![DSC1122CI2-125.0000 (SMD3225-6P) — 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]](/api/v1/assets/C1678098/extracted/figures/p14_fig01.png)
SMD3225-6P · 6P
6P3.2×2.5×1.00mmP=1.05mm
DSC1122 (SMD3225-6P)
Synchronized Pinout (Symbol / 2D / 3D) (6/6)
Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D| Pin | Symbol | Type | Function (EN) |
|---|---|---|---|
| 1 | EN | I | System Enable & Hardware Reset (EN) |
| 2 | NC | I/O | Multiplexed I/O & Peripheral Pin NC (General) |
| 3 | GND | GND | Ground Reference Pin (GND) |
| 4 | OUT | I/O | Multiplexed I/O & Peripheral Pin OUT (General) |
| 5 | OUT | I/O | Multiplexed I/O & Peripheral Pin OUT (General) |
| 6 | VDD | Power | Power Supply Input (VDD — 2.25V to 3.63V) |
PIN 1 EN
ISystem Enable & Hardware Reset (EN)
Design note: EnableorStandby .
IPC-7351B Solder Density & Span C/G/Z Tuner
Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 11 Extracted Figures)
Read the original datasheet PDF directly or click any drawing to view fullscreen1. Realistic 3D PackageREPRESENTATIVE
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
True package pinout (6 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
SMD3225-6P · 3.20×2.50mm · Pitch 1.05mmExpand ›
5. Recommended Land PatternLAND PATTERN
IPC-7351B Footprint (6 Pads)Expand ›
6. Application SchematicSCHEMATIC
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (11 figures · Page 1/1)
Showing 1–11 of 11 uncropped original figures for DSC1122
P1 · p01_fig01376×200px
P5 · p05_fig011777×658px
P5 · p05_fig01P5
P8 · p08_fig011776×1305px
P8 · p08_fig021265×724px
P14 · p14_fig011599×977px
P15 · p15_fig011599×1161px
P15 · p15_fig01P15
P18 · p18_fig011599×1048px
P18 · p18_fig01P18
P19 · p19_fig011216×813px
Technical Specifications & Part Details (DSC1122CI2-125.0000)
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)Detailed Overview:DSC1122CI2-125.0000 (SMD3225-6P) is a 6-pin standard electronic & interconnect component featuring a 3.20 × 2.50 × 1.00 mm mechanical envelope (lead pitch e = 1.05 mm). Rated for 2.25V to 3.63V supply operation across 40°C to +105°C with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
2.25V to 3.63V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
40°C to +105°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
2.3
MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
3.20 × 2.50 × 1.00 mm (A1=0.02 mm)
Package family: OTHER (SMD3225-6P)
Pin Count & Lead PitchN / e
6 Pins | Pitch e = 1.05 mm (41.3 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.
5-Point Standards Verification
Automated compliance checks prior to exportIEEE-315 Symbol6 auto-grouped pins
IPC-7351B Land Pattern6 pads · Pitch 1.05mm
IPC-7525 60% Solder PasteReflow 1:1 Standard
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
Hardware Verification & Community Engineering Reviews
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet5.00 PCB Verified
IPC-7351B
Select package variant or sibling MPN sharing this datasheetFamily Variants & Same Datasheet Chips — DSC1122 (3)
SMD3225-6P · 6P
6P3.2×2.5×1.00mmP=1.05mm
DSC1122 (SMD3225-6P)
SMD3225-6P · 6P
6P3.2×2.5×1.00mmP=1.05mm
DSC1122 (SMD3225-6P)
Mechanical Dimensions & Land Pattern (SMD3225-6P)
Extracted from Datasheet & IPC-7351B NormalizedPackage Body (D × E)Nominal
3.20 × 2.50 mm
Height (A) & Pitch (e)IPC-7351B
A=1.00mm · e=1.05mm
Pad Size (W × L)Level B
1.00 × 1.05 mm
Pins / Total PadsTopology
6P / 6Pad (CUSTOM_ARRAY)
Recommended Companion BOM & Drop-In Equivalents
Passive external components per reference schematic and 1:1 pin-compatible alternatives| Designator / Replacement MPN | Value / Package | Function & PCB Layout Rule |
|---|---|---|
| N/A BOM | Per application circuit SMD3225-6P | Size power & signal trace widths for rated load current following IPC-2221 clearance rules. |
Technical Frequently Asked Questions (FAQ) — DSC1122CI2-125.0000 (SMD3225-6P)
Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formatsWhat is the Pinout and operating voltage specification of DSC1122CI2-125.0000 (SMD3225-6P)?
Manufactured by MICROCHIP, the DSC1122CI2-125.0000 is housed in a SMD3225-6P package with 6 pins and a 1.05 mm lead pitch, supporting a VCC supply range of 2.25V to 3.63V. Key pins include: 1 (EN: System Enable & Hardware Reset (EN)), 2 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 3 (GND: Ground Reference Pin (GND)), 4 (OUT: Multiplexed I/O & Peripheral Pin OUT (General)), 5 (OUT: Multiplexed I/O & Peripheral Pin OUT (General)), 6 (VDD: Power Supply Input (VDD — 2.25V to 3.63V)).
What are the IPC-7351B PCB Footprint dimensions for DSC1122CI2-125.0000?
Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), DSC1122CI2-125.0000 (SMD3225-6P) has a nominal body envelope of 2.50 × 3.20 mm, pitch e = 1.05 mm, and 6 copper pads.
Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for DSC1122CI2-125.0000?
You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for DSC1122CI2-125.0000 (MICROCHIP, SMD3225-6P) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.
Static Reference Appendix: Pinout Table (6 pins) & DSC1122 Family VariantsExpand static table
| Pin # | Signal Name | Electrical Type | Functional Description & Design Notes |
|---|---|---|---|
| 1 | EN | Digital_IO | Chip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset. |
| 2 | NC | NC | Signal terminal NC (I/O, 2.25V to 3.63V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General. |
| 3 | GND | GND | 0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks. |
| 4 | OUT | Digital_IO | Signal terminal OUT (I/O, 2.25V to 3.63V domain). Multiplexed alternate functions: OUT. Supported peripheral buses: General. |
| 5 | OUT | Digital_IO | Signal terminal OUT (I/O, 2.25V to 3.63V domain). Multiplexed alternate functions: OUT. Supported peripheral buses: General. |
| 6 | VDD | Power_In | Primary positive power supply input (VDD) operating in the 2.25V to 3.63V domain (Max rating: 3.63V). |