TC642BEUA (MSOP-8) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of TC642BEUA (MSOP-8)?

Manufactured by MICROCHIP, the TC642BEUA is housed in a MSOP-8 package with 8 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 3.0V to 5.5V. Key pins include: 1 (V IN: Multiplexed I/O & Peripheral Pin V IN (General)), 2 (C F: Multiplexed I/O & Peripheral Pin C F (General)), 3 (V MIN: Multiplexed I/O & Peripheral Pin V MIN (General)), 4 (GND: Ground Reference Pin (GND)), 5 (SENSE: Multiplexed I/O & Peripheral Pin SENSE (General)), 6 (FAULT: Multiplexed I/O & Peripheral Pin FAULT (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for TC642BEUA?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), TC642BEUA (MSOP-8) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.65 mm, and 8 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for TC642BEUA?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for TC642BEUA (MICROCHIP, MSOP-8) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 3.00mm × 3.00mm · Pitch: 0.65mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (8/8)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	V IN	I/O	Multiplexed I/O & Peripheral Pin V IN (General)
2	C F	I/O	Multiplexed I/O & Peripheral Pin C F (General)
3	V MIN	I/O	Multiplexed I/O & Peripheral Pin V MIN (General)
4	GND	GND	Ground Reference Pin (GND)
5	SENSE	I/O	Multiplexed I/O & Peripheral Pin SENSE (General)
6	FAULT	I/O	Multiplexed I/O & Peripheral Pin FAULT (General)
7	V OUT	I/O	Multiplexed I/O & Peripheral Pin V OUT (General)
8	VDD	Power	Power Supply Input (VDD — 3.0V to 5.5V)

PIN 1 V IN

I/O

Multiplexed I/O & Peripheral Pin V IN (General)

Design note: AnalogInput

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 15 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

TC642BEUA (MSOP-8) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

TC642BEUA (MSOP-8) - 2. Standard Pinout (Top View)

True package pinout (8 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

TC642BEUA (MSOP-8) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

TC642BEUA (MSOP-8) - 4. Package Dimensions (D×E×A)

MSOP-8 · 3.00×3.00mm · Pitch 0.65mmExpand ›

5. Recommended Land PatternLAND PATTERN

TC642BEUA (MSOP-8) - 5. Recommended Land Pattern

IPC-7351B Footprint (8 Pads)Expand ›

6. Application SchematicSCHEMATIC

TC642BEUA (MSOP-8) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (15 figures · Page 1/2)

Showing 1–12 of 15 uncropped original figures for TC642

P2 · p02_fig011416×1108px

Functional Block Diagram

P12 · p12_fig01989×608px

FIGURE 4-3: CF Pin Voltage.

P12 · p12_fig02868×298px

EQUATION PWM DUTY CYCLE | Duty Cycle (%) = | VCMAX - VCMIN | (VIN - VCMIN) * 100

P23 · p23_fig01867×651px

FIGURE 5-10: Thermistor Resistance, VIN, and RTEMP vs. Temperature. Step 5: Setting the Minimum Speed Voltage (VMIN).

P23 · p23_fig021778×424px

- R3 = 32.4 kΩ - R4 = 17.6 kΩ

P24 · p24_fig011779×884px

FIGURE 5-12: SENSE pin voltage with 3.0Ω sense resistor.

P24 · p24_fig02693×451px

FIGURE 5-12: SENSE pin voltage with 3.0Ω sense resistor.

P24 · p24_fig03693×475px

FIGURE 5-11: SENSE pin voltage with 4.7Ω sense resistor.

P25 · p25_fig011779×1318px

FIGURE 5-13: Design Example Schematic.

P25 · p25_fig01P25

Datasheet Page 25 (p25_fig01)

P28 · p28_fig011441×1791px

TC642BEUA (MSOP-8) — Foot Angle f 0 4 8 0 4 8 | 15 12 0 15 12 0 β Mold Draft Angle Bottom | 15 12 0 15 12 0 α Mold Draft Angle Top | 0.51 0.42 0.33 .020 .017 .013 B Lead Width | 0.25 0.23 0.20 .010 .009 .008 c Lead Thickness | 0.76 0.62 0.48 .030 .025 .019 L Fo

P28 · p28_fig01P28

Datasheet Page 28 (p28_fig01)

Page 1 / 2 (15 extracted figures)

Technical Specifications & Part Details (TC642BEUA)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:TC642BEUA (MSOP-8) is a 8-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 1.10 mm mechanical envelope (lead pitch e = 0.65 mm). Rated for 3.0V to 5.5V supply operation across 40°C to +125°C with integrated PWM interfaces.

Operating Supply VoltageV_CC / V_DD

3.0V to 5.5V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

40°C to +125°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

DC / Broadband Passive

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

3.00 × 3.00 × 1.10 mm (A1=0.08 mm)

Package family: TSSOP (MSOP-8)

Pin Count & Lead PitchN / e

8 Pins | Pitch e = 0.65 mm (25.6 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

PWM

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol8 auto-grouped pins

IPC-7351B Land Pattern8 pads · Pitch 0.65mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (MSOP-8)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

3.00 × 3.00 mm

Height (A) & Pitch (e)IPC-7351B

A=1.10mm · e=0.65mm

Pad Size (W × L)Level B

0.40 × 1.25 mm

Pins / Total PadsTopology

8P / 8Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit MSOP-8	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — TC642BEUA (MSOP-8)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of TC642BEUA (MSOP-8)?

Manufactured by MICROCHIP, the TC642BEUA is housed in a MSOP-8 package with 8 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 3.0V to 5.5V. Key pins include: 1 (V IN: Multiplexed I/O & Peripheral Pin V IN (General)), 2 (C F: Multiplexed I/O & Peripheral Pin C F (General)), 3 (V MIN: Multiplexed I/O & Peripheral Pin V MIN (General)), 4 (GND: Ground Reference Pin (GND)), 5 (SENSE: Multiplexed I/O & Peripheral Pin SENSE (General)), 6 (FAULT: Multiplexed I/O & Peripheral Pin FAULT (General)).

What are the IPC-7351B PCB Footprint dimensions for TC642BEUA?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), TC642BEUA (MSOP-8) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.65 mm, and 8 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for TC642BEUA?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for TC642BEUA (MICROCHIP, MSOP-8) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (8 pins) & TC642 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	V IN	Digital_IO	Signal terminal V IN (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: V IN. Supported peripheral buses: General.
2	C F	Digital_IO	Signal terminal C F (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: C F. Supported peripheral buses: General.
3	V MIN	Digital_IO	Signal terminal V MIN (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: V MIN. Supported peripheral buses: General.
4	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
5	SENSE	Digital_IO	Signal terminal SENSE (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: SENSE. Supported peripheral buses: General.
6	FAULT	Open_Drain	Signal terminal FAULT (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: FAULT. Supported peripheral buses: General.
7	V OUT	Digital_IO	Signal terminal V OUT (I/O, 3.0V to 5.5V domain). Multiplexed alternate functions: V OUT. Supported peripheral buses: General.
8	VDD	Power_In	Primary positive power supply input (VDD) operating in the 3.0V to 5.5V domain (Max rating: 5.5V).

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