TLV62585RWTT (QFN-12(2x2)) — Symbol, Footprint IPC-7351B & 3D STEP Model

TLV62585RWTT

TIID: C2070949QFN-12(2x2) · 12 Pins · Pitch 0.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · TLV62585RWTT (QFN-12(2x2))1GND2SW3VIN4EN5FB6NC12PGND11SW10VIN9PG8EN7FBGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.812.77.62.5-2.5-7.6-12.7mm
2. 2D FOOTPRINT
121110987654321E=2.00mm · Pitch e=0.50mmD=2.00mm-3-2-101233210-1-2-3mm
3. 3D CAD MODEL
Package Body: 2.00mm × 2.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (12/12)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1GNDGNDGround Reference Pin (GND)
2SWI/OMultiplexed I/O & Peripheral Pin SW (General)
3VINPowerPower Supply Input (VIN — 2.5 V to 5.5 V)
4ENISystem Enable & Hardware Reset (EN)
5FBI/OMultiplexed I/O & Peripheral Pin FB (General)
6NCI/OMultiplexed I/O & Peripheral Pin NC (General)
7FBI/OMultiplexed I/O & Peripheral Pin FB (General)
8ENISystem Enable & Hardware Reset (EN)
9PGI/OMultiplexed I/O & Peripheral Pin PG (CAN)
10VINPowerPower Supply Input (VIN — 2.5 V to 5.5 V)
11SWI/OMultiplexed I/O & Peripheral Pin SW (General)
12PGNDGNDGround Reference Pin (PGND)
PIN 1 GND
GND
Ground Reference Pin (GND)
Design note: Groundpin .
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 14 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: TLV62585RWTT (TI · QFN-12(2x2))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
TLV62585RWTT (QFN-12(2x2)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
TLV62585RWTT (QFN-12(2x2)) - 2. Standard Pinout (Top View)
True package pinout (12 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
TLV62585RWTT (QFN-12(2x2)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
TLV62585RWTT (QFN-12(2x2)) - 4. Package Dimensions (D×E×A)
QFN-12(2x2) · 2.00×2.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
TLV62585RWTT (QFN-12(2x2)) - 5. Recommended Land Pattern
IPC-7351B Footprint (12 Pads)Expand ›
6. Application SchematicSCHEMATIC
TLV62585RWTT (QFN-12(2x2)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (14 figures · Page 1/2)
Showing 1–12 of 14 uncropped original figures for TLV62585
P3 · p03_fig03EXACT PACKAGE
TLV62585RWTT (QFN-12(2x2)) — Pin Functions
Pin Functions
P1 · p01_fig011892×872px
TLV62585RWTT (QFN-12(2x2)) — 空白
空白
P1 · p01_fig01P1
TLV62585RWTT (QFN-12(2x2)) — Datasheet Page 1 (p01_fig01)
Datasheet Page 1 (p01_fig01)
P3 · p03_fig03P3
TLV62585RWTT (QFN-12(2x2)) — Datasheet Page 3 (p03_fig03)
Datasheet Page 3 (p03_fig03)
P8 · p08_fig011292×576px
TLV62585RWTT (QFN-12(2x2)) — 图4. 1.8-V Output Voltage Application
图4. 1.8-V Output Voltage Application
P22 · p22_fig011910×2128px
TLV62585RWTT (QFN-12(2x2)) — PACKAGE OUTLINE
PACKAGE OUTLINE
P23 · p23_fig011910×2145px
TLV62585RWTT (QFN-12(2x2)) — EXAMPLE BOARD LAYOUT
EXAMPLE BOARD LAYOUT
P23 · p23_fig01P23
TLV62585RWTT (QFN-12(2x2)) — Datasheet Page 23 (p23_fig01)
Datasheet Page 23 (p23_fig01)
P24 · p24_fig011910×2146px
TLV62585RWTT (QFN-12(2x2)) — NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
P24 · p24_fig01P24
TLV62585RWTT (QFN-12(2x2)) — Datasheet Page 24 (p24_fig01)
Datasheet Page 24 (p24_fig01)
P25 · p25_fig011910×2138px
TLV62585RWTT (QFN-12(2x2)) — PACKAGE OUTLINE
PACKAGE OUTLINE
P26 · p26_fig011910×2046px
TLV62585RWTT (QFN-12(2x2)) — EXAMPLE BOARD LAYOUT
EXAMPLE BOARD LAYOUT
Page 1 / 2 (14 extracted figures)

