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FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) — Symbol, Footprint IPC-7351B & 3D STEP Model

FDC9216BP

MICROCHIPID: C20579389PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL · 8 Pins · Pitch 2.54mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL)1DSKD#2SEPCLK3REFCLK4GND8VDD7SEPD#6CD15CD0Grid Pitch = 2.54mm (IEEE-315)-15.2-10.2-5.105.110.215.210.25.10-5.1-10.2mm
2. 2D FOOTPRINT
12345678E=6.35mm · Pitch e=2.54mmD=9.62mm-7-5-3-113577531-1-3-5-7mm
3. 3D CAD MODEL
Package Body: 6.35mm × 9.62mm · Pitch: 2.54mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (8/8)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1DSKD#I/OMultiplexed I/O & Peripheral Pin DSKD# (General)
2SEPCLKI/OMultiplexed I/O & Peripheral Pin SEPCLK (General)
3REFCLKI/OMultiplexed I/O & Peripheral Pin REFCLK (General)
4GNDGNDGround Reference Pin (GND)
5CD0I/OMultiplexed I/O & Peripheral Pin CD0 (General)
6CD1I/OMultiplexed I/O & Peripheral Pin CD1 (General)
7SEPD#I/OMultiplexed I/O & Peripheral Pin SEPD# (General)
8VDDPowerPower Supply Input (VDD — 3.3V / 5.0V Standard Logic)
PIN 1 DSKD#
I/O
Multiplexed I/O & Peripheral Pin DSKD# (General)
Design note: Signal terminal DSKD# (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DSKD#. Supported peripheral buses: General.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 5 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: FDC9216BP (MICROCHIP · PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) - 2. Standard Pinout (Top View)
True package pinout (8 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) - 4. Package Dimensions (D×E×A)
PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL · 6.35×9.62mm · Pitch 2.54mmExpand ›
5. Recommended Land PatternLAND PATTERN
FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) - 5. Recommended Land Pattern
IPC-7351B Footprint (8 Pads)Expand ›
6. Application SchematicSCHEMATIC
FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (5 figures · Page 1/1)
Showing 1–5 of 5 uncropped original figures for FDC9216
P1 · p01_fig011803×2302px
FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) — —= UPC FAMILY Floppy Disk Data Separator FEATURES PIN CONFIGURATION COPERFORMS COMPLETE DATA SEPARATION FUNCTION FOR FLOPPY DISK DRIVES COSEPARATES FM OR MFM ENCODED DATA FROM ANY MAGNETIC MEDIA CIELIMINATES SEVERAL SSI AND DSKD (14 80 Vo M
—= UPC FAMILY Floppy Disk Data Separator FEATURES PIN CONFIGURATION COPERFORMS COMPLETE DATA SEPARATION FUNCTION FOR FLOPPY DISK DRIVES COSEPARATES FM OR MFM ENCODED DATA FROM ANY MAGNETIC MEDIA CIELIMINATES SEVERAL SSI AND DSKD (14 80 Vo M
P1 · p01_fig01P1
FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) — Datasheet Page 1 (p01_fig01)
Datasheet Page 1 (p01_fig01)
P2 · p02_fig011803×2302px
FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) — DESCRIPTION OF PIN FUNCTIONS [PINNO.[ NAME [SyMBOL_[ FUNCTION. i 1 Disk Data DSKD Data input signal direct from disk drive. Contains combined clock and data waveform. 2 Separated Clock SEPCLK Clock signal output from the FDDS derived from f
DESCRIPTION OF PIN FUNCTIONS [PINNO.[ NAME [SyMBOL_[ FUNCTION. i 1 Disk Data DSKD Data input signal direct from disk drive. Contains combined clock and data waveform. 2 Separated Clock SEPCLK Clock signal output from the FDDS derived from f
P3 · p03_fig011803×2302px
FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) — OPERATION Areference clock (REFCLK) of between 2 and 8 MHz Separate short and long term timing correctors is divided by the FODS to provide an internal clock. assure accurate clock separation. The division ratio is selected by inputs CDO an
OPERATION Areference clock (REFCLK) of between 2 and 8 MHz Separate short and long term timing correctors is divided by the FODS to provide an internal clock. assure accurate clock separation. The division ratio is selected by inputs CDO an
P4 · p04_fig011803×2302px
FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) — MAXIMUM GUARANTEED RATINGS* Operating Temperature Range ..........cccseceeeeeeeeeeseesseeeeessesseeeeseeseeeeresas OPC to +70°C Storage Temperature Range .........ece cee recee eee eeneeeeterneeseeeneeee ee reeeeees —55°C to + 150°C Lead Te
MAXIMUM GUARANTEED RATINGS* Operating Temperature Range ..........cccseceeeeeeeeeeseesseeeeessesseeeeseeseeeeresas OPC to +70°C Storage Temperature Range .........ece cee recee eee eeneeeeterneeseeeneeee ee reeeeees —55°C to + 150°C Lead Te

Technical Specifications & Part Details (FDC9216BP)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) is a 8-pin standard electronic & interconnect component featuring a 9.62 × 6.35 × 4.20 mm mechanical envelope (lead pitch e = 2.54 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
9.62 × 6.35 × 4.20 mm (A1=0.51 mm)
Package family: DIP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL)
Pin Count & Lead PitchN / e
8 Pins | Pitch e = 2.54 mm (100.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol8 auto-grouped pins
OK
IPC-7351B Land Pattern8 pads · Pitch 2.54mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
9.62 × 6.35 mm
Height (A) & Pitch (e)IPC-7351B
A=4.20mm · e=2.54mm
Pad Size (W × L)Level B
1.60 × 1.60 mm
Pins / Total PadsTopology
8P / 8Pad (THT_DIP)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL)?

Manufactured by MICROCHIP, the FDC9216BP is housed in a PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL package with 8 pins and a 2.54 mm lead pitch. Key pins include: 1 (DSKD#: Multiplexed I/O & Peripheral Pin DSKD# (General)), 2 (SEPCLK: Multiplexed I/O & Peripheral Pin SEPCLK (General)), 3 (REFCLK: Multiplexed I/O & Peripheral Pin REFCLK (General)), 4 (GND: Ground Reference Pin (GND)), 5 (CD0: Multiplexed I/O & Peripheral Pin CD0 (General)), 6 (CD1: Multiplexed I/O & Peripheral Pin CD1 (General)).

What are the IPC-7351B PCB Footprint dimensions for FDC9216BP?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), FDC9216BP (PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) has a nominal body envelope of 6.35 × 9.62 mm, pitch e = 2.54 mm, and 8 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for FDC9216BP?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for FDC9216BP (MICROCHIP, PDIP-8_L9.4-W7.0-P2.54-LS7.6-BL) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (8 pins) & FDC9216 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1DSKD#Digital_IOSignal terminal DSKD# (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DSKD#. Supported peripheral buses: General.
2SEPCLKDigital_IOSignal terminal SEPCLK (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: SEPCLK. Supported peripheral buses: General.
3REFCLKDigital_IOSignal terminal REFCLK (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: REFCLK. Supported peripheral buses: General.
4GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
5CD0Digital_IOSignal terminal CD0 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: CD0. Supported peripheral buses: General.
6CD1Digital_IOSignal terminal CD1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: CD1. Supported peripheral buses: General.
7SEPD#Digital_IOSignal terminal SEPD# (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: SEPD#. Supported peripheral buses: General.
8VDDPower_InPrimary positive power supply input (VDD) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
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