24LC512T-E/MF (DFN-8-EP(5x6)) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of 24LC512T-E/MF (DFN-8-EP(5x6))?

Manufactured by MICROCHIP, the 24LC512T-E/MF is housed in a DFN-8-EP(5x6) package with 9 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 1.7V to 5.5V. Key pins include: 1 (A0: Multiplexed I/O & Peripheral Pin A0 (General)), 2 (A1: Multiplexed I/O & Peripheral Pin A1 (General)), 3 (A2: Multiplexed I/O & Peripheral Pin A2 (General)), 4 (VSS: Ground Reference Pin (VSS)), 5 (SDA: Multiplexed I/O & Peripheral Pin SDA (I2C)), 6 (SCL: Multiplexed I/O & Peripheral Pin SCL (I2C)).

Q: What are the IPC-7351B PCB Footprint dimensions for 24LC512T-E/MF?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), 24LC512T-E/MF (DFN-8-EP(5x6)) has a nominal body envelope of 5.00 × 6.00 mm, pitch e = 1.27 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 4.00 × 2.30 mm with a 60% IPC-7525 windowed solder paste grid.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for 24LC512T-E/MF?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for 24LC512T-E/MF (MICROCHIP, DFN-8-EP(5x6)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 5.00mm × 6.00mm · Pitch: 1.27mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (9/9)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	A0	I/O	Multiplexed I/O & Peripheral Pin A0 (General)
2	A1	I/O	Multiplexed I/O & Peripheral Pin A1 (General)
3	A2	I/O	Multiplexed I/O & Peripheral Pin A2 (General)
4	VSS	GND	Ground Reference Pin (VSS)
5	SDA	I/O	Multiplexed I/O & Peripheral Pin SDA (I2C)
6	SCL	I/O	Multiplexed I/O & Peripheral Pin SCL (I2C)
7	WP	I/O	Multiplexed I/O & Peripheral Pin WP (General)
8	VCC	Power	Power Supply Input (VCC — 1.7V to 5.5V)
9	EP	GND	Exposed Thermal & Ground Pad (EP)

PIN 1 A0

I/O

Multiplexed I/O & Peripheral Pin A0 (General)

Design note: UserConfiguredChipSelect

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 7 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

24LC512T-E/MF (DFN-8-EP(5x6)) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

24LC512T-E/MF (DFN-8-EP(5x6)) - 2. Standard Pinout (Top View)

True package pinout (9 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

24LC512T-E/MF (DFN-8-EP(5x6)) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

24LC512T-E/MF (DFN-8-EP(5x6)) - 4. Package Dimensions (D×E×A)

DFN-8-EP(5x6) · 5.00×6.00mm · Pitch 1.27mmExpand ›

5. Recommended Land PatternLAND PATTERN

24LC512T-E/MF (DFN-8-EP(5x6)) - 5. Recommended Land Pattern

IPC-7351B Footprint (9 Pads)Expand ›

6. Application SchematicSCHEMATIC

24LC512T-E/MF (DFN-8-EP(5x6)) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (7 figures · Page 1/1)

Showing 1–7 of 7 uncropped original figures for 24LC512T

P1 · p01_fig011777×661px

24LC512 2.5-5.5V 400 kHz I, E

P1 · p01_fig02867×783px

CS (Chip Scale)(1)

P1 · p01_fig031777×616px

24LC512T-E/MF (DFN-8-EP(5x6)) —  2010 Microchip Technology Inc. DS21754M-page 1 | Package Type | A0 | A1 | A2 | VSS | VCC | WP | SCL | SDA | 1 | 2 | 3 | 4 | 8 | 7 | 6 | 5 | 24XX512 | TSSOP | A0 A1 | A2 VSS | 1 2 3 4 | 8 7 6 5 | VCC | WP | SCL SDA | 24XX512 | DFN | A0 | A

 2010 Microchip Technology Inc. DS21754M-page 1 | Package Type | A0 | A1 | A2 | VSS | VCC | WP | SCL | SDA | 1 | 2 | 3 | 4 | 8 | 7 | 6 | 5 | 24XX512 | TSSOP | A0 A1 | A2 VSS | 1 2 3 4 | 8 7 6 5 | VCC | WP | SCL SDA | 24XX512 | DFN | A0 | A

