93AA56C-I/SN (SOIC-8) — Symbol, Footprint IPC-7351B & 3D STEP Model

93AA56C-I/SN

MICROCHIPID: C153256SOIC-8 · 8 Pins · Pitch 1.27mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · 93AA56C-I/SN (SOIC-8)1CS2CLK3DI4DO8VCC7NC6ORG/NC5VSSGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.810.25.10-5.1-10.2mm
2. 2D FOOTPRINT
12345678E=3.90mm · Pitch e=1.27mmD=4.90mm-5-4-3-2-101234543210-1-2-3-4mm
3. 3D CAD MODEL
Package Body: 3.90mm × 4.90mm · Pitch: 1.27mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (8/8)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1CSI/OMultiplexed I/O & Peripheral Pin CS (General)
2CLKI/OMultiplexed I/O & Peripheral Pin CLK (General)
3DII/OMultiplexed I/O & Peripheral Pin DI (General)
4DOI/OMultiplexed I/O & Peripheral Pin DO (General)
5VSSGNDGround Reference Pin (VSS)
6ORG/NCI/OMultiplexed I/O & Peripheral Pin ORG/NC (General)
7NCI/OMultiplexed I/O & Peripheral Pin NC (General)
8VCCPowerPower Supply Input (VCC — 3.3V / 5.0V Standard Logic)
PIN 1 CS
I/O
Multiplexed I/O & Peripheral Pin CS (General)
Design note: ChipSelect
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 7 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: 93AA56C-I/SN (MICROCHIP · SOIC-8)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
93AA56C-I/SN (SOIC-8) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
93AA56C-I/SN (SOIC-8) - 2. Standard Pinout (Top View)
True package pinout (8 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
93AA56C-I/SN (SOIC-8) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
93AA56C-I/SN (SOIC-8) - 4. Package Dimensions (D×E×A)
SOIC-8 · 3.90×4.90mm · Pitch 1.27mmExpand ›
5. Recommended Land PatternLAND PATTERN
93AA56C-I/SN (SOIC-8) - 5. Recommended Land Pattern
IPC-7351B Footprint (8 Pads)Expand ›
6. Application SchematicSCHEMATIC
93AA56C-I/SN (SOIC-8) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (7 figures · Page 1/1)
Showing 1–7 of 7 uncropped original figures for 93AA56C
P2 · p02_fig01P2
93AA56C-I/SN (SOIC-8) — Datasheet Page 2 (p02_fig01)
Datasheet Page 2 (p02_fig01)
P13 · p13_fig01P13
93AA56C-I/SN (SOIC-8) — Datasheet Page 13 (p13_fig01)
Datasheet Page 13 (p13_fig01)
P22 · p22_fig011777×2500px
93AA56C-I/SN (SOIC-8) — 93AA56A/BIC, 93LC56A/B/C, 93C56A/B/C - 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] - http:/www.microchip.com/packaging | DS21794G-page 22  2003-2011 Microchip Technology Inc. | D3dêÜè nóܧ•îé qûÜóó m¶•óîüê .qf/ % fÜ££†Æ
93AA56A/BIC, 93LC56A/B/C, 93C56A/B/C - 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] - http:/www.microchip.com/packaging | DS21794G-page 22  2003-2011 Microchip Technology Inc. | D3dêÜè nóܧ•îé qûÜóó m¶•óîüê .qf/ % fÜ££†Æ
P33 · p33_fig011776×1481px
93AA56C-I/SN (SOIC-8) — 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
P33 · p33_fig01P33
93AA56C-I/SN (SOIC-8) — Datasheet Page 33 (p33_fig01)
Datasheet Page 33 (p33_fig01)
P2 · p02_fig01All Packages in PDF
93AA56C-I/SN (SOIC-8) — 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
P13 · p13_fig01All Packages in PDF
93AA56C-I/SN (SOIC-8) — 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

Technical Specifications & Part Details (93AA56C-I/SN)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:93AA56C-I/SN (SOIC-8) is a 8-pin standard electronic & interconnect component featuring a 4.90 × 3.90 × 1.75 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C to +85°C with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to +85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
1 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
4.90 × 3.90 × 1.75 mm (A1=0.15 mm)
Package family: SOIC (SOIC-8)
Pin Count & Lead PitchN / e
8 Pins | Pitch e = 1.27 mm (50.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol8 auto-grouped pins
OK
IPC-7351B Land Pattern8 pads · Pitch 1.27mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOIC-8)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
4.90 × 3.90 mm
Height (A) & Pitch (e)IPC-7351B
A=1.75mm · e=1.27mm
Pad Size (W × L)Level B
0.60 × 1.55 mm
Pins / Total PadsTopology
8P / 8Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SOIC-8
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — 93AA56C-I/SN (SOIC-8)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of 93AA56C-I/SN (SOIC-8)?

Manufactured by MICROCHIP, the 93AA56C-I/SN is housed in a SOIC-8 package with 8 pins and a 1.27 mm lead pitch. Key pins include: 1 (CS: Multiplexed I/O & Peripheral Pin CS (General)), 2 (CLK: Multiplexed I/O & Peripheral Pin CLK (General)), 3 (DI: Multiplexed I/O & Peripheral Pin DI (General)), 4 (DO: Multiplexed I/O & Peripheral Pin DO (General)), 5 (VSS: Ground Reference Pin (VSS)), 6 (ORG/NC: Multiplexed I/O & Peripheral Pin ORG/NC (General)).

What are the IPC-7351B PCB Footprint dimensions for 93AA56C-I/SN?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), 93AA56C-I/SN (SOIC-8) has a nominal body envelope of 3.90 × 4.90 mm, pitch e = 1.27 mm, and 8 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for 93AA56C-I/SN?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for 93AA56C-I/SN (MICROCHIP, SOIC-8) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (8 pins) & 93AA56C Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1CSDigital_IOSignal terminal CS (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: CS. Supported peripheral buses: General.
2CLKDigital_IOSignal terminal CLK (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: CLK. Supported peripheral buses: General.
3DIDigital_IOSignal terminal DI (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DI. Supported peripheral buses: General.
4DODigital_IOSignal terminal DO (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DO. Supported peripheral buses: General.
5VSSGND0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
6ORG/NCDigital_IOSignal terminal ORG/NC (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: ORG/NC. Supported peripheral buses: General.
7NCNCSignal terminal NC (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
8VCCPower_InPrimary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).