7-17.8-22.9mm
2. 2D FOOTPRINT
12345678910111213141516171819202122232425262728E=7.50mm · Pitch e=1.27mmD=17.90mm-10-8-6-4-20246810131197531-1-3-5-7-9-11-13mm
3. 3D CAD MODEL
Package Body: 7.50mm × 17.90mm · Pitch: 1.27mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (28/28)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1MCLR#/VPPI/OMultiplexed I/O & Peripheral Pin MCLR#/VPP (General)
2RA0/AN0I/OMultiplexed I/O & Peripheral Pin RA0/AN0 (General)
3RA1/AN1I/OMultiplexed I/O & Peripheral Pin RA1/AN1 (General)
4RA2/AN2/VREF-/CVREFAnalogMultiplexed I/O & Peripheral Pin RA2/AN2/VREF-/CVREF (General)
5RA3/AN3/VREF+AnalogMultiplexed I/O & Peripheral Pin RA3/AN3/VREF+ (General)
6RA4/T0CKI/C1OUTI/OMultiplexed I/O & Peripheral Pin RA4/T0CKI/C1OUT (General)
7RA5/AN4/SS#/C2OUTI/OMultiplexed I/O & Peripheral Pin RA5/AN4/SS#/C2OUT (General)
8VSSGNDGround Reference Pin (VSS)
9OSC1/CLKII/OMultiplexed I/O & Peripheral Pin OSC1/CLKI (RTC/CLK)
10OSC2/CLKOI/OMultiplexed I/O & Peripheral Pin OSC2/CLKO (RTC/CLK)
11RC0/T1OSO/T1CKII/OMultiplexed I/O & Peripheral Pin RC0/T1OSO/T1CKI (General)
12RC1/T1OSI/CCP2I/OMultiplexed I/O & Peripheral Pin RC1/T1OSI/CCP2 (General)
13RC2/CCP1I/OMultiplexed I/O & Peripheral Pin RC2/CCP1 (General)
14RC3/SCK/SCLI/OMultiplexed I/O & Peripheral Pin RC3/SCK/SCL (SPI, I2C)
15RC4/SDI/SDAI/OMultiplexed I/O & Peripheral Pin RC4/SDI/SDA (I2C)
16RC5/SDOI/OMultiplexed I/O & Peripheral Pin RC5/SDO (General)
17RC6/TX/CKI/OMultiplexed I/O & Peripheral Pin RC6/TX/CK (General)
18RC7/RX/DTI/OMultiplexed I/O & Peripheral Pin RC7/RX/DT (General)
19VSSGNDGround Reference Pin (VSS)
20VDDPowerPower Supply Input (VDD — 2.0V to 5.5V)
21RB0/INTI/OMultiplexed I/O & Peripheral Pin RB0/INT (General)
22RB1I/OMultiplexed I/O & Peripheral Pin RB1 (General)
23RB2I/OMultiplexed I/O & Peripheral Pin RB2 (General)
24RB3/PGMI/OMultiplexed I/O & Peripheral Pin RB3/PGM (General)
25RB4I/OMultiplexed I/O & Peripheral Pin RB4 (General)
26RB5I/OMultiplexed I/O & Peripheral Pin RB5 (General)
27RB6/PGCI/OMultiplexed I/O & Peripheral Pin RB6/PGC (General)
28RB7/PGDI/OMultiplexed I/O & Peripheral Pin RB7/PGD (General)
PIN 1 MCLR#/VPP
I/O
Multiplexed I/O & Peripheral Pin MCLR#/VPP (General)
Design note: Signal terminal MCLR#/VPP (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: MCLR#/VPP. Supported peripheral buses: General.
IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 14 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
1. Realistic 3D PackageREPRESENTATIVE
PIC16LF876A-I/SO (SOIC-28-300mil) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
PIC16LF876A-I/SO (SOIC-28-300mil) - 2. Standard Pinout (Top View)
True package pinout (28 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
PIC16LF876A-I/SO (SOIC-28-300mil) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
PIC16LF876A-I/SO (SOIC-28-300mil) - 4. Package Dimensions (D×E×A)
SOIC-28-300mil · 7.50×17.90mm · Pitch 1.27mmExpand ›
5. Recommended Land PatternLAND PATTERN
PIC16LF876A-I/SO (SOIC-28-300mil) - 5. Recommended Land Pattern
IPC-7351B Footprint (28 Pads)Expand ›
6. Application SchematicSCHEMATIC
PIC16LF876A-I/SO (SOIC-28-300mil) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (14 figures · Page 1/2)
Showing 1–12 of 14 uncropped original figures for PIC16LF876A / PIC16F876AT
P2 · p02_fig021229×907px
PIC16LF876A-I/SO (SOIC-28-300mil) — 44 43 42 41 40 39 16 17
44 43 42 41 40 39 16 17
P2 · p02_fig03938×950px
PIC16LF876A-I/SO (SOIC-28-300mil) — 8 9
8 9
P65 · p65_fig011753×607px
PIC16LF876A-I/SO (SOIC-28-300mil) — FIGURE 8-1: CAPTURE MODE OPERATION BLOCK DIAGRAM
FIGURE 8-1: CAPTURE MODE OPERATION BLOCK DIAGRAM
P66 · p66_fig01867×721px
PIC16LF876A-I/SO (SOIC-28-300mil) — FIGURE 8-2: COMPARE MODE OPERATION BLOCK DIAGRAM Special event trigger will: reset Timer1, but not set interrupt flag bit TMR1IF (PIR1<0>) and set bit GO/DONE (ADCON0<2>).
FIGURE 8-2: COMPARE MODE OPERATION BLOCK DIAGRAM Special event trigger will: reset Timer1, but not set interrupt flag bit TMR1IF (PIR1<0>) and set bit GO/DONE (ADCON0<2>).
P75 · p75_fig011777×938px
PIC16LF876A-I/SO (SOIC-28-300mil) — FIGURE 9-2: SPI MASTER/SLAVE CONNECTION
FIGURE 9-2: SPI MASTER/SLAVE CONNECTION
P78 · p78_fig011777×1087px
PIC16LF876A-I/SO (SOIC-28-300mil) — FIGURE 9-5: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0) SS SCK (CKP = 0 SCK (CKP = 1 CKE = 0) Write to SSPBUF
FIGURE 9-5: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0) SS SCK (CKP = 0 SCK (CKP = 1 CKE = 0) Write to SSPBUF
P78 · p78_fig021777×1126px
PIC16LF876A-I/SO (SOIC-28-300mil) — FIGURE 9-6: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1) SS SCK (CKP = 0 SCK (CKP = 1 CKE = 1) Write to SSPBUF
FIGURE 9-6: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1) SS SCK (CKP = 0 SCK (CKP = 1 CKE = 1) Write to SSPBUF
P78 · p78_fig01P78
PIC16LF876A-I/SO (SOIC-28-300mil) — Datasheet Page 78 (p78_fig01)
Datasheet Page 78 (p78_fig01)
P213 · p213_fig011441×1814px
PIC16LF876A-I/SO (SOIC-28-300mil) — CH2 x 45 CH1 x 45 | 10 5 0 10 5 0  Mold Draft Angle Bottom | 10 5 0 10 5 0  Mold Draft Angle Top | 0.53 0.51 0.33 .021 .020 .013 B | 0.81 0.74 0.66 .032 .029 .026 B1 Upper Lead Width | 0.33 0.27 0.20 .013 .011 .008 c Lead Thickness | 11
CH2 x 45 CH1 x 45 | 10 5 0 10 5 0  Mold Draft Angle Bottom | 10 5 0 10 5 0  Mold Draft Angle Top | 0.53 0.51 0.33 .021 .020 .013 B | 0.81 0.74 0.66 .032 .029 .026 B1 Upper Lead Width | 0.33 0.27 0.20 .013 .011 .008 c Lead Thickness | 11
