TC4431COA (SOIC-8) — Symbol, Footprint IPC-7351B & 3D STEP Model

TC4431COA

MICROCHIPSOIC-8 · 8 Pins · Pitch 1.27mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · TC4431COA (SOIC-8)1VDD2IN3LOCKDIS4GND8VDD7OUT6OUT5GNDGrid Pitch = 2.54mm (IEEE-315)-15.2-10.2-5.105.110.215.210.25.10-5.1-10.2mm
2. 2D FOOTPRINT
12345678E=3.90mm · Pitch e=1.27mmD=4.90mm-5-4-3-2-101234543210-1-2-3-4mm
3. 3D CAD MODEL
Package Body: 3.90mm × 4.90mm · Pitch: 1.27mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (8/8)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1VDDPowerPower Supply Input (VDD — 4.5V to 30V)
2INI/OMultiplexed I/O & Peripheral Pin IN (General)
3LOCKDISI/OMultiplexed I/O & Peripheral Pin LOCKDIS (General)
4GNDGNDGround Reference Pin (GND)
5GNDGNDGround Reference Pin (GND)
6OUTI/OMultiplexed I/O & Peripheral Pin OUT (General)
7OUTI/OMultiplexed I/O & Peripheral Pin OUT (General)
8VDDPowerPower Supply Input (VDD — 4.5V to 30V)
PIN 1 VDD
Power
Power Supply Input (VDD — 4.5V to 30V)
Design note: SupplyInput 45Vto30V , .
IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 8 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
1. Realistic 3D PackageREPRESENTATIVE
TC4431COA (SOIC-8) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
TC4431COA (SOIC-8) - 2. Standard Pinout (Top View)
True package pinout (8 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
TC4431COA (SOIC-8) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
TC4431COA (SOIC-8) - 4. Package Dimensions (D×E×A)
SOIC-8 · 3.90×4.90mm · Pitch 1.27mmExpand ›
5. Recommended Land PatternLAND PATTERN
TC4431COA (SOIC-8) - 5. Recommended Land Pattern
IPC-7351B Footprint (8 Pads)Expand ›
6. Application SchematicSCHEMATIC
TC4431COA (SOIC-8) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (8 figures · Page 1/1)
Showing 1–8 of 8 uncropped original figures for TC4431
P8 · p08_fig01EXACT PACKAGE
TC4431COA (SOIC-8) — TC4431/TC4432
TC4431/TC4432
P1 · p01_fig01867×1056px
TC4431COA (SOIC-8) — Package Type | OUT TC4431 | 1 | 2 | 3 | 4 | VDD | 5 | 6 | 7 | 8 | OUT | GND | VDD | IN | LOCK DIS | GND | TC4432 | 1 | 2 | 3 | 4 | VDD | 5 | 6 | 7 | 8 | OUT | GND | VDD | IN | GND | 2 7 | Inverting | Non Inverting | OUT | 6 | LOCK DIS | 2 7
Package Type | OUT TC4431 | 1 | 2 | 3 | 4 | VDD | 5 | 6 | 7 | 8 | OUT | GND | VDD | IN | LOCK DIS | GND | TC4432 | 1 | 2 | 3 | 4 | VDD | 5 | 6 | 7 | 8 | OUT | GND | VDD | IN | GND | 2 7 | Inverting | Non Inverting | OUT | 6 | LOCK DIS | 2 7
P1 · p01_fig01P1
TC4431COA (SOIC-8) — Datasheet Page 1 (p01_fig01)
Datasheet Page 1 (p01_fig01)
P2 · p02_fig011623×829px
TC4431COA (SOIC-8) — Functional Block Diagram
Functional Block Diagram
P8 · p08_fig021777×750px
TC4431COA (SOIC-8) — DS21424D-page 8 © 2007 Microchip Technology Inc. | Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-speci
DS21424D-page 8 © 2007 Microchip Technology Inc. | Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-speci
P8 · p08_fig01P8
TC4431COA (SOIC-8) — Datasheet Page 8 (p08_fig01)
Datasheet Page 8 (p08_fig01)
P11 · p11_fig011777×2734px
TC4431COA (SOIC-8) — 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] - Note: For the most current package drawings, please see the Microchip Packaging Specification located at - http:/www.microchip.com/packaging | © 2007 Microchip Technology Inc
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] - Note: For the most current package drawings, please see the Microchip Packaging Specification located at - http:/www.microchip.com/packaging | © 2007 Microchip Technology Inc
P12 · p12_fig011777×2734px
TC4431COA (SOIC-8) — 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] - Note: For the most current package drawings, please see the Microchip Packaging Specification located at - http://www. microchip.com/packaging | TC4431/TC4432 | DS21424D-page
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] - Note: For the most current package drawings, please see the Microchip Packaging Specification located at - http://www. microchip.com/packaging | TC4431/TC4432 | DS21424D-page

