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DSC1122CI5-200.0000 (SMD3225-6P) — Symbol, Footprint IPC-7351B & 3D STEP Model

DSC1122CI5-200.0000

MICROCHIPID: C1670900SMD3225-6P · 6 Pins · Pitch 1.05mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · DSC1122CI5-200.0000 (SMD3225-6P)1EN2NC3GND6VDD5OUT4OUTGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.810.25.10-5.1-10.2mm
2. 2D FOOTPRINT
463152E=3.20mm · Pitch e=1.05mmD=2.50mm-3-2-101233210-1-2-3mm
3. 3D CAD MODEL
Package Body: 3.20mm × 2.50mm · Pitch: 1.05mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (6/6)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1ENISystem Enable & Hardware Reset (EN)
2NCI/OMultiplexed I/O & Peripheral Pin NC (General)
3GNDGNDGround Reference Pin (GND)
4OUTI/OMultiplexed I/O & Peripheral Pin OUT (General)
5OUTI/OMultiplexed I/O & Peripheral Pin OUT (General)
6VDDPowerPower Supply Input (VDD — 2.25V to 3.63V)
PIN 1 EN
I
System Enable & Hardware Reset (EN)
Design note: EnableorStandby .
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 11 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: DSC1122CI5-200.0000 (MICROCHIP · SMD3225-6P)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
DSC1122CI5-200.0000 (SMD3225-6P) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
DSC1122CI5-200.0000 (SMD3225-6P) - 2. Standard Pinout (Top View)
True package pinout (6 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
DSC1122CI5-200.0000 (SMD3225-6P) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
DSC1122CI5-200.0000 (SMD3225-6P) - 4. Package Dimensions (D×E×A)
SMD3225-6P · 3.20×2.50mm · Pitch 1.05mmExpand ›
5. Recommended Land PatternLAND PATTERN
DSC1122CI5-200.0000 (SMD3225-6P) - 5. Recommended Land Pattern
IPC-7351B Footprint (6 Pads)Expand ›
6. Application SchematicSCHEMATIC
DSC1122CI5-200.0000 (SMD3225-6P) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (11 figures · Page 1/1)
Showing 1–11 of 11 uncropped original figures for DSC1122
P1 · p01_fig01376×200px
DSC1122CI5-200.0000 (SMD3225-6P) — Low-Jitter Precision LVPECL Oscillator
Low-Jitter Precision LVPECL Oscillator
P5 · p05_fig011777×658px
DSC1122CI5-200.0000 (SMD3225-6P) — FIGURE 2-1: Pin Configuration, 6-Lead QFN
FIGURE 2-1: Pin Configuration, 6-Lead QFN
P5 · p05_fig01P5
DSC1122CI5-200.0000 (SMD3225-6P) — Datasheet Page 5 (p05_fig01)
Datasheet Page 5 (p05_fig01)
P8 · p08_fig011776×1305px
DSC1122CI5-200.0000 (SMD3225-6P) — FIGURE 3-6: Recommended Board Layout. 3.5 Solder Reflow Profile
FIGURE 3-6: Recommended Board Layout. 3.5 Solder Reflow Profile
P8 · p08_fig021265×724px
DSC1122CI5-200.0000 (SMD3225-6P) — FIGURE 3-6: Recommended Board Layout. 3.5 Solder Reflow Profile
FIGURE 3-6: Recommended Board Layout. 3.5 Solder Reflow Profile
P14 · p14_fig011599×977px
DSC1122CI5-200.0000 (SMD3225-6P) — 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
P15 · p15_fig011599×1161px
DSC1122CI5-200.0000 (SMD3225-6P) — 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
P15 · p15_fig01P15
DSC1122CI5-200.0000 (SMD3225-6P) — Datasheet Page 15 (p15_fig01)
Datasheet Page 15 (p15_fig01)
P18 · p18_fig011599×1048px
DSC1122CI5-200.0000 (SMD3225-6P) — Units Dimension Limits
Units Dimension Limits
P18 · p18_fig01P18
DSC1122CI5-200.0000 (SMD3225-6P) — Datasheet Page 18 (p18_fig01)
Datasheet Page 18 (p18_fig01)
P19 · p19_fig011216×813px
DSC1122CI5-200.0000 (SMD3225-6P) — RECOMMENDED LAND PATTERN
RECOMMENDED LAND PATTERN

Technical Specifications & Part Details (DSC1122CI5-200.0000)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:DSC1122CI5-200.0000 (SMD3225-6P) is a 6-pin standard electronic & interconnect component featuring a 3.20 × 2.50 × 1.00 mm mechanical envelope (lead pitch e = 1.05 mm). Rated for 2.25V to 3.63V supply operation across 40°C to +105°C with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
2.25V to 3.63V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
40°C to +105°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
2.3   MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
3.20 × 2.50 × 1.00 mm (A1=0.02 mm)
Package family: OTHER (SMD3225-6P)
Pin Count & Lead PitchN / e
6 Pins | Pitch e = 1.05 mm (41.3 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol6 auto-grouped pins
OK
IPC-7351B Land Pattern6 pads · Pitch 1.05mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SMD3225-6P)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
3.20 × 2.50 mm
Height (A) & Pitch (e)IPC-7351B
A=1.00mm · e=1.05mm
Pad Size (W × L)Level B
1.00 × 1.05 mm
Pins / Total PadsTopology
6P / 6Pad (CUSTOM_ARRAY)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SMD3225-6P
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — DSC1122CI5-200.0000 (SMD3225-6P)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of DSC1122CI5-200.0000 (SMD3225-6P)?

Manufactured by MICROCHIP, the DSC1122CI5-200.0000 is housed in a SMD3225-6P package with 6 pins and a 1.05 mm lead pitch, supporting a VCC supply range of 2.25V to 3.63V. Key pins include: 1 (EN: System Enable & Hardware Reset (EN)), 2 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 3 (GND: Ground Reference Pin (GND)), 4 (OUT: Multiplexed I/O & Peripheral Pin OUT (General)), 5 (OUT: Multiplexed I/O & Peripheral Pin OUT (General)), 6 (VDD: Power Supply Input (VDD — 2.25V to 3.63V)).

What are the IPC-7351B PCB Footprint dimensions for DSC1122CI5-200.0000?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), DSC1122CI5-200.0000 (SMD3225-6P) has a nominal body envelope of 2.50 × 3.20 mm, pitch e = 1.05 mm, and 6 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for DSC1122CI5-200.0000?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for DSC1122CI5-200.0000 (MICROCHIP, SMD3225-6P) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (6 pins) & DSC1122 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1ENDigital_IOChip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
2NCNCSignal terminal NC (I/O, 2.25V to 3.63V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
3GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
4OUTDigital_IOSignal terminal OUT (I/O, 2.25V to 3.63V domain). Multiplexed alternate functions: OUT. Supported peripheral buses: General.
5OUTDigital_IOSignal terminal OUT (I/O, 2.25V to 3.63V domain). Multiplexed alternate functions: OUT. Supported peripheral buses: General.
6VDDPower_InPrimary positive power supply input (VDD) operating in the 2.25V to 3.63V domain (Max rating: 3.63V).
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