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MCP1825S-1202E/DB (SOT-223-3) — Symbol, Footprint IPC-7351B & 3D STEP Model

MCP1825S-1202E/DB

MICROCHIPID: C153262SOT-223-3 · 4 Pins · Pitch 2.30mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · MCP1825S-1202E/DB (SOT-223-3)1V IN2GND4TAB3V OUTGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.810.25.10-5.1-10.2mm
2. 2D FOOTPRINT
1234E=6.50mm · Pitch e=2.30mmD=3.50mm-5-4-3-2-10123456543210-1-2-3-4-5-6mm
3. 3D CAD MODEL
Package Body: 6.50mm × 3.50mm · Pitch: 2.30mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (4/4)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1V INI/OMultiplexed I/O & Peripheral Pin V IN (General)
2GNDGNDGround Reference Pin (GND)
3V OUTI/OMultiplexed I/O & Peripheral Pin V OUT (General)
4TABI/OMultiplexed I/O & Peripheral Pin TAB (General)
PIN 1 V IN
I/O
Multiplexed I/O & Peripheral Pin V IN (General)
Design note: InputVoltageSupply
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 16 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: MCP1825S-1202E/DB (MICROCHIP · SOT-223-3)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
MCP1825S-1202E/DB (SOT-223-3) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
MCP1825S-1202E/DB (SOT-223-3) - 2. Standard Pinout (Top View)
True package pinout (4 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
MCP1825S-1202E/DB (SOT-223-3) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
MCP1825S-1202E/DB (SOT-223-3) - 4. Package Dimensions (D×E×A)
SOT-223-3 · 6.50×3.50mm · Pitch 2.30mmExpand ›
5. Recommended Land PatternLAND PATTERN
MCP1825S-1202E/DB (SOT-223-3) - 5. Recommended Land Pattern
IPC-7351B Footprint (4 Pads)Expand ›
6. Application SchematicSCHEMATIC
MCP1825S-1202E/DB (SOT-223-3) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (16 figures · Page 1/2)
Showing 1–12 of 16 uncropped original figures for MCP1825
P2 · p02_fig01EXACT PACKAGE
MCP1825S-1202E/DB (SOT-223-3) — MCP1825/MCP1825S
MCP1825/MCP1825S
P2 · p02_fig02EXACT PACKAGE
MCP1825S-1202E/DB (SOT-223-3) — SOT-223-3
SOT-223-3
P2 · p02_fig03EXACT PACKAGE
MCP1825S-1202E/DB (SOT-223-3) — Pin Fixed Adjustable
Pin Fixed Adjustable
P2 · p02_fig04EXACT PACKAGE
MCP1825S-1202E/DB (SOT-223-3) — 1 2 3
1 2 3
P26 · p26_fig01EXACT PACKAGE
MCP1825S-1202E/DB (SOT-223-3) — MCP1825/MCP1825S | DS22056B-page 26 © 2008 Microchip Technology Inc. | 3-Lead Plastic Small Outline Transistor (DB) [SOT-223] | Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://
MCP1825/MCP1825S | DS22056B-page 26 © 2008 Microchip Technology Inc. | 3-Lead Plastic Small Outline Transistor (DB) [SOT-223] | Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://
P27 · p27_fig01EXACT PACKAGE
MCP1825S-1202E/DB (SOT-223-3) — 3-Lead Plastic Small Outline Transistor (DB) [SOT-223] - Note: For the most current package drawings, please see the Microchip Packaging Specification located at - http:/www.microchip.com/packaging | © 2008 Microchip Technology Inc. DS22056
3-Lead Plastic Small Outline Transistor (DB) [SOT-223] - Note: For the most current package drawings, please see the Microchip Packaging Specification located at - http:/www.microchip.com/packaging | © 2008 Microchip Technology Inc. DS22056
P2 · p02_fig05732×581px
MCP1825S-1202E/DB (SOT-223-3) — 1 2 3 4 5 | Pin Fixed Adjustable | 1 SHDN SHDN | 2 VIN VIN 3 GND (TAB) GND (TAB) | 4 VOUT VOUT 5 PWRGD ADJ | 6 GND (TAB) GND (TAB)
1 2 3 4 5 | Pin Fixed Adjustable | 1 SHDN SHDN | 2 VIN VIN 3 GND (TAB) GND (TAB) | 4 VOUT VOUT 5 PWRGD ADJ | 6 GND (TAB) GND (TAB)
P2 · p02_fig06479×458px
MCP1825S-1202E/DB (SOT-223-3) — 1 2 3 | Pin | 1 VIN 2 GND (TAB) | 3 VOUT 4 GND (TAB)
1 2 3 | Pin | 1 VIN 2 GND (TAB) | 3 VOUT 4 GND (TAB)
P3 · p03_fig011777×1706px
MCP1825S-1202E/DB (SOT-223-3) — MCP1825/MCP1825S
MCP1825/MCP1825S
P3 · p03_fig01P3
MCP1825S-1202E/DB (SOT-223-3) — Datasheet Page 3 (p03_fig01)
Datasheet Page 3 (p03_fig01)
P17 · p17_fig011450×912px
MCP1825S-1202E/DB (SOT-223-3) — FIGURE 4-1: Typical adjustable output voltage application circuit.
FIGURE 4-1: Typical adjustable output voltage application circuit.
P20 · p20_fig011777×967px
MCP1825S-1202E/DB (SOT-223-3) — 5.1 Typical Application
5.1 Typical Application
Page 1 / 2 (16 extracted figures)

