MSOP-10 · 10P
Synchronized Pinout (Symbol / 2D / 3D) (10/10)
Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D| Pin | Symbol | Type | Function (EN) |
|---|---|---|---|
| 1 | EN# | I/O | Multiplexed I/O & Peripheral Pin EN# (General) |
| 2 | DIN | I/O | Multiplexed I/O & Peripheral Pin DIN (General) |
| 3 | DIN# | I/O | Multiplexed I/O & Peripheral Pin DIN# (General) |
| 4 | VREF | Analog | Multiplexed I/O & Peripheral Pin VREF (General) |
| 5 | LOSLVL | I/O | Multiplexed I/O & Peripheral Pin LOSLVL (General) |
| 6 | GND | GND | Ground Reference Pin (GND) |
| 7 | LOS# | I/O | Multiplexed I/O & Peripheral Pin LOS# (General) |
| 8 | DOUT# | I/O | Multiplexed I/O & Peripheral Pin DOUT# (General) |
| 9 | DOUT | I/O | Multiplexed I/O & Peripheral Pin DOUT (General) |
| 10 | VCC | Power | Power Supply Input (VCC — 3.3V / 5.0V Standard Logic) |
PIN 1 EN#
I/OMultiplexed I/O & Peripheral Pin EN# (General)
Design note: Signal terminal EN# (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: EN#. Supported peripheral buses: General.
IPC-7351B Solder Density & Span C/G/Z Tuner
Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 7 Extracted Figures)
Read the original datasheet PDF directly or click any drawing to view fullscreen1. Realistic 3D PackageREPRESENTATIVE
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
True package pinout (10 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
MSOP-10 · 3.00×3.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
IPC-7351B Footprint (10 Pads)Expand ›
6. Application SchematicSCHEMATIC
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (7 figures · Page 1/1)
Showing 1–7 of 7 uncropped original figures for SY88913
P1 · p01_fig012038×2810px
P2 · p02_fig012039×2701px
P2 · p02_fig01P2
P5 · p05_fig012038×2701px
P6 · p06_fig012038×2701px
P7 · p07_fig012038×2701px
P8 · p08_fig012038×2701px
Technical Specifications & Part Details (SY88913KC)
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)Detailed Overview:SY88913KC (MSOP-10) is a 10-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 1.10 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across 40°C to +85°C with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
40°C to +85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
55MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
3.00 × 3.00 × 1.10 mm (A1=0.08 mm)
Package family: TSSOP (MSOP-10)
Pin Count & Lead PitchN / e
10 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.
5-Point Standards Verification
Automated compliance checks prior to exportIEEE-315 Symbol10 auto-grouped pins
IPC-7351B Land Pattern10 pads · Pitch 0.50mm
IPC-7525 60% Solder PasteReflow 1:1 Standard
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
Hardware Verification & Community Engineering Reviews
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet5.00 PCB Verified
IPC-7351B
Select package variant or sibling MPN sharing this datasheetFamily Variants & Same Datasheet Chips — SY88913 (2)
MSOP-10 · 10P
Mechanical Dimensions & Land Pattern (MSOP-10)
Extracted from Datasheet & IPC-7351B NormalizedPackage Body (D × E)Nominal
3.00 × 3.00 mm
Height (A) & Pitch (e)IPC-7351B
A=1.10mm · e=0.50mm
Pad Size (W × L)Level B
0.30 × 1.25 mm
Pins / Total PadsTopology
10P / 10Pad (DUAL_ROW)
Recommended Companion BOM & Drop-In Equivalents
Passive external components per reference schematic and 1:1 pin-compatible alternatives| Designator / Replacement MPN | Value / Package | Function & PCB Layout Rule |
|---|---|---|
| N/A BOM | Per application circuit MSOP-10 | Size power & signal trace widths for rated load current following IPC-2221 clearance rules. |
Technical Frequently Asked Questions (FAQ) — SY88913KC (MSOP-10)
Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formatsWhat is the Pinout and operating voltage specification of SY88913KC (MSOP-10)?
Manufactured by MICROCHIP, the SY88913KC is housed in a MSOP-10 package with 10 pins and a 0.50 mm lead pitch. Key pins include: 1 (EN#: Multiplexed I/O & Peripheral Pin EN# (General)), 2 (DIN: Multiplexed I/O & Peripheral Pin DIN (General)), 3 (DIN#: Multiplexed I/O & Peripheral Pin DIN# (General)), 4 (VREF: Multiplexed I/O & Peripheral Pin VREF (General)), 5 (LOSLVL: Multiplexed I/O & Peripheral Pin LOSLVL (General)), 6 (GND: Ground Reference Pin (GND)).
What are the IPC-7351B PCB Footprint dimensions for SY88913KC?
Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), SY88913KC (MSOP-10) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.50 mm, and 10 copper pads.
Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for SY88913KC?
You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for SY88913KC (MICROCHIP, MSOP-10) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.
Static Reference Appendix: Pinout Table (10 pins) & SY88913 Family VariantsExpand static table
| Pin # | Signal Name | Electrical Type | Functional Description & Design Notes |
|---|---|---|---|
| 1 | EN# | Digital_IO | Signal terminal EN# (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: EN#. Supported peripheral buses: General. |
| 2 | DIN | Digital_IO | Signal terminal DIN (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DIN. Supported peripheral buses: General. |
| 3 | DIN# | Digital_IO | Signal terminal DIN# (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DIN#. Supported peripheral buses: General. |
| 4 | VREF | Analog | Signal terminal VREF (Analog, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VREF. Supported peripheral buses: General. |
| 5 | LOSLVL | Digital_IO | Signal terminal LOSLVL (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: LOSLVL. Supported peripheral buses: General. |
| 6 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |
| 7 | LOS# | Digital_IO | Signal terminal LOS# (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: LOS#. Supported peripheral buses: General. |
| 8 | DOUT# | Digital_IO | Signal terminal DOUT# (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DOUT#. Supported peripheral buses: General. |
| 9 | DOUT | Digital_IO | Signal terminal DOUT (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DOUT. Supported peripheral buses: General. |
| 10 | VCC | Power_In | Primary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V). |