Technical Specifications & Part Details (TLV62585RWTT)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:TLV62585RWTT (QFN-12(2x2)) is a 12-pin standard electronic & interconnect component featuring a 2.00 × 2.00 × 0.90 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 2.5 V to 5.5 V supply operation across 25°C to 0°C with integrated PWM, CAN interfaces.
Operating Supply VoltageV_CC / V_DD
2.5 V to 5.5 V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
25°C to 0°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
1.5MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
2.00 × 2.00 × 0.90 mm (A1=0.03 mm)
Package family: QFN (QFN-12(2x2))
Pin Count & Lead PitchN / e
12 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
PWM, CAN
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol12 auto-grouped pins
OK
IPC-7351B Land Pattern12 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (QFN-12(2x2))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
2.00 × 2.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.90mm · e=0.50mm
Pad Size (W × L)Level B
0.30 × 0.55 mm
Pins / Total PadsTopology
12P / 12Pad (QUAD_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
QFN-12(2x2)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — TLV62585RWTT (QFN-12(2x2))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of TLV62585RWTT (QFN-12(2x2))?

Manufactured by TI, the TLV62585RWTT is housed in a QFN-12(2x2) package with 12 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 2.5 V to 5.5 V. Key pins include: 1 (GND: Ground Reference Pin (GND)), 2 (SW: Multiplexed I/O & Peripheral Pin SW (General)), 3 (VIN: Power Supply Input (VIN — 2.5 V to 5.5 V)), 4 (EN: System Enable & Hardware Reset (EN)), 5 (FB: Multiplexed I/O & Peripheral Pin FB (General)), 6 (NC: Multiplexed I/O & Peripheral Pin NC (General)).

What are the IPC-7351B PCB Footprint dimensions for TLV62585RWTT?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), TLV62585RWTT (QFN-12(2x2)) has a nominal body envelope of 2.00 × 2.00 mm, pitch e = 0.50 mm, and 12 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for TLV62585RWTT?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for TLV62585RWTT (TI, QFN-12(2x2)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (12 pins) & TLV62585 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
2SWDigital_IOSignal terminal SW (I/O, 2.5 V to 5.5 V domain). Multiplexed alternate functions: SW. Supported peripheral buses: General.
3VINPower_InPrimary positive power supply input (VIN) operating in the 2.5 V to 5.5 V domain (Max rating: 5.5V).
4ENDigital_IOChip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
5FBDigital_IOSignal terminal FB (I/O, 2.5 V to 5.5 V domain). Multiplexed alternate functions: FB. Supported peripheral buses: General.
6NCNCSignal terminal NC (I/O, 2.5 V to 5.5 V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
7FBDigital_IOSignal terminal FB (I/O, 2.5 V to 5.5 V domain). Multiplexed alternate functions: FB. Supported peripheral buses: General.
8ENDigital_IOChip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
9PGOpen_DrainSignal terminal PG (I/O, 2.5 V to 5.5 V domain). Multiplexed alternate functions: PG. Supported peripheral buses: CAN.
10VINPower_InPrimary positive power supply input (VIN) operating in the 2.5 V to 5.5 V domain (Max rating: 5.5V).
11SWDigital_IOSignal terminal SW (I/O, 2.5 V to 5.5 V domain). Multiplexed alternate functions: SW. Supported peripheral buses: General.
12PGNDGND0V electrical ground return terminal (PGND) for internal core logic, I/O drivers, and analog sub-blocks.