MRF89XAM9AT-I/RM (SMD-12P) — Symbol, Footprint IPC-7351B & 3D STEP Model

MRF89XAM9AT-I/RM

MICROCHIPID: C1844934SMD-12P · 12 Pins · Pitch 0.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · MRF89XAM9AT-I/RM (SMD-12P)1GND2RESET3CSCON4IRQ05SDI6SCK12GND11GND10Vin9IRQ18CSDATA7SDOGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.812.77.62.5-2.5-7.6-12.7mm
2. 2D FOOTPRINT
123456789101112E=17.80mm · Pitch e=0.50mmD=28.00mm-17-15-13-11-9-7-5-3-1135791113151721191715131197531-1-3-5-7-9-11-13-15-17-19-21mm
3. 3D CAD MODEL
Package Body: 17.80mm × 28.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (12/12)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1GNDGNDGround Reference Pin (GND)
2RESETISystem Enable & Hardware Reset (RESET)
3CSCONI/OMultiplexed I/O & Peripheral Pin CSCON (General)
4IRQ0I/OMultiplexed I/O & Peripheral Pin IRQ0 (General)
5SDII/OMultiplexed I/O & Peripheral Pin SDI (General)
6SCKI/OMultiplexed I/O & Peripheral Pin SCK (SPI)
7SDOI/OMultiplexed I/O & Peripheral Pin SDO (General)
8CSDATAI/OMultiplexed I/O & Peripheral Pin CSDATA (General)
9IRQ1I/OMultiplexed I/O & Peripheral Pin IRQ1 (General)
10VinPowerPower Supply Input (Vin — 2.1–3.6V)
11GNDGNDGround Reference Pin (GND)
12GNDGNDGround Reference Pin (GND)
PIN 1 GND
GND
Ground Reference Pin (GND)
Design note: Ground
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 13 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: MRF89XAM9AT-I/RM (MICROCHIP · SMD-12P)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
MRF89XAM9AT-I/RM (SMD-12P) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
MRF89XAM9AT-I/RM (SMD-12P) - 2. Standard Pinout (Top View)
True package pinout (12 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
MRF89XAM9AT-I/RM (SMD-12P) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
MRF89XAM9AT-I/RM (SMD-12P) - 4. Package Dimensions (D×E×A)
SMD-12P · 17.80×28.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
MRF89XAM9AT-I/RM (SMD-12P) - 5. Recommended Land Pattern
IPC-7351B Footprint (12 Pads)Expand ›
6. Application SchematicSCHEMATIC
MRF89XAM9AT-I/RM (SMD-12P) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (13 figures · Page 1/2)
Showing 1–12 of 13 uncropped original figures for MRF89XAM9AT
P1 · p01_fig01377×201px
MRF89XAM9AT-I/RM (SMD-12P) — 915 MHz Ultra Low-Power Sub-GHz Transceiver Module
915 MHz Ultra Low-Power Sub-GHz Transceiver Module
P1 · p01_fig02276×431px
MRF89XAM9AT-I/RM (SMD-12P) — 2 3 4 5 6 | 1 | 7 | 8 9 10 RESET CSCON | SDO SDI SCK | 12 11 GND
2 3 4 5 6 | 1 | 7 | 8 9 10 RESET CSCON | SDO SDI SCK | 12 11 GND
P1 · p01_fig02P1
MRF89XAM9AT-I/RM (SMD-12P) — Datasheet Page 1 (p01_fig02)
Datasheet Page 1 (p01_fig02)
P2 · p02_fig011778×677px
MRF89XAM9AT-I/RM (SMD-12P) — TO OUR VALUED CUSTOMERS
TO OUR VALUED CUSTOMERS
P3 · p03_fig011778×908px
MRF89XAM9AT-I/RM (SMD-12P) — FIGURE 1-1: MRF89XAM9A BLOCK DIAGRAM
FIGURE 1-1: MRF89XAM9A BLOCK DIAGRAM
P4 · p04_fig011162×732px
MRF89XAM9AT-I/RM (SMD-12P) — FIGURE 1-2: MICROCONTROLLER TO MRF89XAM9A INTERFACE
FIGURE 1-2: MICROCONTROLLER TO MRF89XAM9A INTERFACE
P5 · p05_fig01883×946px
MRF89XAM9AT-I/RM (SMD-12P) — FIGURE 1-3: MODULE DETAILS
FIGURE 1-3: MODULE DETAILS
P5 · p05_fig02964×794px
MRF89XAM9AT-I/RM (SMD-12P) — FIGURE 1-4: RECOMMENDED PCB FOOTPRINT
FIGURE 1-4: RECOMMENDED PCB FOOTPRINT
P5 · p05_fig01P5
MRF89XAM9AT-I/RM (SMD-12P) — Datasheet Page 5 (p05_fig01)
Datasheet Page 5 (p05_fig01)
P9 · p09_fig011765×1387px
MRF89XAM9AT-I/RM (SMD-12P) — FIGURE 2-1: MRF89XAM9A APPLICATION SCHEMATIC
FIGURE 2-1: MRF89XAM9A APPLICATION SCHEMATIC
P9 · p09_fig01P9
MRF89XAM9AT-I/RM (SMD-12P) — Datasheet Page 9 (p09_fig01)
Datasheet Page 9 (p09_fig01)
P35 · p35_fig011824×2636px
MRF89XAM9AT-I/RM (SMD-12P) —  2011-2012 Microchip Technology Inc. Preliminary DS75017B-page 35 | Trademarks | FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Techn
 2011-2012 Microchip Technology Inc. Preliminary DS75017B-page 35 | Trademarks | FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Techn
Page 1 / 2 (13 extracted figures)

