ATF16LV8C-10XU (TSSOP-20) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of ATF16LV8C-10XU (TSSOP-20)?

Manufactured by MICROCHIP, the ATF16LV8C-10XU is housed in a TSSOP-20 package with 20 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 3.0V to 5.5V. Key pins include: 1 (I/CLK: Multiplexed I/O & Peripheral Pin I/CLK (General)), 2 (I1: Multiplexed I/O & Peripheral Pin I1 (General)), 3 (I2: Multiplexed I/O & Peripheral Pin I2 (General)), 4 (PD/I3: Multiplexed I/O & Peripheral Pin PD/I3 (General)), 5 (I4: Multiplexed I/O & Peripheral Pin I4 (General)), 6 (I5: Multiplexed I/O & Peripheral Pin I5 (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for ATF16LV8C-10XU?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), ATF16LV8C-10XU (TSSOP-20) has a nominal body envelope of 4.40 × 6.50 mm, pitch e = 0.65 mm, and 20 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for ATF16LV8C-10XU?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for ATF16LV8C-10XU (MICROCHIP, TSSOP-20) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 4.40mm × 6.50mm · Pitch: 0.65mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (20/20)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	I/CLK	I/O	Multiplexed I/O & Peripheral Pin I/CLK (General)
2	I1	I/O	Multiplexed I/O & Peripheral Pin I1 (General)
3	I2	I/O	Multiplexed I/O & Peripheral Pin I2 (General)
4	PD/I3	I/O	Multiplexed I/O & Peripheral Pin PD/I3 (General)
5	I4	I/O	Multiplexed I/O & Peripheral Pin I4 (General)
6	I5	I/O	Multiplexed I/O & Peripheral Pin I5 (General)
7	I6	I/O	Multiplexed I/O & Peripheral Pin I6 (General)
8	I7	I/O	Multiplexed I/O & Peripheral Pin I7 (General)
9	I8	I/O	Multiplexed I/O & Peripheral Pin I8 (General)
10	GND	GND	Ground Reference Pin (GND)
11	I9/OE#	I/O	Multiplexed I/O & Peripheral Pin I9/OE# (General)
12	I/O	I/O	Multiplexed I/O & Peripheral Pin I/O (General)
13	I/O	I/O	Multiplexed I/O & Peripheral Pin I/O (General)
14	I/O	I/O	Multiplexed I/O & Peripheral Pin I/O (General)
15	I/O	I/O	Multiplexed I/O & Peripheral Pin I/O (General)
16	I/O	I/O	Multiplexed I/O & Peripheral Pin I/O (General)
17	I/O	I/O	Multiplexed I/O & Peripheral Pin I/O (General)
18	I/O	I/O	Multiplexed I/O & Peripheral Pin I/O (General)
19	I/O	I/O	Multiplexed I/O & Peripheral Pin I/O (General)
20	VCC	Power	Power Supply Input (VCC — 3.0V to 5.5V)

PIN 1 I/CLK

I/O

Multiplexed I/O & Peripheral Pin I/CLK (General)

Design note: Signal terminal I/CLK (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I/CLK. Supported peripheral buses: General.

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 8 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

ATF16LV8C-10XU (TSSOP-20) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

ATF16LV8C-10XU (TSSOP-20) - 2. Standard Pinout (Top View)

True package pinout (20 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

ATF16LV8C-10XU (TSSOP-20) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

ATF16LV8C-10XU (TSSOP-20) - 4. Package Dimensions (D×E×A)

TSSOP-20 · 4.40×6.50mm · Pitch 0.65mmExpand ›

5. Recommended Land PatternLAND PATTERN

ATF16LV8C-10XU (TSSOP-20) - 5. Recommended Land Pattern

IPC-7351B Footprint (20 Pads)Expand ›

6. Application SchematicSCHEMATIC

ATF16LV8C-10XU (TSSOP-20) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (8 figures · Page 1/1)

Showing 1–8 of 8 uncropped original figures for ATF16LV8C

P1 · p01_fig01652×503px

ATF16LV8C

P1 · p01_fig021454×1346px

P1 · p01_fig02P1

Datasheet Page 1 (p01_fig02)

P2 · p02_fig011751×694px

Storage Temperature..................................... -65°C to +150°C

P10 · p10_fig012027×2361px

ATF16LV8C 10

P13 · p13_fig012038×2582px

ATF16LV8C

P13 · p13_fig01P13

Datasheet Page 13 (p13_fig01)