Technical Specifications & Part Details (MCP1825S-1202E/DB)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Low-Dropout Linear Voltage Regulator (LDO)
Detailed Overview:MCP1825S-1202E/DB (SOT-223-3) is a 4-pin low-dropout linear voltage regulator (ldo) featuring a 6.50 × 3.50 × 1.60 mm mechanical envelope (lead pitch e = 2.30 mm). Rated for 2.1V to 6.0V supply operation across -65°C to +150°C with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
2.1V to 6.0V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-65°C to +150°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
1 kHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
120 µA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
6.50 × 3.50 × 1.60 mm (A1=0.06 mm)
Package family: SOT223 (SOT-223-3)
Pin Count & Lead PitchN / e
4 Pins | Pitch e = 2.30 mm (90.6 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol4 auto-grouped pins
OK
IPC-7351B Land Pattern4 pads · Pitch 2.30mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOT-223-3)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
6.50 × 3.50 mm
Height (A) & Pitch (e)IPC-7351B
A=1.60mm · e=2.30mm
Pad Size (W × L)Level B
0.95 × 2.00 mm
Pins / Total PadsTopology
4P / 4Pad (SOT_TAB)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SOT-223-3
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MCP1825S-1202E/DB (SOT-223-3)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MCP1825S-1202E/DB (SOT-223-3)?

Manufactured by MICROCHIP, the MCP1825S-1202E/DB is housed in a SOT-223-3 package with 4 pins and a 2.30 mm lead pitch, supporting a VCC supply range of 2.1V to 6.0V. Key pins include: 1 (V IN: Multiplexed I/O & Peripheral Pin V IN (General)), 2 (GND: Ground Reference Pin (GND)), 3 (V OUT: Multiplexed I/O & Peripheral Pin V OUT (General)), 4 (TAB: Multiplexed I/O & Peripheral Pin TAB (General)).

What are the IPC-7351B PCB Footprint dimensions for MCP1825S-1202E/DB?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP1825S-1202E/DB (SOT-223-3) has a nominal body envelope of 3.50 × 6.50 mm, pitch e = 2.30 mm, and 4 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP1825S-1202E/DB?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP1825S-1202E/DB (MICROCHIP, SOT-223-3) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (4 pins) & MCP1825 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1V INDigital_IOSignal terminal V IN (I/O, 2.1V to 6.0V domain). Multiplexed alternate functions: V IN. Supported peripheral buses: General.
2GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
3V OUTDigital_IOSignal terminal V OUT (I/O, 2.1V to 6.0V domain). Multiplexed alternate functions: V OUT. Supported peripheral buses: General.
4TABDigital_IOSignal terminal TAB (I/O, 2.1V to 6.0V domain). Multiplexed alternate functions: TAB. Supported peripheral buses: General.
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