Technical Specifications & Part Details (TC4431COA)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:TC4431COA (SOIC-8) is a 8-pin standard electronic & interconnect component featuring a 4.90 × 3.90 × 1.75 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 4.5V to 30V supply operation across -65°C to +150°C with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
4.5V to 30V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-65°C to +150°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
1.5 A
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
4.90 × 3.90 × 1.75 mm (A1=0.15 mm)
Package family: SOIC (SOIC-8)
Pin Count & Lead PitchN / e
8 Pins | Pitch e = 1.27 mm (50.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol8 auto-grouped pins
OK
IPC-7351B Land Pattern8 pads · Pitch 1.27mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOIC-8)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
4.90 × 3.90 mm
Height (A) & Pitch (e)IPC-7351B
A=1.75mm · e=1.27mm
Pad Size (W × L)Level B
0.60 × 1.55 mm
Pins / Total PadsTopology
8P / 8Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SOIC-8
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — TC4431COA (SOIC-8)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of TC4431COA (SOIC-8)?

Manufactured by MICROCHIP, the TC4431COA is housed in a SOIC-8 package with 8 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 4.5V to 30V. Key pins include: 1 (VDD: Power Supply Input (VDD — 4.5V to 30V)), 2 (IN: Multiplexed I/O & Peripheral Pin IN (General)), 3 (LOCKDIS: Multiplexed I/O & Peripheral Pin LOCKDIS (General)), 4 (GND: Ground Reference Pin (GND)), 5 (GND: Ground Reference Pin (GND)), 6 (OUT: Multiplexed I/O & Peripheral Pin OUT (General)).

What are the IPC-7351B PCB Footprint dimensions for TC4431COA?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), TC4431COA (SOIC-8) has a nominal body envelope of 3.90 × 4.90 mm, pitch e = 1.27 mm, and 8 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for TC4431COA?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for TC4431COA (MICROCHIP, SOIC-8) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (8 pins) & TC4431 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1VDDPower_InPrimary positive power supply input (VDD) operating in the 4.5V to 30V domain (Max rating: 30.0V).
2INDigital_IOSignal terminal IN (I/O, 4.5V to 30V domain). Multiplexed alternate functions: IN. Supported peripheral buses: General.
3LOCKDISDigital_IOSignal terminal LOCKDIS (I/O, 4.5V to 30V domain). Multiplexed alternate functions: LOCKDIS. Supported peripheral buses: General.
4GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
5GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
6OUTDigital_IOSignal terminal OUT (I/O, 4.5V to 30V domain). Multiplexed alternate functions: OUT. Supported peripheral buses: General.
7OUTDigital_IOSignal terminal OUT (I/O, 4.5V to 30V domain). Multiplexed alternate functions: OUT. Supported peripheral buses: General.
8VDDPower_InPrimary positive power supply input (VDD) operating in the 4.5V to 30V domain (Max rating: 30.0V).