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1N4097 (Through Hole) — Symbol, Footprint IPC-7351B & 3D STEP Model

1N4097

MICROCHIPID: C20288663Through Hole · 2 Pins · Pitch 0.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · 1N4097 (Through Hole)1K2AGrid Pitch = 2.54mm (IEEE-315)-15.2-10.2-5.105.110.215.210.25.10-5.1-10.2mm
2. 2D FOOTPRINT
12E=2.00mm · Pitch e=0.50mmD=2.00mm-7-5-3-1135731-1-3mm
3. 3D CAD MODEL
Package Body: 2.00mm × 2.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (2/2)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1KI/OMultiplexed I/O & Peripheral Pin K (General)
2AI/OMultiplexed I/O & Peripheral Pin A (General)
PIN 1 K
I/O
Multiplexed I/O & Peripheral Pin K (General)
Design note: Signal terminal K (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: K. Supported peripheral buses: General.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 3 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: 1N4097 (MICROCHIP · Through Hole)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
1N4097 (Through Hole) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
1N4097 (Through Hole) - 2. Standard Pinout (Top View)
True package pinout (2 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
1N4097 (Through Hole) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
1N4097 (Through Hole) - 4. Package Dimensions (D×E×A)
Through Hole · 2.00×2.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
1N4097 (Through Hole) - 5. Recommended Land Pattern
IPC-7351B Footprint (2 Pads)Expand ›
6. Application SchematicSCHEMATIC
1N4097 (Through Hole) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (3 figures · Page 1/1)
Showing 1–3 of 3 uncropped original figures for 1N4097
P1 · p01_fig011739×2304px
1N4097 (Through Hole) — PDF Figure p01_fig01 (Page 1 — OTHER_DIAGRAM)
PDF Figure p01_fig01 (Page 1 — OTHER_DIAGRAM)
P2 · p02_fig011737×2303px
1N4097 (Through Hole) — 1N5063 - 1N5117, MZ806 - MZ890, MZ 210 - MZ 240 WeNGoe . ® NX pT ING ET PEERANEE z iN eReeNE ” 20 Pitt te tTN 0 25 50 75 100 125 (150 175 AMBIENT TEMPERATURE °C FIGURE 2 EXPLANATION OF ZENER CHARACTERISTICS 1000 ZENER IMPEDANCE zener Get \
1N5063 - 1N5117, MZ806 - MZ890, MZ 210 - MZ 240 WeNGoe . ® NX pT ING ET PEERANEE z iN eReeNE ” 20 Pitt te tTN 0 25 50 75 100 125 (150 175 AMBIENT TEMPERATURE °C FIGURE 2 EXPLANATION OF ZENER CHARACTERISTICS 1000 ZENER IMPEDANCE zener Get \
P2 · p02_fig01P2
1N4097 (Through Hole) — Datasheet Page 2 (p02_fig01)
Datasheet Page 2 (p02_fig01)

Technical Specifications & Part Details (1N4097)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:1N4097 (Through Hole) is a 2-pin standard electronic & interconnect component featuring a 2.00 × 2.00 × 0.75 mm mechanical envelope (lead pitch e = 0.00 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
2.00 × 2.00 × 0.75 mm (A1=0.02 mm)
Package family: OTHER (Through Hole)
Pin Count & Lead PitchN / e
2 Pins
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol2 auto-grouped pins
OK
IPC-7351B Land Pattern2 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (Through Hole)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
2.00 × 2.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.75mm · e=0.50mm
Pad Size (W × L)Level B
0.40 × 0.90 mm
Pins / Total PadsTopology
2P / 2Pad (CUSTOM_ARRAY)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
Through Hole
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — 1N4097 (Through Hole)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of 1N4097 (Through Hole)?

Manufactured by MICROCHIP, the 1N4097 is housed in a Through Hole package with 2 pins and a 0.50 mm lead pitch. Key pins include: 1 (K: Multiplexed I/O & Peripheral Pin K (General)), 2 (A: Multiplexed I/O & Peripheral Pin A (General)).

What are the IPC-7351B PCB Footprint dimensions for 1N4097?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), 1N4097 (Through Hole) has a nominal body envelope of 2.00 × 2.00 mm, pitch e = 0.50 mm, and 2 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for 1N4097?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for 1N4097 (MICROCHIP, Through Hole) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (2 pins) & 1N4097 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1KDigital_IOSignal terminal K (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: K. Supported peripheral buses: General.
2ADigital_IOSignal terminal A (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: A. Supported peripheral buses: General.
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