P216 · p216_fig011442×1787px
PIC16LF876A-I/SO (SOIC-28-300mil) — Foot Angle Top  0 4 8 0 4 8 | 15 12 0 15 12 0  Mold Draft Angle Bottom | 15 12 0 15 12 0  Mold Draft Angle Top | 0.51 0.42 0.36 .020 .017 .014 B Lead Width | 0.33 0.28 0.23 .013 .011 .009 c Lead Thickness | 1.27 0.84 0.41 .050 .033 .016
Foot Angle Top  0 4 8 0 4 8 | 15 12 0 15 12 0  Mold Draft Angle Bottom | 15 12 0 15 12 0  Mold Draft Angle Top | 0.51 0.42 0.36 .020 .017 .014 B Lead Width | 0.33 0.28 0.23 .013 .011 .009 c Lead Thickness | 1.27 0.84 0.41 .050 .033 .016
P216 · p216_fig01P216
PIC16LF876A-I/SO (SOIC-28-300mil) — Datasheet Page 216 (p216_fig01)
Datasheet Page 216 (p216_fig01)
P2 · p02_fig01All Packages in PDF
PIC16LF876A-I/SO (SOIC-28-300mil) — 28-Pin QFN
28-Pin QFN
Page 1 / 2 (14 extracted figures)

Technical Specifications & Part Details (PIC16LF876A-I/SO)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:PIC16LF876A-I/SO (SOIC-28-300mil) is a 28-pin standard electronic & interconnect component featuring a 17.90 × 7.50 × 2.70 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 2.0V to 5.5V supply operation across -40°C ~ +85°C (Industrial Grade) with integrated UART, SPI, I2C, ADC, PWM, RTC/CLK interfaces.
Operating Supply VoltageV_CC / V_DD
2.0V to 5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
20 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
17.90 × 7.50 × 2.70 mm (A1=0.20 mm)
Package family: SOIC (SOIC-28-300mil)
Pin Count & Lead PitchN / e
28 Pins | Pitch e = 1.27 mm (50.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
UART, SPI, I2C, ADC, PWM, RTC/CLK
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol28 auto-grouped pins
OK
IPC-7351B Land Pattern28 pads · Pitch 1.27mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified
IPC-7351B

Family Variants & Same Datasheet Chips — PIC16LF876A / PIC16F876AT (2)

Select package variant or sibling MPN sharing this datasheet

Mechanical Dimensions & Land Pattern (SOIC-28-300mil)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
17.90 × 7.50 mm
Height (A) & Pitch (e)IPC-7351B
A=2.70mm · e=1.27mm
Pad Size (W × L)Level B
0.60 × 1.90 mm
Pins / Total PadsTopology
28P / 28Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SOIC-28-300mil
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — PIC16LF876A-I/SO (SOIC-28-300mil)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of PIC16LF876A-I/SO (SOIC-28-300mil)?

Manufactured by MICROCHIP, the PIC16LF876A-I/SO is housed in a SOIC-28-300mil package with 28 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 2.0V to 5.5V. Key pins include: 1 (MCLR#/VPP: Multiplexed I/O & Peripheral Pin MCLR#/VPP (General)), 2 (RA0/AN0: Multiplexed I/O & Peripheral Pin RA0/AN0 (General)), 3 (RA1/AN1: Multiplexed I/O & Peripheral Pin RA1/AN1 (General)), 4 (RA2/AN2/VREF-/CVREF: Multiplexed I/O & Peripheral Pin RA2/AN2/VREF-/CVREF (General)), 5 (RA3/AN3/VREF+: Multiplexed I/O & Peripheral Pin RA3/AN3/VREF+ (General)), 6 (RA4/T0CKI/C1OUT: Multiplexed I/O & Peripheral Pin RA4/T0CKI/C1OUT (General)).