Technical Specifications & Part Details (MRF89XAM9AT-I/RM)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Wireless Wi-Fi / Bluetooth LE SoC Module
Detailed Overview:MRF89XAM9AT-I/RM (SMD-12P) is a 12-pin wireless wi-fi / bluetooth le soc module featuring a 28.00 × 17.80 × 3.10 mm mechanical envelope (lead pitch e = 0.00 mm). Rated for 2.1–3.6V supply operation across -40°C to +85°C with integrated SPI interfaces.
Operating Supply VoltageV_CC / V_DD
2.1–3.6V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to +85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
928 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
28.00 × 17.80 × 3.10 mm (A1=0.00 mm)
Package family: CASTELLATED_MODULE (SMD-12P)
Pin Count & Lead PitchN / e
12 Pins
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
SPI
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol12 auto-grouped pins
OK
IPC-7351B Land Pattern12 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteEPAD 19.78×14.70mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SMD-12P)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
28.00 × 17.80 mm
Height (A) & Pitch (e)IPC-7351B
A=3.10mm · e=0.50mm
Pad Size (W × L)Level B
0.40 × 0.90 mm
Pins / Total PadsTopology
12P / 12Pad (CASTELLATED_MODULE)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SMD-12P
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MRF89XAM9AT-I/RM (SMD-12P)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MRF89XAM9AT-I/RM (SMD-12P)?

Manufactured by MICROCHIP, the MRF89XAM9AT-I/RM is housed in a SMD-12P package with 12 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 2.1–3.6V. Key pins include: 1 (GND: Ground Reference Pin (GND)), 2 (RESET: System Enable & Hardware Reset (RESET)), 3 (CSCON: Multiplexed I/O & Peripheral Pin CSCON (General)), 4 (IRQ0: Multiplexed I/O & Peripheral Pin IRQ0 (General)), 5 (SDI: Multiplexed I/O & Peripheral Pin SDI (General)), 6 (SCK: Multiplexed I/O & Peripheral Pin SCK (SPI)).

What are the IPC-7351B PCB Footprint dimensions for MRF89XAM9AT-I/RM?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MRF89XAM9AT-I/RM (SMD-12P) has a nominal body envelope of 17.80 × 28.00 mm, pitch e = 0.50 mm, and 12 copper pads plus a central exposed thermal pad (EPAD) of 19.78 × 14.70 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MRF89XAM9AT-I/RM?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MRF89XAM9AT-I/RM (MICROCHIP, SMD-12P) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (12 pins) & MRF89XAM9AT Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
2RESETDigital_IOActive-low hardware reset terminal (RESET): pulling this pin Low resets the processor core and peripherals.
3CSCONDigital_IOSignal terminal CSCON (I/O, 2.1–3.6V domain). Multiplexed alternate functions: CSCON. Supported peripheral buses: General.
4IRQ0Digital_IOSignal terminal IRQ0 (I/O, 2.1–3.6V domain). Multiplexed alternate functions: IRQ0. Supported peripheral buses: General.
5SDIDigital_IOSignal terminal SDI (I/O, 2.1–3.6V domain). Multiplexed alternate functions: SDI. Supported peripheral buses: General.
6SCKDigital_IOSignal terminal SCK (I/O, 2.1–3.6V domain). Multiplexed alternate functions: SCK. Supported peripheral buses: SPI.
7SDODigital_IOSignal terminal SDO (I/O, 2.1–3.6V domain). Multiplexed alternate functions: SDO. Supported peripheral buses: General.
8CSDATADigital_IOSignal terminal CSDATA (I/O, 2.1–3.6V domain). Multiplexed alternate functions: CSDATA. Supported peripheral buses: General.
9IRQ1Digital_IOSignal terminal IRQ1 (I/O, 2.1–3.6V domain). Multiplexed alternate functions: IRQ1. Supported peripheral buses: General.
10VinPower_InPrimary positive power supply input (Vin) operating in the 2.1–3.6V domain (Max rating: 3.6V).
11GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
12GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.