LQFP-64(10x10) · 64P
64P10.0×10.0×1.40mmP=0.5mm
Standard Electronic & Interconnect Component
Electronic Component Library & IPC-7351B CAD Models — Page 241
Look up datasheet specifications, verify synchronized IEEE-315 Symbols / IPC-7351B Footprints / STEP AP214 3D models, and download directly for KiCad 8, Fusion 360 (.lbr), and Altium.
Verified ComponentsDRC PASS
2928
2D ECAD LibrariesIEEE-315 / IPC
8784
3D MCAD ModelsAP214 / GLB
5848
Land Pattern NormalizationIPC-7351B
100%
Split by MPN (2943 · Page 241/246)
Showing 2881–2892 of 2943 componentsLQFP-100(14x14) · 100P
100P14.0×14.0×1.40mmP=0.5mm
Standard Electronic & Interconnect Component
LQFP-48(7x7) · 48P
48P7.0×7.0×1.40mmP=0.5mm
Standard Electronic & Interconnect Component
- · 320P
320P11.0×11.0×1.12mmP=0.5mm
Embedded Microcontroller Unit (MCU)
- · 289P
289P14.0×14.0×1.35mmP=0.8mm
Embedded Microcontroller Unit (MCU)
- · 320P
320P11.0×11.0×1.12mmP=0.5mm
Embedded Microcontroller Unit (MCU)
- · 289P
- · 289P
LFBGA-354 · 354P
354P16.0×16.0×1.35mmP=0.8mm
Standard Electronic & Interconnect Component
VFBGA-178 · 178P
178P12.0×12.0×0.85mmP=0.8mm
Standard Electronic & Interconnect Component
- · 27P
27P2.3×2.6×0.55mmP=0.4mm
Standard Electronic & Interconnect Component
QFN32 · 33P
33P5.0×5.0×0.85mmP=0.5mm
Standard Electronic & Interconnect Component
Components by Package Family (IPC-7351B & IPC-7525)
Each package links to a dedicated directory with IPC pad calculation rules, 60% stencil grids, and copper keepoutsQFN / DFN / LGAQFN
IPC-7351B · 60% Paste WindowHigh-density MCUs & SoCs (RP2040, ESP32-S3, STM32) with 60% segmented paste windows on EPAD to prevent reflow voiding.
LQFP / TQFP (4-Side Gull-Wing)QFP
IPC-7351B Toe/Heel Fillet4-sided gull-wing microcontrollers (STM32F103C8T6 LQFP-48, LQFP-64, LQFP-100) verified for JLCPCB minimum DFM clearance.
Castellated RF ModuleMODULE
IPC-7351B · Antenna KeepoutCastellated Wi-Fi/BLE modules (ESP32-WROOM, MINI-1U, S3) with strictly defined antenna copper keepout zones.
SOIC / SOP / TSSOP / MSOPSOIC
IPC-7351B Level A / B / CUSB-UART, Timer, Op-Amp & SPI Flash ICs (CH340G, NE555, W25Q128, TSSOP-20) supporting live Span C/G/Z toggling.
BGA / WLCSP (2D Ball Grid)BGA
JEDEC MO-275 / MO-211 NSMDUltra-high-density MCUs & SoCs (STM32H7, STM32G0 WLCSP-25, UFBGA-176) with circular NSMD pads and 3D solder ball arrays.
SOT-23 / SOT-223 / TO-252SOT
IPC-7351B Asymmetric TabLDO voltage regulators & power MOSFETs featuring asymmetric heatsink tabs (AMS1117-3.3, SOT-23-5, TO-252).
Through-Hole DIP / HeaderTHT
IPC-2221 / IPC-7251 Plated HoleThrough-hole components, industrial terminal blocks & DIP ICs (NE555P DIP-8) with square Pin 1 polarity pad.