P11 · p11_fig01All Packages in PDF

ATF16LV8C

Technical Specifications & Part Details (ATF16LV8C-10XU)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:ATF16LV8C-10XU (TSSOP-20) is a 20-pin standard electronic & interconnect component featuring a 6.50 × 4.40 × 1.00 mm mechanical envelope (lead pitch e = 0.65 mm). Rated for 3.0V to 5.5V supply operation across -40°C to +85°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

3.0V to 5.5V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C to +85°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

15 MHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

6.50 × 4.40 × 1.00 mm (A1=0.10 mm)

Package family: TSSOP (TSSOP-20)

Pin Count & Lead PitchN / e

20 Pins | Pitch e = 0.65 mm (25.6 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol20 auto-grouped pins

IPC-7351B Land Pattern20 pads · Pitch 0.65mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (TSSOP-20)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

6.50 × 4.40 mm

Height (A) & Pitch (e)IPC-7351B

A=1.00mm · e=0.65mm

Pad Size (W × L)Level B

0.42 × 1.45 mm

Pins / Total PadsTopology

20P / 20Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit TSSOP-20	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — ATF16LV8C-10XU (TSSOP-20)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of ATF16LV8C-10XU (TSSOP-20)?

Manufactured by MICROCHIP, the ATF16LV8C-10XU is housed in a TSSOP-20 package with 20 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 3.0V to 5.5V. Key pins include: 1 (I/CLK: Multiplexed I/O & Peripheral Pin I/CLK (General)), 2 (I1: Multiplexed I/O & Peripheral Pin I1 (General)), 3 (I2: Multiplexed I/O & Peripheral Pin I2 (General)), 4 (PD/I3: Multiplexed I/O & Peripheral Pin PD/I3 (General)), 5 (I4: Multiplexed I/O & Peripheral Pin I4 (General)), 6 (I5: Multiplexed I/O & Peripheral Pin I5 (General)).

What are the IPC-7351B PCB Footprint dimensions for ATF16LV8C-10XU?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), ATF16LV8C-10XU (TSSOP-20) has a nominal body envelope of 4.40 × 6.50 mm, pitch e = 0.65 mm, and 20 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for ATF16LV8C-10XU?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for ATF16LV8C-10XU (MICROCHIP, TSSOP-20) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (20 pins) & ATF16LV8C Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	I/CLK	Digital_IO	Signal terminal I/CLK (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I/CLK. Supported peripheral buses: General.
2	I1	Digital_IO	Signal terminal I1 (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I1. Supported peripheral buses: General.
3	I2	Digital_IO	Signal terminal I2 (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I2. Supported peripheral buses: General.
4	PD/I3	Digital_IO	Signal terminal PD/I3 (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: PD/I3. Supported peripheral buses: General.
5	I4	Digital_IO	Signal terminal I4 (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I4. Supported peripheral buses: General.
6	I5	Digital_IO	Signal terminal I5 (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I5. Supported peripheral buses: General.
7	I6	Digital_IO	Signal terminal I6 (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I6. Supported peripheral buses: General.
8	I7	Digital_IO	Signal terminal I7 (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I7. Supported peripheral buses: General.
9	I8	Digital_IO	Signal terminal I8 (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I8. Supported peripheral buses: General.
10	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
11	I9/OE#	Digital_IO	Signal terminal I9/OE# (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I9/OE#. Supported peripheral buses: General.
12	I/O	Digital_IO	Signal terminal I/O (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I/O. Supported peripheral buses: General.
13	I/O	Digital_IO	Signal terminal I/O (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I/O. Supported peripheral buses: General.
14	I/O	Digital_IO	Signal terminal I/O (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I/O. Supported peripheral buses: General.
15	I/O	Digital_IO	Signal terminal I/O (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I/O. Supported peripheral buses: General.
16	I/O	Digital_IO	Signal terminal I/O (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I/O. Supported peripheral buses: General.
17	I/O	Digital_IO	Signal terminal I/O (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I/O. Supported peripheral buses: General.
18	I/O	Digital_IO	Signal terminal I/O (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I/O. Supported peripheral buses: General.
19	I/O	Digital_IO	Signal terminal I/O (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: I/O. Supported peripheral buses: General.
20	VCC	Power_In	Primary positive power supply input (VCC) operating in the 3.0V to 5.5V domain (Max rating: 5.5V).

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