What are the IPC-7351B PCB Footprint dimensions for PIC16LF876A-I/SO?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC16LF876A-I/SO (SOIC-28-300mil) has a nominal body envelope of 7.50 × 17.90 mm, pitch e = 1.27 mm, and 28 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC16LF876A-I/SO?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC16LF876A-I/SO (MICROCHIP, SOIC-28-300mil) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (28 pins) & PIC16LF876A / PIC16F876AT Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1MCLR#/VPPDigital_IOSignal terminal MCLR#/VPP (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: MCLR#/VPP. Supported peripheral buses: General.
2RA0/AN0Digital_IOSignal terminal RA0/AN0 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RA0/AN0. Supported peripheral buses: General.
3RA1/AN1Digital_IOSignal terminal RA1/AN1 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RA1/AN1. Supported peripheral buses: General.
4RA2/AN2/VREF-/CVREFAnalogSignal terminal RA2/AN2/VREF-/CVREF (Analog, 2.0V to 5.5V domain). Multiplexed alternate functions: RA2/AN2/VREF-/CVREF. Supported peripheral buses: General.
5RA3/AN3/VREF+AnalogSignal terminal RA3/AN3/VREF+ (Analog, 2.0V to 5.5V domain). Multiplexed alternate functions: RA3/AN3/VREF+. Supported peripheral buses: General.
6RA4/T0CKI/C1OUTDigital_IOSignal terminal RA4/T0CKI/C1OUT (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RA4/T0CKI/C1OUT. Supported peripheral buses: General.
7RA5/AN4/SS#/C2OUTDigital_IOSignal terminal RA5/AN4/SS#/C2OUT (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RA5/AN4/SS#/C2OUT. Supported peripheral buses: General.
8VSSGND0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
9OSC1/CLKIDigital_IOSignal terminal OSC1/CLKI (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: OSC1/CLKI. Supported peripheral buses: RTC/CLK.
10OSC2/CLKODigital_IOSignal terminal OSC2/CLKO (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: OSC2/CLKO. Supported peripheral buses: RTC/CLK.
11RC0/T1OSO/T1CKIDigital_IOSignal terminal RC0/T1OSO/T1CKI (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC0/T1OSO/T1CKI. Supported peripheral buses: General.
12RC1/T1OSI/CCP2Digital_IOSignal terminal RC1/T1OSI/CCP2 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC1/T1OSI/CCP2. Supported peripheral buses: General.
13RC2/CCP1Digital_IOSignal terminal RC2/CCP1 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC2/CCP1. Supported peripheral buses: General.
14RC3/SCK/SCLDigital_IOSignal terminal RC3/SCK/SCL (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC3/SCK/SCL. Supported peripheral buses: SPI, I2C.
15RC4/SDI/SDADigital_IOSignal terminal RC4/SDI/SDA (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC4/SDI/SDA. Supported peripheral buses: I2C.
16RC5/SDODigital_IOSignal terminal RC5/SDO (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC5/SDO. Supported peripheral buses: General.
17RC6/TX/CKDigital_IOSignal terminal RC6/TX/CK (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC6/TX/CK. Supported peripheral buses: General.
18RC7/RX/DTDigital_IOSignal terminal RC7/RX/DT (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC7/RX/DT. Supported peripheral buses: General.
19VSSGND0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
20VDDPower_InPrimary positive power supply input (VDD) operating in the 2.0V to 5.5V domain (Max rating: 5.5V).
21RB0/INTDigital_IOSignal terminal RB0/INT (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB0/INT. Supported peripheral buses: General.
22RB1Digital_IOSignal terminal RB1 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB1. Supported peripheral buses: General.
23RB2Digital_IOSignal terminal RB2 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB2. Supported peripheral buses: General.
24RB3/PGMDigital_IOSignal terminal RB3/PGM (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB3/PGM. Supported peripheral buses: General.
25RB4Digital_IOSignal terminal RB4 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB4. Supported peripheral buses: General.
26RB5Digital_IOSignal terminal RB5 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB5. Supported peripheral buses: General.
27RB6/PGCDigital_IOSignal terminal RB6/PGC (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB6/PGC. Supported peripheral buses: General.
28RB7/PGDDigital_IOSignal terminal RB7/PGD (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB7/PGD. Supported peripheral buses: General.