SOP-8 · 8P
8P4.9×3.9×1.75mmP=1.27mm
Standard Electronic & Interconnect Component
Electronic Component Library & IPC-7351B CAD Models — Page 257
Look up datasheet specifications, verify synchronized IEEE-315 Symbols / IPC-7351B Footprints / STEP AP214 3D models, and download directly for KiCad 8, Fusion 360 (.lbr), and Altium.
Verified ComponentsDRC PASS
3744
2D ECAD LibrariesIEEE-315 / IPC
11232
3D MCAD ModelsAP214 / GLB
7480
Land Pattern NormalizationIPC-7351B
100%
Split by MPN (3747 · Page 257/313)
Showing 3073–3084 of 3747 componentsSOT-23-3L · 3P
3P2.9×1.3×1.10mmP=1.9mm
Standard Electronic & Interconnect Component
ASOP-6 · 8P
8P6.2×3.9×1.65mmP=1.3mm10 to 35 V
Standard Electronic & Interconnect Component
SOT-23-3L · 3P
3P2.9×1.3×1.10mmP=1.9mm
Standard Electronic & Interconnect Component
SOT-23-6 · 6P
6P2.9×1.6×1.10mmP=0.95mm15 to 30 V
Standard Electronic & Interconnect Component
HSOP-7-EP-150mil · 8P
8P6.2×3.9×1.60mmP=1.33mm
Standard Electronic & Interconnect Component
SOIC-8 · 8P
8P4.9×3.9×1.75mmP=1.27mm
Standard Electronic & Interconnect Component
SOIC-8 · 8P
8P4.9×3.9×1.75mmP=1.27mm
Standard Electronic & Interconnect Component
SOT-23-6L · 6P
6P2.9×1.6×1.10mmP=0.95mm15 to 30 V
Standard Electronic & Interconnect Component
SOP-8 · 8P
8P4.9×3.9×1.75mmP=1.27mm
Standard Electronic & Interconnect Component
SOP-8 · 8P
8P4.9×3.9×1.75mmP=1.27mm
Standard Electronic & Interconnect Component
SOP-8 · 8P
8P4.9×3.9×1.75mmP=1.27mm
Standard Electronic & Interconnect Component
Components by Package Family (IPC-7351B & IPC-7525)
Each package links to a dedicated directory with IPC pad calculation rules, 60% stencil grids, and copper keepoutsQFN / DFN / LGAQFN
IPC-7351B · 60% Paste WindowHigh-density MCUs & SoCs (RP2040, ESP32-S3, STM32) with 60% segmented paste windows on EPAD to prevent reflow voiding.
LQFP / TQFP (4-Side Gull-Wing)QFP
IPC-7351B Toe/Heel Fillet4-sided gull-wing microcontrollers (STM32F103C8T6 LQFP-48, LQFP-64, LQFP-100) verified for JLCPCB minimum DFM clearance.
Castellated RF ModuleMODULE
IPC-7351B · Antenna KeepoutCastellated Wi-Fi/BLE modules (ESP32-WROOM, MINI-1U, S3) with strictly defined antenna copper keepout zones.
SOIC / SOP / TSSOP / MSOPSOIC
IPC-7351B Level A / B / CUSB-UART, Timer, Op-Amp & SPI Flash ICs (CH340G, NE555, W25Q128, TSSOP-20) supporting live Span C/G/Z toggling.
BGA / WLCSP (2D Ball Grid)BGA
JEDEC MO-275 / MO-211 NSMDUltra-high-density MCUs & SoCs (STM32H7, STM32G0 WLCSP-25, UFBGA-176) with circular NSMD pads and 3D solder ball arrays.
SOT-23 / SOT-223 / TO-252SOT
IPC-7351B Asymmetric TabLDO voltage regulators & power MOSFETs featuring asymmetric heatsink tabs (AMS1117-3.3, SOT-23-5, TO-252).
Through-Hole DIP / HeaderTHT
IPC-2221 / IPC-7251 Plated HoleThrough-hole components, industrial terminal blocks & DIP ICs (NE555P DIP-8) with square Pin 1 polarity pad.