P1 · p01_fig03P1

Datasheet Page 1 (p01_fig03)

P15 · p15_fig011412×1336px

24AA512/24LC512/24FC512

P15 · p15_fig021361×748px

 2010 Microchip Technology Inc. DS21754M-page 15

P15 · p15_fig01P15

Datasheet Page 15 (p15_fig01)

Technical Specifications & Part Details (24LC512T-E/MF)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:24LC512T-E/MF (DFN-8-EP(5x6)) is a 8-pin standard electronic & interconnect component featuring a 6.00 × 5.00 × 0.85 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 1.7V to 5.5V supply operation across -65°C to +150°C with integrated I2C interfaces.

Operating Supply VoltageV_CC / V_DD

1.7V to 5.5V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-65°C to +150°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

100 kHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

6.00 × 5.00 × 0.85 mm (A1=0.03 mm)

Package family: DFN (DFN-8-EP(5x6))

Pin Count & Lead PitchN / e

8 Pins | Pitch e = 1.27 mm (50.0 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

I2C

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol9 auto-grouped pins

IPC-7351B Land Pattern9 pads · Pitch 1.27mm

IPC-7525 60% Solder PasteEPAD 4.00×2.30mm windowed grid

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (DFN-8-EP(5x6))

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

6.00 × 5.00 mm

Height (A) & Pitch (e)IPC-7351B

A=0.85mm · e=1.27mm

Pad Size (W × L)Level B

0.45 × 1.10 mm

Pins / Total PadsTopology

9P / 9Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit DFN-8-EP(5x6)	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — 24LC512T-E/MF (DFN-8-EP(5x6))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of 24LC512T-E/MF (DFN-8-EP(5x6))?

Manufactured by MICROCHIP, the 24LC512T-E/MF is housed in a DFN-8-EP(5x6) package with 9 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 1.7V to 5.5V. Key pins include: 1 (A0: Multiplexed I/O & Peripheral Pin A0 (General)), 2 (A1: Multiplexed I/O & Peripheral Pin A1 (General)), 3 (A2: Multiplexed I/O & Peripheral Pin A2 (General)), 4 (VSS: Ground Reference Pin (VSS)), 5 (SDA: Multiplexed I/O & Peripheral Pin SDA (I2C)), 6 (SCL: Multiplexed I/O & Peripheral Pin SCL (I2C)).

What are the IPC-7351B PCB Footprint dimensions for 24LC512T-E/MF?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), 24LC512T-E/MF (DFN-8-EP(5x6)) has a nominal body envelope of 5.00 × 6.00 mm, pitch e = 1.27 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 4.00 × 2.30 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for 24LC512T-E/MF?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for 24LC512T-E/MF (MICROCHIP, DFN-8-EP(5x6)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (9 pins) & 24LC512T Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	A0	Digital_IO	Signal terminal A0 (I/O, 1.7V to 5.5V domain). Multiplexed alternate functions: A0. Supported peripheral buses: General.
2	A1	Digital_IO	Signal terminal A1 (I/O, 1.7V to 5.5V domain). Multiplexed alternate functions: A1. Supported peripheral buses: General.
3	A2	Digital_IO	Signal terminal A2 (I/O, 1.7V to 5.5V domain). Multiplexed alternate functions: A2. Supported peripheral buses: General.
4	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
5	SDA	Digital_IO	Signal terminal SDA (I/O, 1.7V to 5.5V domain). Multiplexed alternate functions: SDA. Supported peripheral buses: I2C.
6	SCL	Digital_IO	Signal terminal SCL (I/O, 1.7V to 5.5V domain). Multiplexed alternate functions: SCL. Supported peripheral buses: I2C.
7	WP	Digital_IO	Signal terminal WP (I/O, 1.7V to 5.5V domain). Multiplexed alternate functions: WP. Supported peripheral buses: General.
8	VCC	Power_In	Primary positive power supply input (VCC) operating in the 1.7V to 5.5V domain (Max rating: 5.5V).
9	EP	GND	Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.

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