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DSC6011HI2A-000.0000T (SMD1612-4P) — Symbol, Footprint IPC-7351B & 3D STEP Model

DSC6011HI2A-000.0000T

MICROCHIPID: C2040985SMD1612-4P · 4 Pins · Pitch 0.75mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · DSC6011HI2A-000.0000T (SMD1612-4P)1Output2GND4VDD3DNCGrid Pitch = 2.54mm (IEEE-315)-20.3-15.2-10.2-5.105.110.215.220.310.25.10-5.1-10.2mm
2. 2D FOOTPRINT
4321E=1.60mm · Pitch e=0.75mmD=1.20mm-3-2-10123210-1-2mm
3. 3D CAD MODEL
Package Body: 1.60mm × 1.20mm · Pitch: 0.75mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (4/4)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1OutputI/OMultiplexed I/O & Peripheral Pin Output (RTC/CLK)
2GNDGNDGround Reference Pin (GND)
3DNCI/OMultiplexed I/O & Peripheral Pin DNC (General)
4VDDPowerPower Supply Input (VDD — 1.71V to 3.63V)
PIN 1 Output
I/O
Multiplexed I/O & Peripheral Pin Output (RTC/CLK)
Design note: Oscillatorclockoutput
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 13 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: DSC6011HI2A-000.0000T (MICROCHIP · SMD1612-4P)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
DSC6011HI2A-000.0000T (SMD1612-4P) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
DSC6011HI2A-000.0000T (SMD1612-4P) - 2. Standard Pinout (Top View)
True package pinout (4 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
DSC6011HI2A-000.0000T (SMD1612-4P) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
DSC6011HI2A-000.0000T (SMD1612-4P) - 4. Package Dimensions (D×E×A)
SMD1612-4P · 1.60×1.20mm · Pitch 0.75mmExpand ›
5. Recommended Land PatternLAND PATTERN
DSC6011HI2A-000.0000T (SMD1612-4P) - 5. Recommended Land Pattern
IPC-7351B Footprint (4 Pads)Expand ›
6. Application SchematicSCHEMATIC
DSC6011HI2A-000.0000T (SMD1612-4P) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (13 figures · Page 1/2)
Showing 1–12 of 13 uncropped original figures for DSC6001 / DSC6003 / DSC6011
P1 · p01_fig01376×200px
DSC6011HI2A-000.0000T (SMD1612-4P) — Ultra-Small, Ultra-Low Power MEMS Oscillator
Ultra-Small, Ultra-Low Power MEMS Oscillator
P1 · p01_fig02867×728px
DSC6011HI2A-000.0000T (SMD1612-4P) — Package Types | DSC60XX 3.2 mm x 2.5 mm DFN 2.5 mm x 2.0 mm LGA 2.0 mm x 1.6 mm LGA 1.6 mm x 1.2 mm LGA (Top View) | OE/STBY/FS 4 | GND | VDD | OUT 3 2 | 1
Package Types | DSC60XX 3.2 mm x 2.5 mm DFN 2.5 mm x 2.0 mm LGA 2.0 mm x 1.6 mm LGA 1.6 mm x 1.2 mm LGA (Top View) | OE/STBY/FS 4 | GND | VDD | OUT 3 2 | 1
P2 · p02_fig011582×1039px
DSC6011HI2A-000.0000T (SMD1612-4P) — SUPPLY REGULATION
SUPPLY REGULATION
P2 · p02_fig021319×647px
DSC6011HI2A-000.0000T (SMD1612-4P) — PIN 2
PIN 2
P2 · p02_fig02P2
DSC6011HI2A-000.0000T (SMD1612-4P) — Datasheet Page 2 (p02_fig02)
Datasheet Page 2 (p02_fig02)
P9 · p09_fig011777×2389px
DSC6011HI2A-000.0000T (SMD1612-4P) — DSC60XX | 5.0 PACKAGING INFORMATION | 4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline | 0.07 C A B 0.03 C | (DATUM B) | (DATUM A) | C | SEATING | PLANE | NOTE 1 | 1 2 | N | TOP VIEW | SIDE VIEW | BOTTOM VIEW | NOTE 1 | 1 2 | N | 0.10 C | 0.08
DSC60XX | 5.0 PACKAGING INFORMATION | 4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline | 0.07 C A B 0.03 C | (DATUM B) | (DATUM A) | C | SEATING | PLANE | NOTE 1 | 1 2 | N | TOP VIEW | SIDE VIEW | BOTTOM VIEW | NOTE 1 | 1 2 | N | 0.10 C | 0.08
P10 · p10_fig011777×2381px
DSC6011HI2A-000.0000T (SMD1612-4P) — DSC60XX | 4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline | Microchip Technology Drawing C04-1199A Sheet 2 of 2 | REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact val
DSC60XX | 4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline | Microchip Technology Drawing C04-1199A Sheet 2 of 2 | REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact val
P11 · p11_fig011641×2074px
DSC6011HI2A-000.0000T (SMD1612-4P) — 4-Lead VFLGA 1.6 mm x 1.2 mm Recommended Land Pattern | RECOMMENDED LAND PATTERN | Dimension Limits | Units | X2 Contact Width | Contact Pitch | MILLIMETERS | 1.20 BSC MIN E1 | MAX | Space Between Contacts (X4) Contact Pad Length (X6) | G1
4-Lead VFLGA 1.6 mm x 1.2 mm Recommended Land Pattern | RECOMMENDED LAND PATTERN | Dimension Limits | Units | X2 Contact Width | Contact Pitch | MILLIMETERS | 1.20 BSC MIN E1 | MAX | Space Between Contacts (X4) Contact Pad Length (X6) | G1
P11 · p11_fig01P11
DSC6011HI2A-000.0000T (SMD1612-4P) — Datasheet Page 11 (p11_fig01)
Datasheet Page 11 (p11_fig01)
P13 · p13_fig011635×2093px
DSC6011HI2A-000.0000T (SMD1612-4P) — 4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline (Continued)
4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline (Continued)
P13 · p13_fig01P13
DSC6011HI2A-000.0000T (SMD1612-4P) — Datasheet Page 13 (p13_fig01)
Datasheet Page 13 (p13_fig01)
P14 · p14_fig011777×2734px
DSC6011HI2A-000.0000T (SMD1612-4P) — DSC60XX | DS20005625C-page 14  2017-2018 Microchip Technology Inc. | 4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline | RECOMMENDED LAND PATTERN | Dimension Limits | Units | X2 Contact Width (X2) | Contact Pitch | MILLIMETERS | 1.55 BSC MIN E
DSC60XX | DS20005625C-page 14  2017-2018 Microchip Technology Inc. | 4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline | RECOMMENDED LAND PATTERN | Dimension Limits | Units | X2 Contact Width (X2) | Contact Pitch | MILLIMETERS | 1.55 BSC MIN E
Page 1 / 2 (13 extracted figures)

