![93LC66CX-I/SN (SOIC-8) — MILLIMETERS MIN NOM [MSOP-8]](/api/v1/assets/C1350336/extracted/package_dimensions.png)
MSOP-8 · 8P
Synchronized Pinout (Symbol / 2D / 3D) (8/8)
Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D| Pin | Symbol | Type | Function (EN) |
|---|---|---|---|
| 1 | CS | I/O | Multiplexed I/O & Peripheral Pin CS (General) |
| 2 | CLK | I/O | Multiplexed I/O & Peripheral Pin CLK (General) |
| 3 | DI | I/O | Multiplexed I/O & Peripheral Pin DI (General) |
| 4 | DO | I/O | Multiplexed I/O & Peripheral Pin DO (General) |
| 5 | VSS | GND | Ground Reference Pin (VSS) |
| 6 | ORG/NC | I/O | Multiplexed I/O & Peripheral Pin ORG/NC (General) |
| 7 | NC | I/O | Multiplexed I/O & Peripheral Pin NC (General) |
| 8 | VCC | Power | Power Supply Input (VCC — 1.8V-5.5V) |
PIN 1 CS
I/OMultiplexed I/O & Peripheral Pin CS (General)
Design note: ChipSelect
IPC-7351B Solder Density & Span C/G/Z Tuner
Extracted Drawings Gallery (6 Standard Drawings + 12 Extracted Figures)
Read the original datasheet PDF directly or click any drawing to view fullscreen1. Realistic 3D PackageREPRESENTATIVE
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
True package pinout (8 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
SOIC-8 · 3.90×4.90mm · Pitch 1.27mmExpand ›
5. Recommended Land PatternLAND PATTERN
IPC-7351B Footprint (8 Pads)Expand ›
6. Application SchematicSCHEMATIC
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (12 figures · Page 1/1)
Showing 1–12 of 12 uncropped original figures for 93LC66CX / 93C66BT / 93C66B
P1 · p01_fig01376×200px
P16 · p16_fig01P16
P23 · p23_fig011061×1130px
P23 · p23_fig01P23
P27 · p27_fig011296×1597px
P28 · p28_fig01981×927px
P34 · p34_fig01876×1020px
P40 · p40_fig011776×1768px
P40 · p40_fig01P40
P41 · p41_fig011776×1521px
P16 · p16_fig01All Packages in PDF
P22 · p22_fig011579×736px
Technical Specifications & Part Details (93LC66CX-I/SN)
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)Detailed Overview:93LC66CX-I/SN (SOIC-8) is a 8-pin standard electronic & interconnect component featuring a 4.90 × 3.90 × 1.75 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 1.8V-5.5V supply operation across -40°C to +85°C with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V-5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to +85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
1 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
4.90 × 3.90 × 1.75 mm (A1=0.15 mm)
Package family: SOIC (SOIC-8)
Pin Count & Lead PitchN / e
8 Pins | Pitch e = 1.27 mm (50.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.
5-Point Standards Verification
Automated compliance checks prior to exportIEEE-315 Symbol8 auto-grouped pins
IPC-7351B Land Pattern8 pads · Pitch 1.27mm
IPC-7525 60% Solder PasteReflow 1:1 Standard
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
Hardware Verification & Community Engineering Reviews
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet5.00 PCB Verified
IPC-7351B
Select package variant or sibling MPN sharing this datasheetFamily Variants & Same Datasheet Chips — 93LC66CX / 93C66BT / 93C66B (8)
SOIC-8 · 8P
SOIC-8 · 8P
SOIC-8 · 8P
SOIC-8 · 8P
SOIC-8 · 8P
TSSOP-8 · 8P
TSSOP-8 · 8P
IPC-7351B
8P3.0×4.4×1.20mmP=0.65mm
93LC66CX / 93C66BT / 93C66B (TSSOP-8)
Mechanical Dimensions & Land Pattern (SOIC-8)
Extracted from Datasheet & IPC-7351B NormalizedPackage Body (D × E)Nominal
4.90 × 3.90 mm
Height (A) & Pitch (e)IPC-7351B
A=1.75mm · e=1.27mm
Pad Size (W × L)Level B
0.60 × 1.55 mm
Pins / Total PadsTopology
8P / 8Pad (DUAL_ROW)
Recommended Companion BOM & Drop-In Equivalents
Passive external components per reference schematic and 1:1 pin-compatible alternatives| Designator / Replacement MPN | Value / Package | Function & PCB Layout Rule |
|---|---|---|
| N/A BOM | Per application circuit SOIC-8 | Size power & signal trace widths for rated load current following IPC-2221 clearance rules. |
Technical Frequently Asked Questions (FAQ) — 93LC66CX-I/SN (SOIC-8)
Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formatsWhat is the Pinout and operating voltage specification of 93LC66CX-I/SN (SOIC-8)?
Manufactured by MICROCHIP, the 93LC66CX-I/SN is housed in a SOIC-8 package with 8 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 1.8V-5.5V. Key pins include: 1 (CS: Multiplexed I/O & Peripheral Pin CS (General)), 2 (CLK: Multiplexed I/O & Peripheral Pin CLK (General)), 3 (DI: Multiplexed I/O & Peripheral Pin DI (General)), 4 (DO: Multiplexed I/O & Peripheral Pin DO (General)), 5 (VSS: Ground Reference Pin (VSS)), 6 (ORG/NC: Multiplexed I/O & Peripheral Pin ORG/NC (General)).
What are the IPC-7351B PCB Footprint dimensions for 93LC66CX-I/SN?
Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), 93LC66CX-I/SN (SOIC-8) has a nominal body envelope of 3.90 × 4.90 mm, pitch e = 1.27 mm, and 8 copper pads.
Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for 93LC66CX-I/SN?
You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for 93LC66CX-I/SN (MICROCHIP, SOIC-8) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.
Static Reference Appendix: Pinout Table (8 pins) & 93LC66CX / 93C66BT / 93C66B Family VariantsExpand static table
| Pin # | Signal Name | Electrical Type | Functional Description & Design Notes |
|---|---|---|---|
| 1 | CS | Digital_IO | Signal terminal CS (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: CS. Supported peripheral buses: General. |
| 2 | CLK | Digital_IO | Signal terminal CLK (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: CLK. Supported peripheral buses: General. |
| 3 | DI | Digital_IO | Signal terminal DI (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: DI. Supported peripheral buses: General. |
| 4 | DO | Digital_IO | Signal terminal DO (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: DO. Supported peripheral buses: General. |
| 5 | VSS | GND | 0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks. |
| 6 | ORG/NC | Digital_IO | Signal terminal ORG/NC (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: ORG/NC. Supported peripheral buses: General. |
| 7 | NC | NC | Signal terminal NC (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General. |
| 8 | VCC | Power_In | Primary positive power supply input (VCC) operating in the 1.8V-5.5V domain (Max rating: 5.5V). |