Technical Specifications & Part Details (DSC6011HI2A-000.0000T)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:DSC6011HI2A-000.0000T (SMD1612-4P) is a 4-pin standard electronic & interconnect component featuring a 1.60 × 1.20 × 0.75 mm mechanical envelope (lead pitch e = 0.75 mm). Rated for 1.71V to 3.63V supply operation across 40°C to 85°C with integrated RTC/CLK interfaces.
Operating Supply VoltageV_CC / V_DD
1.71V to 3.63V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
40°C to 85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
2 kHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
1.60 × 1.20 × 0.75 mm (A1=0.02 mm)
Package family: OTHER (SMD1612-4P)
Pin Count & Lead PitchN / e
4 Pins | Pitch e = 0.75 mm (29.5 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
RTC/CLK
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol4 auto-grouped pins
OK
IPC-7351B Land Pattern4 pads · Pitch 0.75mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SMD1612-4P)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
1.60 × 1.20 mm
Height (A) & Pitch (e)IPC-7351B
A=0.75mm · e=0.75mm
Pad Size (W × L)Level B
0.35 × 0.50 mm
Pins / Total PadsTopology
4P / 4Pad (CUSTOM_ARRAY)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SMD1612-4P
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — DSC6011HI2A-000.0000T (SMD1612-4P)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of DSC6011HI2A-000.0000T (SMD1612-4P)?

Manufactured by MICROCHIP, the DSC6011HI2A-000.0000T is housed in a SMD1612-4P package with 4 pins and a 0.75 mm lead pitch, supporting a VCC supply range of 1.71V to 3.63V. Key pins include: 1 (Output: Multiplexed I/O & Peripheral Pin Output (RTC/CLK)), 2 (GND: Ground Reference Pin (GND)), 3 (DNC: Multiplexed I/O & Peripheral Pin DNC (General)), 4 (VDD: Power Supply Input (VDD — 1.71V to 3.63V)).

What are the IPC-7351B PCB Footprint dimensions for DSC6011HI2A-000.0000T?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), DSC6011HI2A-000.0000T (SMD1612-4P) has a nominal body envelope of 1.20 × 1.60 mm, pitch e = 0.75 mm, and 4 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for DSC6011HI2A-000.0000T?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for DSC6011HI2A-000.0000T (MICROCHIP, SMD1612-4P) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (4 pins) & DSC6001 / DSC6003 / DSC6011 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1OutputDigital_IOSignal terminal Output (I/O, 1.71V to 3.63V domain). Multiplexed alternate functions: Output. Supported peripheral buses: RTC/CLK.
2GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
3DNCNCSignal terminal DNC (I/O, 1.71V to 3.63V domain). Multiplexed alternate functions: DNC. Supported peripheral buses: General.
4VDDPower_InPrimary positive power supply input (VDD) operating in the 1.71V to 3.63V domain (Max rating: 3.63V).
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